WO1991010757A1

WO1991010757A1 - Method and apparatus for depositing on a solid substrate a solid additive material consisting of particles of at least one metal, alloy or metalloid

Info

Publication number: WO1991010757A1
Application number: PCT/FR1991/000011
Authority: WO
Inventors: Etienne Broult
Original assignee: Etienne Broult
Priority date: 1990-01-16
Filing date: 1991-01-10
Publication date: 1991-07-25

Abstract

Method for depositing, on a solid substrate (2), a solid additive material (M) having originally the form of a solid piece (I) consisting of particles of at least one metal, alloy or metalloid, said method being characterized in that it comprises the following series of steps: a) driving a material transfer device (7) made of metal; b) frictionally engaging the piece (I) with the moving transfer device (7) to pick up particles of the material; c) engaging the moving transfer device (7) with the substrate (2) downstream from the piece (I) in order to deposit particles of the material (M) onto the substrate (2); and optionally d) moving said transfer device (7) and the substrate (2) relatively to each other along a set path which corresponds to the shape of required deposit (3).

Description

METHOD AND APPARATUS FOR DEPOSITING A SOLID FILLER COMPOSED OF PARTICLES OF AT LEAST ONE METAL, ALLOY, METALLOID

ON A SOLID SUBSTRATE

The invention relates to the technical field of coating materials with metallic materials and more specifically relates to a method and an apparatus for depositing a solid filler material consisting of particles of at least one metal, alloy, metalloid on a solid substrate.

Various processes are already known for depositing metals, adapted to the technology used. Among these technologies, one of the most frequent is that, well known, of electrolytic deposition. However, this technology of electrolytic deposition has limits of implementation. work with regard in particular to the materials used, the thicknesses obtained, the forms of deposit produced, etc., as well as other intrinsic drawbacks. Other technologies are also known allowing the production of a metallic deposit:

magnetron or cathode sputtering, projection, laser deposition, chemical deposition, application of molten metal to the substrate, diffusion, evaporation. vacuum, decomposition coating, contact deposition, etc. We can refer, for example, to documents EP D3224-96, EP 0089604 and EP 0I4-86I3 which relate to such metal deposition technologies.

According to document EP 0I52 204, which also describes the known state of the art concerning the deposition of thin layers, in particular metallic, a deposition is carried out by spraying a filler material onto an applicator roller made of textile material (cotton) in contact with the substrate on which the filler material is to be deposited, a retaining roller being opposite the applicator roller.

Other deposition technologies are also known, but for applications other than the deposition of metals or the like, such as those expressly referred to by the present invention, these known technologies, moreover, therefore belonging to different technical fields than that concerned. Here, in the document PR 243I 363, a rubber is applied to a substrate. In the document US 46229I4, a device intended for a photocopier is proposed. This device includes flexible brushes removing a soft powder material from a movable bar to deposit it on a substrate. But the device according to this document is not suitable in the case where the filler material is a metal or equivalent.

The object of the invention is therefore to propose a technology

(defined by its method and an apparatus for implementing the method) specifically allowing the deposition of a solid filler material consisting of particles of at least one metal, alloy, metalloid, on a solid substrate.

To this end, the invention first of all proposes a method of depositing a solid material which is originally in the form of a solid part made up of particles of at least one metal, alloy, metalloid, on a solid substrate. , which includes the following sequence of steps:

a) Driving in movement a metallic member for transferring said filler material;

b) Apply with friction the piece of filler material on the moving transfer member, under conditions of reciprocal pressure, temperature, relative speed, capable of achieving physical conditions, in particular thermal conditions of the filler material capable of allowing the transfer member to take particles of filler material from the part; c) Apply the moving transfer member to the substrate, downstream of the piece of filler material, with a pressure less than or equal to the pressure of mutual application piece of filler material / moving transfer member and at a temperature lower than or equal to that of the piece of filler material, these physical conditions of reciprocal pressure and temperature being capable of allowing the deposition of particles of filler material located on the transfer member in motion on the substrate;

