JPH01162781A - Mechanical plating method - Google Patents
Mechanical plating methodInfo
- Publication number
- JPH01162781A JPH01162781A JP62321345A JP32134587A JPH01162781A JP H01162781 A JPH01162781 A JP H01162781A JP 62321345 A JP62321345 A JP 62321345A JP 32134587 A JP32134587 A JP 32134587A JP H01162781 A JPH01162781 A JP H01162781A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- plated
- brush
- plating
- metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims description 37
- 229910052751 metal Inorganic materials 0.000 claims abstract description 72
- 239000002184 metal Substances 0.000 claims abstract description 72
- 239000000463 material Substances 0.000 claims abstract description 34
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 9
- 239000000956 alloy Substances 0.000 claims abstract description 9
- 230000001590 oxidative effect Effects 0.000 abstract description 2
- 239000000126 substance Substances 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
- B23K20/1215—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding for other purposes than joining, e.g. built-up welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は耐食性、耐熱性、耐摩耗性、ハンダ付性、導電
性、メツキ性、装飾性を要求される分野において使用さ
れるメツキ方法に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a plating method used in fields that require corrosion resistance, heat resistance, abrasion resistance, solderability, electrical conductivity, plating performance, and decorative properties. .
（従来の技術）
従来より材料、部品などに金属をメツキする方法として
一般的に行われている表面処理技術としては、電気メツ
キ、化学メツキ、溶融メツキ、溶射メツキなどの方法が
あり、金属の薄い膜を材料表面にメツキさせ各種目的に
供している。(Conventional technology) Surface treatment techniques that have been commonly used to plate metals on materials, parts, etc. include electroplating, chemical plating, hot-dip plating, and thermal spray plating. Thin films are plated onto the surface of materials and used for various purposes.
電気メツキ法は、金属を溶かした溶液の中に被メツキ材
を陰極とし、向い合せた陽極との間に直流電流を流すこ
とにより、材料表面に金属薄膜を得る方法である。化学
メツキ法は、電気を使用せずにガラス、合成樹脂などの
不導体物質上にメツキする方法である。溶融メツキ法は
、溶融した金属の中に浸漬してメツキする方法である。The electroplating method is a method of forming a thin metal film on the surface of a material by using a material to be plated as a cathode in a solution containing metal and passing a direct current between the anode and the opposing anode. The chemical plating method is a method of plating on nonconducting materials such as glass and synthetic resins without using electricity. The molten plating method is a method of plating by immersing the material in molten metal.
溶射メツキ法は、ガスまたはアークで溶融した金属を高
圧のガスまたは空気によって材料の表面に吹き付けてメ
ツキする方法である。これら各種のメツキ方法にはそれ
ぞれ固有の欠点若しくは問題点がある。The thermal spray plating method is a method of plating the surface of a material by spraying metal melted by gas or arc onto the surface of the material using high-pressure gas or air. Each of these various plating methods has its own drawbacks or problems.
（発明が解決しようとする問題点）
すなわち、＠気メツキ法は合金のメツキが困難であるこ
と、化学メツキ法はメツキ層が厚くできず薬品の値段が
高いこと、溶融メツキ法は浸漬するだけでパイプの内面
などにメツキ層を厚くできる利点があるが、厚さの調整
が難しいこと、溶射メツキ法は多孔質になりやすく、金
属粒子が酸化されることなどの点である。共通した最も
大きな問題点はメツキ層と材料の固着力が必ずしも十分
でないこと、および装置が高価であること、また廃液処
理の必要性があることなどである。(Problems to be solved by the invention) In other words, the @chemical plating method has difficulty in plating alloys, the chemical plating method cannot produce a thick plating layer and the cost of chemicals is high, and the hot-dip plating method only requires immersion. This method has the advantage of being able to thicken the plating layer on the inner surface of pipes, etc., but it is difficult to adjust the thickness, and the thermal spray plating method tends to become porous and the metal particles can be oxidized. The most common problems are that the adhesion between the plating layer and the material is not necessarily sufficient, the equipment is expensive, and there is a need for waste liquid treatment.
