JPH0219479A - Mechanical plating method - Google Patents

Abstract

PURPOSE:To prevent a plating layer formed by mechanical plating from being made ununiform in thickness by carrying out mechanical plating while removing metal chips sticking to the surface of a metal brush with a grindstone or a cutting tool. CONSTITUTION:A metal brush 1 is turned at a high speed and brought into contact with a metal block 2 to tear fine metal chips from the block 2. At the same time, the brush 1 is brought into contact with a material 3 to be plated to mechanically plate the surface of the material 3 with the metal torn from the block 2 through the brush 1. At this time, the remaining metal chips not converted into a plating layer and sticking to the surface of the brush 1 are removed by bringing a grindstone 4 or a cutting tool into contact with the brush 1. The formation of an intensely worked layer in the surface of the block 2 can be prevented and a formed plating layer 5 can be made uniform in thickness even when mechanical plating is continuously carried out.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention is applied to mechanical plates used in fields that require corrosion resistance, heat resistance, abrasion resistance, solderability, conductivity, plating properties, and decorative properties. Regarding the ting method.

(Conventional technology) Surface treatment techniques that have been commonly used to plate metals on materials, parts, etc. include electroplating, chemical plating, hot-dip plating, and thermal spray plating. A thin film of metal or alloy is plated on the surface of the material and used for various purposes.

Electroplating is a method of forming a thin metal film on the surface of a material by using a material to be plated as a cathode in a solution containing metal and passing a direct current between the anode and the opposing anode.

Chemical plating is a method of plating on nonconducting materials such as glass and synthetic resin without using electricity. The hot-dip plating method is a method of plating by dipping into molten metal. Thermal spray plating is a method of spraying metal melted by gas or arc onto the surface of a material using high-pressure gas or air. Each of these various plating methods has its own drawbacks or problems.

(Problems to be solved by the invention) Namely, with electroplating, alloy plating is difficult, with chemical plating, the plating layer cannot be thick and the cost of chemicals is high, and with hot-dip plating, it is difficult to form a pipe by simply dipping it. Although it has the advantage of being able to thicken the plating layer on the inner surface, etc., it has the disadvantages that it is difficult to adjust the thickness, that thermal spray plating tends to be porous, and that the metal particles are oxidized. The most common problems are that the adhesion between the plating layer and the material is not necessarily sufficient, that the equipment is expensive, and that waste liquid treatment is necessary.

The present inventors previously discovered a mechanical plating method (Japanese Patent Application No. 62-299714) as a means of solving these problems, and eliminated and improved the problems or drawbacks of conventional methods of plating metal surfaces.

In other words, the mechanical plating method involves bringing a metal brush into contact with a metal block and stripping off the metal from the metal block with the metal brush, and then bringing the material to be plated into contact with the metal brush and stripping it off with the metal brush. This is a method of mechanically plating metal onto the surface of a material to be plated via a metal brush.

However, there are other problems with this method.

While blating is being performed, the metal from the metal block that was previously stripped off by the brush does not adhere to the material to be plated, but instead adheres to the surface of the metal block and forms a hard-working layer (re-deposition). This hard-working layer is very hard and difficult to scrape, so the amount of metal that can be removed by a metal brush is small. Therefore, if plating is performed for a long time, the plating film thickness will decrease over time. There are many things that can be mentioned.

An object of the present invention is to provide a mechanical plating method that eliminates and improves the problems or drawbacks of the above-mentioned mechanical plating methods and prevents non-uniformity in plating thickness.

(Means for Solving the Problems) That is, the present invention brings a metal brush into frictional contact with a metal block made of pure metal or an alloy, and peels off minute portions of metal from the metal block with the metal brush, and at the same time removes the metal from the metal block. In a mechanical plating method, the metal of the stripped metal block is mechanically plated onto the surface of the material to be plated through the metal brush by bringing the brush into frictional contact with the material to be plated. This is a mechanical plating method that performs plating while removing small metal particles that have adhered to the brush surface that could not form a plating layer. It is between the contact point of the block and the contact point of the metal brush and the material to be plated.

In other words, in the method of the present invention, after the metal brush and the material to be plated come into contact, the metal brush is brought into contact with a grindstone or a cutting tool, thereby removing small metal pieces that have not been formed into a plating layer and adhered to the surface of the metal brush. This prevents the formation of a hard working layer on the surface of the metal block which will then come into contact with the metal brush, and allows continuous use of the metal block, ie continuous plating.

In the combination of the metal block, metal brush, and material to be plated used in the present invention, the metal block must be softer than the metal brush, or must have an equivalent hardness in principle.

A few examples of combinations of metal blocks and metal brushes include using the same metal for the metal block and metal brush, and using a stainless steel wire brush for the AQ metal block and a stainless steel wire brush for the Cu metal block. There are combinations such as hard steel wire brushes.

The material to be plated is not particularly limited, and examples include 42% Ni alloy, stainless steel, and ordinary steel.