and where appropriate, d) relatively moving the transfer member and the substrate thus applied to it along a certain path corresponding to the shape of the deposition of filler material to be produced and with a relative speed adapted to the thickness desired for this deposit. The invention then proposes an apparatus for implementing this method which comprises:

a) means for supporting the piece of filler material; b) substrate support means; c) a movable metallic material transfer member

input;

d) means for driving the transfer member in movement; e) means associated with the support means of the part made of filler material and the transfer member for applying with friction the part made of filler material to the transfer member under physical conditions of reciprocal pressure, temperature, relative speed capable of allowing the transfer member to take particles of filler material from the part;

f) means associated with the support means of the substrate and with the transfer member for applying the transfer member to the substrate under physical conditions of reciprocal pressure and temperature capable of allowing the deposition of the particles of material found on the transfer member moving on the substrate;

and where appropriate, g) means of displacement relative to the assembly of the transfer member and means of supporting the substrate along a certain path corresponding to the shape of the deposit of filler material to be produced, with a relative speed adapted to the desired thickness of the deposit. the invention finally proposes a substrate thus provided with a

deposition of filler material using the method or apparatus according to the invention. Given what precedes this, it is understood that the method and the apparatus according to the invention are completely different from the methods and apparatus well known to those skilled in the art for carrying out, according to known techniques different from that of invention and recalled above, a metal coating on a solid substrate. For example, and without this being limiting, the apparatus according to the invention does not have an electrode, an electrolyte tank, a spray nozzle, etc., such as those commonly used in the prior art applicable with electroplating or spraying technologies.

As regards the technology taught by the document US 4 622 9I4 and which relates to a specific application other than that of the invention, there is no reason to think, a priori, that it can be transposed to other applications, since the conditions which then exist are significantly different than those provided for in this document or which result from the specific application concerned. In particular, it should be emphasized that this document is concerned with certain specific problems such as the manner in which the filler material is eroded, the presence of dust, the flexible nature of the substrate, etc. Furthermore, in the field metallic coating, if any. It is well known to abrade a metallic part rubbed with a certain pressure by means of a brush, a disc or another equivalent tool in movement, it is however not known or obvious, on the one hand, to deposit on a substrate of the metal powder carried by a brush, a disc or other equivalent tool in movement and in contact with the substrate and, on the other hand, to combine, as precisely provided for by the invention, the abrasion of a part metal constituting the powder filler material by means of a brush, a disc, or a tool used for subsequently transporting the powder filler material removed by abrasion and, finally, the deposition of this powder on a substrate to which it fully adheres to it rigidly. Indeed, it should be noted that according to the invention, said brush, disc or tool successively plays two opposite functions: first of collection and of deposit then with an intermediate transport function. This combination of three functions of the movable metallic transfer member implemented in the invention by the specific application of a metallic deposit leads to the obtaining of completely surprising results, on the one hand, as regards the even obtaining a metallic deposit on a substrate and, on the other hand, the quality of the deposit obtained. Finally, it should be noted that the invention makes it possible to avoid the drawbacks of the techniques of the known state of the art. techniques, such as pollution, while allowing great flexibility of implementation.

The invention will be better understood thanks to the attached drawings:

Figure I is a schematic view of the invention

Figure 2 is an elevational view of an apparatus for implementing the method.

Figure 3 is a top view of this apparatus.

The invention firstly relates to a method and an apparatus for depositing a solid filler material M, originally in the form of a part I, on a substrate 2.

The invention then relates to the substrate 2 comprising the deposit 3 of filler material M thus produced.

The filler material M is essentially a (or at least one) metal or, where appropriate, an alloy or a metalloid. This filler material generally consists of particles, in the physical sense of the term, that is to say grains of material of small dimensions.

