JPH0520511B2 - - Google Patents

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention is applied to mechanical plates used in fields that require corrosion resistance, heat resistance, abrasion resistance, solderability, electrical conductivity, plating performance, and decorative properties. Regarding the teing method.

(Prior art) Surface treatment techniques that have been commonly used to plate metal on materials, parts, etc. include electroplating, chemical plating, hot-dip plating, and thermal spray plating. A thin film of metal or alloy is plated on the surface of the material and is used for various purposes.

The electroplating method is a method of forming a thin metal film on the surface of a material by using a material to be plated as a cathode in a solution containing a metal and passing a direct current between the anode and the opposing anode. The chemical plating method is a method of plating on nonconducting materials such as glass and synthetic resins without using electricity. The molten plating method is a method of plating by immersing the material in molten metal. The thermal spray plating method is a method of plating the surface of a material by spraying metal melted by gas or arc onto the surface of the material using high-pressure gas or air. Each of these various plating methods has its own drawbacks or problems.

(Problems to be solved by the invention) Namely, with electroplating, alloy plating is difficult, with chemical plating, the plating layer cannot be thick and the cost of chemicals is high, and with hot-melt plating, it is difficult to form a pipe by just dipping it. Although it has the advantage of being able to thicken the plating layer on the inner surface, etc., it is difficult to adjust the thickness, thermal spray plating tends to become porous, and the metal particles are oxidized. The most common problems are that the adhesion between the plating layer and the material is not necessarily sufficient, that the equipment is expensive, and that waste liquid treatment is necessary.

The present inventors have previously proposed a mechanical plating method (Japanese Patent Application No. 1983-1983) as a means of solving these problems.
299714) and eliminated and improved the problems and drawbacks of conventional methods of plating metal surfaces.

In other words, the mechanical plating method involves bringing a metal brush into contact with the metal block and stripping off the metal from the metal block with the metal brush, and then bringing the material to be plated into contact with the metal brush and stripping it off with the metal brush. In this method, the removed metal is mechanically plated onto the surface of the material to be plated using a metal brush.

However, another problem with this method is that during plating, the metal from the metal block that has been stripped off by the brush does not adhere to the material to be plated and is re-attached to the surface of the metal block. A hard-working layer (also called a re-deposition layer) is formed by adhering to the surface of the metal block. This hard-working layer is very hard and difficult to scrape off, so the amount of metal that can be peeled off with a metal brush is small. When plating is performed over time, the plating film thickness decreases over time.

The present invention eliminates and improves the problems or drawbacks of the above mechanical plating method,
The object of the present invention is to provide a mechanical plating method that prevents nonuniform plating thickness.

(Means for Solving the Problems) That is, the present invention brings a metal brush and a metal block made of pure metal or an alloy into frictional contact to peel off minute portions of metal from the metal block with the metal brush, and at the same time removes the metal from the metal block. In a mechanical plating method, the metal of the stripped metal block is mechanically plated onto the surface of the material to be plated through the metal brush by bringing the brush into frictional contact with the material to be plated. This is a mechanical plating method that performs plating while removing small metal particles that have adhered to the brush surface and cannot be used as a plating layer. This is between the contact point of the block and the contact point of the metal brush and the material to be plated.

That is, in the method of the present invention, after the metal brush and the material to be plated come into contact, the metal brush and the grindstone or cutting tool are brought into contact with each other, thereby removing small metal particles that have adhered to the surface of the metal brush and cannot become a plating layer. This prevents the formation of a hard working layer on the surface of the metal block which will then come into contact with the metal brush, and allows continuous use of the metal block, ie continuous plating.

In principle, the combination of the metal block, metal brush, and material to be plated used in the present invention requires that the metal block be softer than the metal brush, or have a hardness equivalent to that of the metal brush.

A few examples of combinations of metal blocks and metal brushes include using the same metal for the metal block and metal brush, or using a stainless steel wire brush for an Al metal block and a hard wire brush for a Cu metal block. There are combinations such as steel wire brushes.

The material to be plated is not particularly limited, and examples include 42% Ni alloy, stainless steel, and ordinary steel.

Further, the grindstone and cutting tool (for example, cutting tool) are not particularly specified as long as they can sharpen the surface of the metal brush. Furthermore, the metal block only needs to have a surface that comes into contact with the metal brush, and its shape is not particularly specified.

Next, the present invention will be explained with reference to the drawings.
FIG. 1 is an explanatory diagram of the method according to the present invention. In Fig. 1, 1 is a metal brush, 2 is a metal block, 3 is a material to be plated, 4 is a grinding wheel (Fig. 1a) or a grinding belt (Fig. 1b), and 5 is a formed plating layer. .

