JPH023624Y2 - - Google Patents
Info
- Publication number
- JPH023624Y2 JPH023624Y2 JP2373484U JP2373484U JPH023624Y2 JP H023624 Y2 JPH023624 Y2 JP H023624Y2 JP 2373484 U JP2373484 U JP 2373484U JP 2373484 U JP2373484 U JP 2373484U JP H023624 Y2 JPH023624 Y2 JP H023624Y2
- Authority
- JP
- Japan
- Prior art keywords
- spool
- wire
- bonding wire
- alumite
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000000873 masking effect Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Wire Bonding (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
【考案の詳細な説明】
〈産業上の利用分野〉
本考案は、半導体リード線に用いるボンデイン
グワイヤーを巻き取るスプール、特にワイヤーボ
ンダにより半導体にワイヤーをボンデイングする
際ワイヤーの断線を検知してワイヤーボンダーを
停止させるための回路を形成させるのに便利なボ
ンデイングワイヤー用スプールに関する。[Detailed description of the invention] <Industrial application field> The present invention is a spool for winding bonding wire used for semiconductor lead wires, and in particular, a wire bonder that detects wire breakage when bonding a wire to a semiconductor using a wire bonder. This invention relates to a spool for bonding wire that is convenient for forming a circuit for stopping.
〈従来技術の説明〉
ボンデイングワイヤー用スプールは、スプール
とワイヤーとの間の電気化学的反応にる腐食を抑
えるためと、商品価値を向上させることと、ボン
デイングワイヤーの品位の判別を容易にすること
などのために、その表面に着色アルマイト処理を
施しているのが通常である。<Description of Prior Art> The purpose of the bonding wire spool is to suppress corrosion due to electrochemical reaction between the spool and the wire, to improve the product value, and to make it easy to determine the quality of the bonding wire. For this reason, the surface is usually treated with colored alumite.
一方、ワイヤーボンダーにより半導体にワイヤ
ーをボンデイングする際、ワイヤーが断線すると
これを検知してワイヤーボンダを停止させるため
の回路を形成している。 On the other hand, when a wire is bonded to a semiconductor using a wire bonder, a circuit is formed to detect if the wire breaks and to stop the wire bonder.
この場合、ワイヤーと回路の端子との間で安定
した電気的接続を得るためにスプールの鍔ないし
胴の内面に、
金属箔を貼り付ける。 In this case, metal foil is pasted on the inner surface of the spool's collar or body to obtain a stable electrical connection between the wire and the circuit terminal.
導電塗料を塗布する。 Apply conductive paint.
アルミニウム素地を露出させる。 Expose the aluminum base.
メツキを施す。 Apply plating.
などにより、スプールをワイヤーボンダーのス
プールホルダーにセツトするだけでワイヤーと回
路端子との電気的接続が得られるものが提案され
ている。しかしこれ等の提案を検討してみると、
のものについては、金属箔の貼り付けに人手
を要し工数が大で、貼り付けた金属箔が剥げたり
破れたりして長期間の繰返し使用に耐え得ない。 et al. have proposed a wire bonder that allows electrical connection between the wire and the circuit terminal simply by setting the spool in the spool holder of the wire bonder. However, after considering these proposals, we found that the method requires a lot of manpower and labor to attach the metal foil, and the attached metal foil may peel or tear, making it difficult to use repeatedly over a long period of time. I can't stand it.
のものは、塗膜が剥げ易く耐摩耗性に劣り、
導電性の微粉末が飛散してクリーンルーム内の清
浄度を低下させ半導体の品位を低下させるおそれ
があり、また、導電性塗膜を強固に被着させるた
めに焼付け塗装を行うと着色アルマイトが脱色す
ると共に肌あれが生じて使用に耐えなくなる、
のものは、アルマイト処理時にマスキングを
せねばならず、この作業はアルマイト処理作業を
大幅に遅延させるものであり、また、アルミニウ
ムは酸化しやすい金属であつて、酸化膜は電気絶
縁性であるため電気的接続を悪化させることとな
り、更に酸化生成物は微粉末状であるためこれが
飛散しクリーンルームの清浄度を低下させる、
のものについては、アルマイト処理→マスキ
ング→剥離（苛性ソーダ中に浸漬）→水洗→マス
キング→亜鉛メツキ→ニツケルメツキ→クロムメ
ツキと云うようにその工程が繁雑であり、高度の
技術を必要とし、良好なメツキを施すことは極め
て困難である、
という問題がある。 The paint film peels off easily and has poor abrasion resistance.