Originally, the filler material M is in the form of the piece which forms a solid block consisting of said filler material M, the particles of which are bonded together

After implementation of the method, thanks to the apparatus according to the invention, the filler material M is, finally, once deposited, in the form of a layer or deposit 3 covering a surface 4 of the substrate 2. Filler material M discussed here is the one from Exhibit I

The part I is a piece forming a structural whole of the said filler material M. The part I therefore includes a piece of material M in bar or bar block, tube, profile, block or other. The part I is of the type capable of being able to be gradually abraded and in particular with a certain regularity. For example, the part I is longitilinear, thus having a main axis 5 along which it extends. And it has a transverse attack end surface 6, consumable, substantially perpendicular to the axis 5, from which the filler material M is removed. In such a case, the part I sees its axial length decrease as and as the filler M is removed. The part I is solid and rigid, that is to say that in the absence of external constraints s, it has the appearance of a solid, as would, for example, a copper rod, lead, etc. . . This solid and rigid character means that the part I can be self-supporting and carried by support means to which we will return later. The part I of material M, thus characterized, is different and is opposed to material M originally in powder with separate particles, or constituting (or carried by) a liquid or gaseous fluid.

The term “metal” means a pure or almost pure metal or its oxide or a composition essentially containing a metal. It can also be a metal alloy. According to a surprising result of the invention, it has been found to be effective with most (if not all) of the metals and alloys commonly used in industry or for research. Thus we can cite as a non-limiting list of metals which can be used: aluminum, zinc, nickel, copper, brass, silver, gold, silicon, etc. . .

The invention also applies to the case where two (or more) metals (or metal alloys) are deposited simultaneously, the part I being composite or two (or more) parts I being juxtaposed and attacked simultaneously by the metallic transfer member

In the case of a part I of which the filler material M is a alloy, it is said alloy which is removed, then transported, then deposited.

The invention also applies to the case where two (or more) metals (or metal alloys) are deposited successively, the second on the first (and so on) if necessary in a superposed manner or not. one can obtain, by the association of successive deposits on the substrate 2, an alloy or a juxtaposition of said metals by superposition from metals (or metal alloys) originally distinct.

According to the invention, the filler M remains essentially in the solid state visible from the start to the end of the process, although it is in the finely divided form of particles originally bound at the start and at the end of the process and separated during the transport step from the part I to the substrate 2. However, it is not excluded, on the contrary, that the filler material M, undergoes a transformation or a physical evolution on a microscopic scale between its original state (piece) and its final state (deposit 3 on the substrate 2).

The substrate 2 is any solid body on which a deposition of the filler material M can be carried out. Generally, the substrate 2 is characterized by a free surface 4 on which the deposit of material M is desired. As for its composition, the substrate 2 is arbitrary as long as it is compatible with the filler material M envisaged and the method according to the invention. For example, and without the list being exhaustive, the substrate 2 can be metallic (metal, alloy, composition based on metal or alloy), glass, wood, plastic, ceramic, etc. The substrate 2 can be flat, filiform, tubular, massive or other Its face 4 can be smooth or not, that is to say with significant reliefs (such as holes) or, on the contrary, unimportant (surface granite), localized or on the contrary extended. preferably rigid, like a plate, but can also have a certain flexibility, like a sheet. In this last case and taking into account the pressure which is exerted on it during the implementation of the process, a counterpart support is provided for a such a substrate 2 thus deformable. A typical, but not limiting, case of the invention is that in which the substrate has a free face 4 generally flat and smooth, in the manner of a plate. But the free face 4 can be curved when the substrate 2 is a wire or a tube. Preferably, the part I has a hardness at most equal to that of the substrate2.