本件出願人はこれらの解決手段として特願昭６１−１０
７７６４号においてメカニカルメツキ方法を提案し、従
来の金属表面にメツキする方法における問題点あるいは
欠点を除去、改善した。前記特許出願において提案した
メカニカルメツキ方法とは、金属ブラシと被メツキ材料
とを摩擦接触させて、金属ブラシの純金属または合金を
被メツキ材料表面に機械的にメツキする方法である。As a means of solving these problems, the applicant filed a patent application in 1986-10.
In No. 7764, a mechanical plating method was proposed to eliminate and improve the problems and drawbacks of conventional methods of plating metal surfaces. The mechanical plating method proposed in the above patent application is a method of mechanically plating the pure metal or alloy of the metal brush onto the surface of the material to be plated by bringing the metal brush into frictional contact with the material to be plated.
しかしながら、この方法における問題点として金属ブラ
シの純金属または合金を被メツキ材表面に摩擦接触させ
てメツキするため金属ブラシが酸化し易く、また、金属
ブラシに用いる金属ワイヤーが高価であり、さらに金属
ワイヤーが抜けやすいなどの点がある。However, the problem with this method is that the metal brush is easily oxidized because the pure metal or alloy of the metal brush is brought into frictional contact with the surface of the material to be plated, and the metal wire used for the metal brush is expensive. There are some issues, such as the wires coming off easily.
本発明は上記のメカニカルメツキ方法の有する問題点あ
るいは欠点を除去、改善し、金属ブラシの酸化およびワ
イヤーのぬけを防止した機械的にメツキする方法、すな
わちメカニカルプレーティング方法を提供することを・
目的とするものである。The present invention aims to provide a mechanical plating method, that is, a mechanical plating method, which eliminates and improves the problems and drawbacks of the above-mentioned mechanical plating methods, and prevents oxidation of metal brushes and shedding of wires.
This is the purpose.
（問題点を解決するための手段）
本発明方法は金属ブロックと金属ブラシおよび金属ブラ
シと被プレーティング材料の摩擦接触を同時に行うこと
によって、金属ブロックの純金属または合金を金属ブラ
シを介して被プレーティング材料表面にプレーティング
する方法である。すなわち、金属ブラシで金属ブロック
の微小部分を剥ぎ取り一ブラシに付着させ、その剥ぎ取
った金属ブロックの金属を被プレーティング材料にメカ
ニカルプレーティングする。(Means for Solving the Problems) The method of the present invention allows the pure metal or alloy of the metal block to be coated through the metal brush by simultaneously bringing the metal block into frictional contact with the metal brush and between the metal brush and the material to be plated. This is a method of plating on the surface of a plating material. That is, a minute portion of a metal block is peeled off with a metal brush and adhered to the brush, and the metal of the peeled off metal block is mechanically plated onto a material to be plated.
このメカニカルプレーティングの条件としては大気中、
非酸化性ガス中、真空中の何れか１種の雰囲気で、−２
０℃〜１０００℃の温度範囲において行えばよく、特に
好ましい条件としては、被酸化性ガス雰囲気下で１０℃
〜３００℃の温度範囲である。The conditions for this mechanical plating are atmospheric,
-2 in either non-oxidizing gas or vacuum atmosphere
It may be carried out in a temperature range of 0°C to 1000°C, particularly preferably at 10°C in an oxidizable gas atmosphere.
The temperature range is ~300°C.
本発明において、使用する金属ブロック、金属ブラシ、
被プレーティング材料の組合せは、原則的には金属ブロ
ックが金属ブラシよりも柔らかいか、または、同等の硬
さで、なければならない。そばＡＱ金属ブロックに対し
てはＣｕ金属ブラシ、 Ｃｕ金属ブロックに対しては硬
鋼線等の異種の組合せであってもよい。被プレーティン
グ材料としては特に限定されるものではなく、例えば、
４２Ｎｉ合金、ステンレス鋼等である。In the present invention, metal blocks, metal brushes,
In principle, the combination of materials to be plated must be such that the metal block is softer than the metal brush, or has an equivalent hardness. Different combinations may be used, such as a Cu metal brush for the Soba AQ metal block and a hard steel wire for the Cu metal block. The material to be plated is not particularly limited, and for example,
42Ni alloy, stainless steel, etc.
