JPH0237083B2 - - Google Patents

Info

Publication number
JPH0237083B2
JPH0237083B2 JP56137210A JP13721081A JPH0237083B2 JP H0237083 B2 JPH0237083 B2 JP H0237083B2 JP 56137210 A JP56137210 A JP 56137210A JP 13721081 A JP13721081 A JP 13721081A JP H0237083 B2 JPH0237083 B2 JP H0237083B2
Authority
JP
Japan
Prior art keywords
circuit
dielectric
copper
conductive paste
solderability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56137210A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5839051A (ja
Inventor
Sandai Iwasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Laboratory Co Ltd
Original Assignee
Asahi Chemical Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Laboratory Co Ltd filed Critical Asahi Chemical Laboratory Co Ltd
Priority to JP56137210A priority Critical patent/JPS5839051A/ja
Publication of JPS5839051A publication Critical patent/JPS5839051A/ja
Publication of JPH0237083B2 publication Critical patent/JPH0237083B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP56137210A 1981-08-31 1981-08-31 絶縁基板に誘電体を形成する方法 Granted JPS5839051A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56137210A JPS5839051A (ja) 1981-08-31 1981-08-31 絶縁基板に誘電体を形成する方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56137210A JPS5839051A (ja) 1981-08-31 1981-08-31 絶縁基板に誘電体を形成する方法

Publications (2)

Publication Number Publication Date
JPS5839051A JPS5839051A (ja) 1983-03-07
JPH0237083B2 true JPH0237083B2 (enExample) 1990-08-22

Family

ID=15193357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56137210A Granted JPS5839051A (ja) 1981-08-31 1981-08-31 絶縁基板に誘電体を形成する方法

Country Status (1)

Country Link
JP (1) JPS5839051A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1299655C (en) * 1987-07-30 1992-04-28 Stephen J. Yuhasz Multiple-input power control system
JP6669359B2 (ja) * 2016-06-16 2020-03-18 住友電工デバイス・イノベーション株式会社 キャパシタの製造方法

Also Published As

Publication number Publication date
JPS5839051A (ja) 1983-03-07

Similar Documents

Publication Publication Date Title
JPS59226178A (ja) 銅金属被覆の形成方法
US4130854A (en) Borate treated nickel pigment for metallizing ceramics
JPH08180731A (ja) 導電性厚膜組成物、厚膜電極、セラミック電子部品、および積層セラミックコンデンサ
JPS60205907A (ja) セラミツクガラス材料およびそれから製造されるコンデンサーおよびその製造法
JPH01273305A (ja) セラミック多層コンデンサおよびその製造方法
JP2000216046A (ja) 積層セラミック電子部品
JPS6166303A (ja) 配線基板の製造方法
US4168519A (en) Capacitor with tin-zinc electrodes
JPS5874030A (ja) 電子部品、導電皮膜組成物及び製造方法
JPH0237083B2 (enExample)
JPH03296205A (ja) セラミックコンデンサ
JPS5844789A (ja) プリント配線板に誘電体を形成する方法
JPH08153414A (ja) 導電ペースト
JPS5853965A (ja) 固体電解コンデンサ用導電塗料
JPH0237117B2 (ja) Kibannidodenkairookeiseisuruhoho
JP2850200B2 (ja) 積層セラミック電子部品
JPS635842B2 (enExample)
JPS62163387A (ja) 基板に蓄電回路を形成する方法
JPH07105721A (ja) 導電性ペーストの製造方法
JP2000182435A (ja) 導電性ペースト及びセラミック電子部品
JPS6322046B2 (enExample)
JP2002313664A (ja) 導電性ペーストおよび積層セラミック電子部品
JPS5858717A (ja) 電子部品
JPS62242325A (ja) チツプコンデンサ−の製造方法
JPH0377647B2 (enExample)