The method according to the invention comprises the succession of steps consisting in:

a) Driving in movement a metallic transfer member 7 of said filler material M; b) Apply with friction the part I of filler materialM on the transfer member 7 in motion, under conditions of reciprocal pressure, temperature, relative speed, capable of achieving physical conditions, in particular thermal conditions of the filler material M capable of allowing the transfer member 7 to take particles of filler material M from the part I, in particular from its attack surface 6; c) Apply the transfer member 7 in movement on the substrate 2, downstream of the part I of the filler material M, with a pressure less than or equal to the pressure of reciprocal application part I of filler material M / transfer member 7 in motion and at a temperature lower than or equal to that of the piece I of filler material M, these physical conditions of reciprocal pressure and temperature being able to allow the deposition of particles of filler material M being on the transfer member 7 in motion on the substrate 2;

and optionally,

d) Relatively move the moving transfer member 7 and the substrate 2 thus applied to it along a certain path corresponding to the shape of the deposit 3 of filler material M to be produced and with a suitable relative speed to the desired thickness for the deposit 3.

This process is carried out by means of an apparatus which comprises: a) support means 8 of the part I of filler material M; b) support means 9 for the substrate 2;

c) a movable metallic transfer member 7 for the filler material M;

d) drive means I0 in movement of the transfer member 7;

e) means II associated with the support means 8 of the part I in filler material M and with the transfer member 7 for applying with friction the part I in filler material M on the transfer member 7 in physical conditions of reciprocal pressure, temperature, relative speed capable of allowing the transfer member 7 to take particles of filler material M from the part I; f) means I2 associated with the support means 9 of the substrate 2 and with the transfer member 7 for applying the transfer member to the substrate under physical conditions of reciprocal pressure and temperature capable of allowing the deposition of matter particles d 'M supply located on the transfer member 7 in motion on the substrate 2;

and optionally,

g) means I3 for relative overall displacement of the transfer member 7 and of the substrate 2 along a certain path corresponding to the shape of the deposit 3 of filler material M to be produced, with a suitable relative speed to the desired thickness of the deposit 3.

By deposit or layer 3 of material M, we mean a certain amount of this material M, being on the substrate 2, rigidly associated with the latter. The deposit or layer 3 can be punctual or longitilinear or surface, and this at the scale of direct human visual observation. It can be, moreover, continuous or discontinuous, both on this direct visual scale and on the microscopic scale. It can finally be rectilinear or curvilinear as for its line of extent, of regular contour or not. Its thickness can be constant or not, small or on the contrary greater. Normally, a deposit by a single pass of the transfer member 7 can be of the order of a few microns. By successive passes in the same places, it is possible to make a subsequent deposit 3 on an earlier deposit 3, without the deposits 3 are finally indivisualisables between them, the total deposit produced can then have a thickness of the order of a millimeter or several millimeters.

The shape, appearance, thickness, etc. characteristics of the deposit or layer 3 are, according to the invention, determined essentially by the conditions of application of the transfer member 7 on the substrate 2, these characteristics possibly making the subject to many variations.

The invention does not necessarily have to use masks such as those implemented, necessarily, in other technologies. However, such masks can also be used in the invention, in particular for ease of implementation. and, for example, obtaining more or less complex patterns of shape.

Typical cases of deposit 3 are point-in-time type deposits such as those which may constitute electrical or electronic contacts; filiform type such as those which may constitute electrical or electronic conductors; of surface type such as strips or other surfaces in particular for the metallic coating of substrate 2 or various objects.

According to a surprising result of the implementation of the method, the deposit 3 of material M, on the substrate 2, appears as material M deposited on and rigidly associated with the substrate 2. This means that by a simple manual action, even energetic, the deposit 3 cannot be dissociated from the substrate 2.

The characteristics of the deposit 3 produced are therefore determined by the member 7 and the conditions for its implementation. Beyond the general conditions of speed, pressure, etc. already mentioned, the person skilled in the art can choose or determine the particular conditions of implementation according to the deposit 3 which is desired, the choice or the determination of these conditions of implementation then being within its reach.