Further, the grindstone and cutting tool (for example, cutting tool) are not particularly specified as long as they can sharpen the surface of the metal brush. Furthermore, the metal block only needs to have a surface that comes into contact with the metal brush, and its shape is not particularly specified.

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is an explanatory diagram of the method according to the present invention. In Fig. 1, 1 is a metal brush, 2 is a metal block, 3 is a material to be plated, 4 is two grinding wheels (Fig. 1 (a)) or a grinding belt (Fig. 1 (b)), and 5 is a forming This shows the plating layer.

Rotate the metal brush 1 at high speed (peripheral speed approximately 2000 m/wi
n) Attach the tip of the brush to the metal block 2 and the material to be plated 3.
The plating layer 5 can be obtained by contacting with. Furthermore, by bringing the metal brush 1 into contact with the grinding wheel 4, it is possible to prevent the formation of a hard working layer on the surface of the metal block 2, and as a result, the metal block can be used continuously.

(Function) As in the present invention, by bringing the metal brush into contact with the grindstone or cutting tool, small metal pieces that have adhered to the surface of the metal brush and could not form a plating layer are removed. As a result, the metal brush comes into contact with the metal block in the same condition as when it first came into contact, which prevents the formation of a hard working layer on the surface of the metal block, and allows continuous mechanical plating for a long time. Even if this is done, it is possible to make the plating film thickness uniform.

(Example) Next, the present invention will be specifically explained with examples.
The present invention is not to be construed as being limited by this.

Example 1 Outer diameter 200+ with many 0.25mmφ hard steel wires implanted
25 nmφ, length 100mmQ foil metal brushes
Rotate at 0 rpm, thickness 50 II 1 m x width 100 m
+++X A Cu block with a length of 200 mm is pressed against a metal brush, and a thickness of 1. FIG. 2 shows the plating thickness distribution in the longitudinal direction of the strip when a metal brush was pressed onto the 5IJS 304 strip having a width of 100 mm and a width of 100 mm.

The marks in FIG. 2 are those obtained by the method of the present invention. That is, plating is performed while a grindstone is brought into contact with a rotating hard steel wire brush (see Fig. 1 (a) of the embodiment).
). The O mark is a comparative example in which the brush was not brought into contact with the grindstone.

Example 2 A foil metal brush with an outer diameter of 300φ and a length of 500mm Q, in which many 0.1mmφ SUS 304 wires were implanted, was rotated at 200 Orpm+, and an AQ block with a thickness of 100mna, a width of 500mm, and a length of 400cm was brushed with the metal brush. Figure 3 shows the plating thickness distribution in the longitudinal direction of the strip when a metal brush is pressed against and plated a 42% Ni alloy strip with a thickness of 2.0 + + + m x width of 500 mm moving at a speed of 1.0 m/min. show.

The marks in Fig. 3 are based on the method of the present invention, in which plating was performed while the grinding belt was in contact with the rotating SO5304 brush (see Fig. 1 (b) of the embodiment).
). The O mark is a comparative example in which the brush was not brought into contact with the grinding belt.

(Effect of the invention) A mechanical plating method according to the present invention.

This is a method of mechanically brating metal by simultaneously making frictional contact between a metal brush, a metal block, the material to be plated, and a grindstone.

Unlike electroplating or chemical plating, this method does not require various baths or solutions, is inexpensive, and provides a plated material with strong adhesion. Additionally, problems such as non-uniform plating thickness and reduced plating thickness, as with earlier mechanical plating methods, are improved.

In addition, the mechanical plating method of the present invention allows a wide variety of pure metals and alloys to be firmly plated on the material surface at a much lower cost than conventional methods. Shows the characteristics of metal and has plating properties.

A plated material with excellent solderability, conductivity, corrosion resistance, heat resistance, abrasion resistance, and decorativeness can be obtained.

[Brief explanation of the drawing]

FIG. 1(a) and FIG. 1(b) are explanatory diagrams of the method according to the present invention. FIG. 2 shows the change in the plating film thickness in the longitudinal direction of the coil in the case of AΩ plating. - Marks are data related to the present invention, and ○ marks are data related to the comparative example. Figure 3 shows an example of Cu plating, and the marks . and O are the same as in Figure 2. 1 Metal brush 4 Grinding wheel or grinding belt 2 Metal block 5 Plating layer 3 Material to be plated

Claims (1)

[Scope of Claims] 1 A metal brush is brought into frictional contact with a metal block made of pure metal or an alloy, and minute portions of metal from the metal block are removed by the metal brush, and the metal brush is brought into frictional contact with a material to be plated. In the mechanical plating method, the metal from the stripped metal block is mechanically plated onto the surface of the material to be plated using a metal brush. A mechanical plating method characterized by performing plating while removing small pieces of metal that were not obtained. 2. The mechanical plating method according to claim 1, wherein the grindstone or cutting tool is arranged between a contact point between a metal brush and a metal block and a contact point between a metal brush and a material to be plated.