本発明では上述のように金属ブラシのブラシに金属ブロ
ックの金属を付着させるので、ブラシの酸化を防止する
ことができる。In the present invention, since the metal of the metal block is attached to the brush of the metal brush as described above, oxidation of the brush can be prevented.
次に本発明方法を実施するための装置の１例を第１図に
示す。図面において、１は金属ブラシ、２は金属ブロッ
ク、３は被プレーティング材料である。金属ブラシ１を
約２４００回転／分の速度で回転させ、金属ブラシ１の
先端を金属ブロック２及び被プレーティング材料３のそ
れぞれの表面に摩擦接触させることによって金属ブラシ
１を介して金属ブローツク２の金属を被プレーティング
材料３の表面にプレーティングさせる。この例では金属
ブロック２は金属ブラシ１を介して被プレーティング材
料３の上方に位置しているが、このような位置にとどま
らず金属ブラシ１の周囲のいずれの場所に位置してもよ
いことは言うまでもない。Next, an example of an apparatus for carrying out the method of the present invention is shown in FIG. In the drawings, 1 is a metal brush, 2 is a metal block, and 3 is a material to be plated. The metal brush 1 is rotated at a speed of about 2400 revolutions per minute, and the tip of the metal brush 1 is brought into frictional contact with the surfaces of the metal block 2 and the material to be plated 3, so that the metal block 2 is rotated through the metal brush 1. Metal is plated on the surface of the plated material 3. In this example, the metal block 2 is located above the material to be plated 3 via the metal brush 1, but it is not limited to this position and may be located anywhere around the metal brush 1. Needless to say.
以下、実施例をもって本発明を説明する。The present invention will be explained below with reference to Examples.
（実施例）
第１表に本発明方法によってプレーティングする際の金
属ブラシ、金属ブロック、被プレーティング材料の組合
せ例を示す。また、第２表にプレーティングの代表例と
して金属ブラシ、金属ブロックおよび被プレーティング
材料の組合せと、その時のプレーティング条件（ブラシ
回転数）およびプレーティング膜厚を示す。(Example) Table 1 shows examples of combinations of metal brushes, metal blocks, and materials to be plated when plating according to the method of the present invention. Further, Table 2 shows combinations of metal brushes, metal blocks, and materials to be plated as representative examples of plating, as well as the plating conditions (brush rotation speed) and plating film thickness.
以下余白
（発明の効果）
本発明によるメカニカルプレーティング方法は、金属ブ
ロックと金属ブラシおよび被プレーティング材料の摩擦
接触を同時に行うことにより、機械的に金属をプレーテ
ィングさせる方法であるので、電気メツキ法や化学メツ
キ法の場合のごとく各種の槽や溶液を必要とせず安価な
方法であり、また、固着力が強固で厚さが均一なプレー
ティングされてなる材料が得られる６さらに、メカニカ
ルメツキ方法の場合のごとくブラシが酸化し易く、また
、金属ブラシに用いる金属ワイヤーが高価であり、且つ
抜けやすいなどの問題点が排除される。The following margins (effects of the invention) The mechanical plating method according to the present invention is a method of mechanically plating metal by simultaneously bringing a metal block, a metal brush, and the material to be plated into frictional contact, so that electroplating is possible. It is an inexpensive method that does not require various baths or solutions unlike the mechanical plating method and the chemical plating method, and it is possible to obtain plated materials with strong adhesion and uniform thickness6.Furthermore, the mechanical plating method Problems such as the brushes being easily oxidized and the metal wires used for the metal brushes being expensive and easily coming off, as in the case of the method, are eliminated.
また、本発明によるメカニカルプレーティング方法では
、従来方法に比べ極めて安価に各種の純金属、合金を強
固に材料表面にプレーティングさせることができ、この
ような表面処理を施した材料では、表面固着金属の特性
を示し、メツキ性、ハンダ付性、導電性、耐食性、耐熱
性、耐摩耗性。In addition, the mechanical plating method of the present invention allows various pure metals and alloys to be firmly plated on the surface of the material at a much lower cost than conventional methods. Shows the properties of metal, including plating, soldering, conductivity, corrosion resistance, heat resistance, and abrasion resistance.
装飾性にすぐれたメツキされてなる材料を得ることがで
きる。A plated material with excellent decorative properties can be obtained.