There is a risk that conductive fine powder will scatter, reducing the cleanliness in the clean room and lowering the quality of semiconductors.Also, if baking is performed to firmly adhere the conductive coating, the colored alumite may decolorize. However, the surface becomes rough and becomes unusable.Aluminum must be masked during alumite treatment, which greatly delays the alumite treatment.In addition, aluminum is a metal that easily oxidizes. In some cases, the oxide film is electrically insulating, which deteriorates the electrical connection, and the oxidation products are in the form of fine powder, which scatters and reduces the cleanliness of the clean room. → Masking → Peeling (immersion in caustic soda) → Washing → Masking → Zinc plating → Nickel plating → Chrome plating.The process is complicated and requires advanced technology, and it is extremely difficult to perform good plating. , there is a problem.
〈考案の目的〉
本考案は以上の点に鑑み成されたものでアルマ
イト処理時にマスキング、アルマイト層の剥離な
どの余分な作業を必要とせずアルマイト層の上か
ら直接導電性物質を溶射することにより生産性が
良く且つ強固な導電性物質層を有するボンデイン
グワイヤー用スプールを提供することを目的とす
るものである。<Purpose of the invention> The present invention was developed in view of the above points, and it is possible to spray a conductive substance directly onto the alumite layer without requiring extra work such as masking or peeling off the alumite layer during alumite treatment. It is an object of the present invention to provide a spool for bonding wire that is highly productive and has a strong conductive material layer.
〈考案の構成および作用〉
上記目的を達成する本考案スプールは、胴部両
端または片端に鍔を有するアルマイト処理を施し
たボンデイングワイヤー用スプールの少なくとも
一方の前記鍔部または該鍔部と前記胴部内面に連
続または不連続に導電性物質を溶射してなること
を特徴とするものである。<Structure and operation of the invention> The spool of the present invention which achieves the above object has a spool for bonding wire which is anodized and has a flange at both ends or one end of the body, or at least one of the flange portions or the flange portion and the body portion. It is characterized by having a conductive material sprayed continuously or discontinuously on the inner surface.
なおこの考案は金線のみならず半導体リード線
の全ての金属線に適用される。 Note that this idea applies not only to gold wires but also to all metal wires for semiconductor lead wires.
次に本考案の一実施例を図面と共に説明する。 Next, an embodiment of the present invention will be described with reference to the drawings.
１はアルミニウム管を成形加工したスプール素
材で、その両端（片端の場合もある）には鍔２が
一体に設けられており、鍔２の一部にはボンデイ
ングワイヤーを引き通す切欠き部３が設けられて
いる。４は該スプールに施された着色アルマイト
層で、５はスプール１の鍔部内面（スプールに巻
かれる線に対向しない面）および胴部１１内面に
着色アルマイト層をつき破つてアルミニウムに直
接結合した溶射ステンレス層である。 Reference numeral 1 is a spool material formed from an aluminum tube, and a collar 2 is integrally provided at both ends (sometimes at one end), and a part of the collar 2 has a notch 3 through which the bonding wire is passed. It is provided. 4 is a colored alumite layer applied to the spool, and 5 is a colored alumite layer on the inner surface of the flange portion of the spool 1 (the surface not facing the wire wound around the spool) and the inner surface of the body portion 11, and is bonded directly to the aluminum by tearing through the colored alumite layer. It is a thermally sprayed stainless steel layer.
なお、ここぜステンレスを用いたがこれに限ら
ず導電性物質であれば何れの物質でも用いること
ができるが耐食性物質であれば特に良好な電気的
接続が得られることは云うまでもない。 Note that although stainless steel is used here, the material is not limited to this, and any conductive material may be used, but it goes without saying that a particularly good electrical connection can be obtained if the material is corrosion resistant.
また、図面では溶射ステンレス層は鍔部内面か
ら胴部内面に連続して設けられているが、本考案
の場合は、アルマイト層をつき破つてアルミニウ
ムに直接ステンレスが結合しているので、所望の
位置に不連続にまたは間けつ的に溶射ステンレス
層を形成しても実用的に何等問題はない。 In addition, in the drawings, the sprayed stainless steel layer is continuously provided from the inner surface of the flange to the inner surface of the body, but in the case of the present invention, the stainless steel layer is bonded directly to the aluminum by breaking through the alumite layer, so the desired coating can be achieved. There is no practical problem in forming the thermally sprayed stainless steel layer discontinuously or intermittently at the locations.