Rotate the metal brush 1 at high speed (peripheral speed approx.
The plating layer 5 can be obtained by bringing the tip of the brush into contact with the metal block 2 and the material 3 to be plated. Also, metal brush 1
By bringing the grinding wheel 4 into contact with the grinding wheel 4, it is possible to prevent the formation of a hard working layer on the surface of the metal block 2,
As a result, metal blocks can be used continuously.

(Function) As in the present invention, by bringing the metal brush into contact with a grindstone or a cutting tool, small metal pieces that are attached to the surface of the metal brush and cannot become a plating layer are removed. This allows the metal brush to come into contact with the metal block in the same condition as it did at the beginning, which prevents the formation of a hard-worked layer on the surface of the metal block and allows mechanical plating to be carried out continuously over a long period of time. Even if it is done, it becomes possible to make the plating film thickness uniform.

(Example) Next, the present invention will be specifically explained with reference to Examples, but the present invention should not be construed as limited by these.

Example 1 Outer diameter 200mm with many 0.25mmφ hard steel wires implanted
φ, 100mm length foil metal brush
Rotate at 2500rpm, thickness 50mm x width 100mm x length
A 200mm Cu block is pressed against a metal brush and moved at a speed of 2.0m/min, 1.0mm thick x width.
Figure 2 shows the plating thickness distribution in the longitudinal direction of the 100 SUS 304 strip when it was plated by pressing a metal brush onto it.

The ● mark in FIG. 2 is based on the method of the present invention. That is, plating is performed while a grindstone is brought into contact with a rotating hard steel wire brush (corresponding to FIG. 1a of the embodiment). The circle mark indicates a comparative example in which the brush was not brought into contact with the grindstone.

Example 2 Outer diameter with many 0.1mmφ SUS 304 wires implanted
A foil metal brush with a diameter of 300 mm and a length of 500 mm.
Rotate at 2000rpm, thickness 100mm x width 500mm x length
Press the 400mm A block against the metal brush,
Also, 2.0mm thick x width that moves at a speed of 1.0m/min.
Figure 3 shows the plating thickness distribution in the longitudinal direction of a 500 mm 42% Ni alloy strip when it was plated by pressing a metal brush against it.

The mark ● in FIG. 3 is based on the method of the present invention, in which plating was performed while the grinding belt was brought into contact with a rotating SUS 304 brush (corresponding to FIG. 1b of the embodiment). The circle mark indicates a comparative example in which the brush was not brought into contact with the grinding belt.

(Effects of the Invention) The mechanical plating method according to the present invention is a method of mechanically plating metal by simultaneously performing frictional contact between a metal brush, a metal block, a material to be plated, and a grindstone, so it is a method for electroplating. This is an inexpensive method that does not require various baths or solutions as in the case of chemical plating methods, and a plated material with strong adhesion can be obtained. Additionally, problems such as non-uniform plating thickness and reduced plating thickness, as with earlier mechanical plating methods, are improved.

In addition, the mechanical plating method according to the present invention makes it possible to firmly plate a wide variety of pure metals and alloys onto the material surface at a much lower cost than conventional methods. Indicates the characteristics of metal, plating property,
A plated material with excellent solderability, electrical conductivity, corrosion resistance, heat resistance, abrasion resistance, and decorativeness can be obtained.

[Brief explanation of the drawing]

1a and 1b are illustrations of the method according to the invention. FIG. 2 shows the change in the plating film thickness in the longitudinal direction of the coil when Al plating is applied. The ● mark is data related to the present invention, and the ○ mark is data related to the comparative example. Figure 3 shows an example of Cu plating, and the ● and ○ marks are the same as in Figure 2. 1...metal brush, 2...metal block, 3...
...Material to be plated, 4...Whetstone or grinding belt, 5
...Metsuki layer.

Claims (1)

[Scope of Claims] 1 A metal brush is brought into frictional contact with a metal block made of pure metal or an alloy, and a minute portion of metal from the metal block is removed by the metal brush, and the metal brush is brought into frictional contact with a material to be plated. In the mechanical plating method, in which the metal of the stripped metal block is mechanically plated onto the surface of the material to be plated using a metal brush, the plating layer adhering to the surface of the metal brush is removed using a grindstone or a cutting tool. A mechanical plating method characterized by performing plating while removing small pieces of metal that have not been obtained. 2. The mechanical plating method according to claim 1, wherein said grindstone or cutting tool is arranged between a contact point between a metal brush and a metal block and a contact point between a metal brush and a material to be plated.