第１図は本発明を実施するための装置の一例を示す説明
図である。
１・・・金属ブラシ ２・・・金属ブロック３・・・
被プレーティング材料FIG. 1 is an explanatory diagram showing an example of an apparatus for implementing the present invention. 1... Metal brush 2... Metal block 3...
Material to be plated
Claims (1)
を摩擦接触させて、該金属ブラシにより金属ブロックの
金属の微小部分を剥ぎ取ると同時に、前記金属ブラシを
被プレーティング材料と摩擦接触させて、剥ぎ取った金
属ブロックの金属を、金属ブラシを介して被プレーティ
ング材料表面に機械的にプレーティングさせることを特
徴とするメカニカルプレーティング方法。A metal brush is brought into frictional contact with a metal block made of a pure metal or an alloy, and a minute portion of the metal of the metal block is stripped off by the metal brush, and at the same time, the metal brush is brought into frictional contact with a material to be plated to strip it. A mechanical plating method characterized by mechanically plating the metal of the removed metal block onto the surface of the material to be plated via a metal brush.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62321345A JPH01162781A (en) | 1987-12-21 | 1987-12-21 | Mechanical plating method |
| US07/282,681 US4987000A (en) | 1987-12-21 | 1988-12-12 | Mechanical plating process |
| EP88121003A EP0321863B1 (en) | 1987-12-21 | 1988-12-15 | Mechanical plasting process |
| DE8888121003T DE3874106T2 (en) | 1987-12-21 | 1988-12-15 | MECHANICAL PLATING PROCESS. |
| KR1019880017117A KR910004525B1 (en) | 1987-12-21 | 1988-12-21 | Mechanical plating process watch dog timer circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62321345A JPH01162781A (en) | 1987-12-21 | 1987-12-21 | Mechanical plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01162781A true JPH01162781A (en) | 1989-06-27 |
Family
ID=18131546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62321345A Pending JPH01162781A (en) | 1987-12-21 | 1987-12-21 | Mechanical plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01162781A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001334358A (en) * | 1999-12-20 | 2001-12-04 | Ahresty Corp | Method for manufacturing engine block |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5087930A (en) * | 1973-12-10 | 1975-07-15 |
-
1987
- 1987-12-21 JP JP62321345A patent/JPH01162781A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5087930A (en) * | 1973-12-10 | 1975-07-15 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001334358A (en) * | 1999-12-20 | 2001-12-04 | Ahresty Corp | Method for manufacturing engine block |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2020523486A (en) | Refractory metal or stainless steel having an electroplated layer on the surface, and electroplating process of refractory metal or stainless steel surface | |
| JPH01162781A (en) | Mechanical plating method | |
| Pushpavanam et al. | Rhodium—Electrodeposition and applications | |
| KR910004525B1 (en) | Mechanical plating process watch dog timer circuit | |
| WO2003010357A1 (en) | Electroconductive structure and electroplating method using the structure | |
| JPS62267480A (en) | Mechanical plating method | |
| JPS627280B2 (en) | ||
| US2829116A (en) | Preparation of oxidation catalytic units | |
| JPS62267481A (en) | Mechanical plating method | |
| JP2729835B2 (en) | Method for forming ceramic film on aluminum substrate surface | |
| JP2003049292A (en) | Electrodeposition drum | |
| JPS63203777A (en) | Partial mechanical plating method | |
| JPS61284593A (en) | Manufacture of copper alloy bar for contact maker | |
| Birkle et al. | Electrodeposited Aluminum Using the Sigal Process | |
| JPH0520511B2 (en) | ||
| JP3232777B2 (en) | Aluminum electroless plating method | |
| KR930007665B1 (en) | Surface treatment of welding sputtering accessible member | |
| JPH0219480A (en) | Mechanical plating method | |
| JPH0563554B2 (en) | ||
| US3368951A (en) | Metal plating process and article made thereby | |
| JP2685936B2 (en) | Manufacturing method of composite material | |
| JPS5511184A (en) | Surface treating method of copper or copper alloy or plated product by these metals | |
| JPS61286060A (en) | Jig member for soldering | |
| GB1124684A (en) | Nickel alloy article with improved properties and method of making same | |
| JPS57177984A (en) | Cathode for electrolysis |