本考案のスプールの製作は、例えば径50mm×厚
さ0.8mm×長さ85mmのアルミニウムパイプを絞り
加工によつてその両端を折り曲げて鍔を形成して
スプール素材を製作する。このスプール素材に公
知の技術により着色アルマイト処理を施し、次い
で該鍔部の内面にプラズマ溶射ガンによりステン
レスを溶射して本考案のボンデイング用スプール
を得る。なお、スプールに巻かれる線と鍔とが接
触しないときには、鍔部の外面にも溶射されても
かまわない。 To manufacture the spool of the present invention, for example, a spool material is manufactured by drawing an aluminum pipe with a diameter of 50 mm, a thickness of 0.8 mm, and a length of 85 mm, bending both ends of the pipe to form a flange. This spool material is subjected to a colored alumite treatment using a known technique, and then stainless steel is sprayed onto the inner surface of the flange using a plasma spray gun to obtain the bonding spool of the present invention. Note that when the wire wound around the spool and the collar do not come into contact with each other, the outer surface of the collar may also be thermally sprayed.
また、上記溶射の際従来技術のような特別のマ
スキングは必要とせず、被溶射物のホルダーに若
干工夫を加えるだけで所望の部分を溶射すること
ができる。 Further, during the above-mentioned thermal spraying, special masking as in the prior art is not required, and a desired portion can be thermally sprayed by simply making some modifications to the holder of the object to be thermally sprayed.
〈考案の効果〉
以上説明した如く本考案のボンデイングワイヤ
ー用スプールは手間のかかるマスキングや繁雑な
工程を要せず、着色アルマイト処理したスプール
の直上からアルマイト層をつき破つて素地に直接
導電物質を溶射して得られるので生産性がよく、
かつ強固に導電性物質が被着している。<Effects of the invention> As explained above, the bonding wire spool of the present invention does not require time-consuming masking or complicated processes, and allows the conductive material to be applied directly to the substrate by breaking through the alumite layer directly above the colored alumite-treated spool. It is obtained by thermal spraying, so productivity is high.
In addition, the conductive material is firmly adhered.
従つて本考案のスプールの溶射導電性物質層は
容易に脱落することがなく、長期間に亘つて繰返
し使用が可能で、使用中導電性物質の微粉末が飛
散することもないのでクリーンルームの清浄度を
低下させることがないなどの効果を有するもので
ある。 Therefore, the thermally sprayed conductive material layer of the spool of the present invention does not fall off easily and can be used repeatedly over a long period of time, and the fine powder of the conductive material does not scatter during use, making it easy to clean the clean room. This has the effect of not reducing the degree of
第１図は本考案のボンデイングワイヤー用スプ
ールの縦断面図、第２図は同側面図で、第３図は
スプールの胴部から鍔部へ至る部分の拡大図であ
り、図中の符号は次の通りである。
１……スプール素材、２……鍔、３……切欠
部、４……着色アルマイト層、５……溶射ステン
レス層、１１……胴部。
Fig. 1 is a longitudinal cross-sectional view of the bonding wire spool of the present invention, Fig. 2 is a side view of the same, and Fig. 3 is an enlarged view of the portion from the body of the spool to the flange. It is as follows. 1... Spool material, 2... Tsuba, 3... Notch, 4... Colored alumite layer, 5... Thermal sprayed stainless steel layer, 11... Body.
Claims (1)
処理を施したアルミニウム製ボンデイングワイヤ
ー用スプールの少なくとも一方の前記鍔部または
該鍔部と前記胴部内面に連続または不連続に導電
性物質を溶射してなることを特徴とするボンデイ
ングワイヤー用スプール。 A conductive material is sprayed continuously or discontinuously on at least one of the flanges of an aluminum bonding wire spool subjected to alumite treatment, or on the flanges and the inner surface of the body. A spool for bonding wire that is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2373484U JPS60136138U (en) | 1984-02-20 | 1984-02-20 | Spool for bonding wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2373484U JPS60136138U (en) | 1984-02-20 | 1984-02-20 | Spool for bonding wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60136138U JPS60136138U (en) | 1985-09-10 |
| JPH023624Y2 true JPH023624Y2 (en) | 1990-01-29 |
Family
ID=30517234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2373484U Granted JPS60136138U (en) | 1984-02-20 | 1984-02-20 | Spool for bonding wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60136138U (en) |
-
1984
- 1984-02-20 JP JP2373484U patent/JPS60136138U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60136138U (en) | 1985-09-10 |
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