The member 7 of the device according to the invention has the essential characteristic of being metallic or conductive of electricity and sufficiently hard. It is driven in movement on itself, thanks to the IO drive means. For example, this movement is a rotational movement, in particular around an axis I4 parallel to the surface 4 and orthogonal to axis 5, but this movement can also be in translational movement parallel to surface 4.

Excellent results have been obtained with members 7 constituted by metallic brushes made of steel wires or also by steel discs.

However, the member 7 can also be a moving band, such as an endless band, the flat part of which is parallel or perpendicular or inclined relative to the surface 4. The member 7 can also be a cutter. It can be not only made of metal but also of plastic loaded with sufficiently hard material and conductive of electricity.

Experience has shown that organs 7 which are not electrically conductive are not suitable for suitable implementation of the invention.

For example, excellent results have been obtained for large surface deposits with brushes 7 with an outside diameter of between about 4 cm and 20 cm and an axial thickness of the order of a few centimeters.

For obtaining point or longitilinear or filiform deposits, good results have been obtained with thin disks of diameter comparable to what is.

The size of the steel wires of such a brush 7 depends on and is adapted to the substrate 2. For a substrate 2 such as steel, the steel wires can have a diameter of 0.30 mm. For a copper substrate 2 , more fragile, the diameter of the steel wires can be of the order of 0.16 mm.

A preliminary treatment of the brush 7 in a bath of trichlorethylene or other solvent is compulsory so that the brush 7 is perfectly degreased because it is necessary to cause a dry friction effect and not a lubricated friction effect on the part I. For the putting into service of a new brush 7 on a very soft substrate 2 such as copper, it is compulsory that the brush 7 undergoes prior wear, that is to say that for for example two or a few minutes, it is rubbed on a very abrasive substance which will provide wear and leveling of the free ends of the wires. An effective test to check that the brush 7 is thus "made" is that when you pass your hand over it, the brush does not should only be hanging in one direction, the direction of rotation but not in the opposite direction.

Optionally the member 7 is treated to be coated with a hard material such as chromium, which avoids mixing of the material of the member 7 with the filler material.

The method according to the invention, as well as its apparatus for implementation, can therefore be the subject of numerous variants. These variants relate in particular to the member 7 as well as the means 8, 9, I0, II, I2, I3, the material M, the part I, the substrate 2 and the conditions of temperature, pressure, speed. As already indicated, the detailed operating conditions can, generally, be determined by the skilled person as a function of starting parameters (support2, material M, characteristics of the desired deposit 3).

In addition, the method according to the invention can be implemented in a more complex manner, for example by making several simultaneous or successive deposits 3, superimposed or not, in whole or in part, with the same filler material M or with different M filler materials.

Whether or not there is a relative displacement of the whole of the member 7 relative to the substrate 2, along a certain path, in particular if it is desired to obtain a deposit 3 other than punctual. substrate 2 is moved in the same direction as member 7.

In the case of a member 7 of generally circular shape applied at least substantially tangentially to the substrate 2, in the absence of relative displacement, a deposition 3 is carried out essentially punctual (member 7 narrow) or longitilinear (parallel to the axis of organ 7 in case this last extends along its axis)

With a relative overall displacement, a longilinear (narrow member 7) or surface (axially extended member 7) deposit can be produced.

The moving member 7 is applied to the part I under conditions capable of tearing the filler material M from the part I as a result of the friction which occurs and with a substantial rise in temperature of the part I. For example, at from a part I originally at room temperature, it was possible to reach, during operation, temperatures of these of the order of 400 ° C. (aluminum) to 800 ° C. (Nickel) and this in a few seconds.

According to the invention, it has been found that the rise in temperature of the filler material on the part I is favorable for obtaining the deposit 3. The invention therefore provides, as a variant, to increase the temperature of the piece I of the filler material M or the temperature gradient between the piece I and the substrate 2 by a positive, clean action, for example we can heat the piece I and / or cool the substrate 2. For this purpose, we can use heating means: blowtorch, electrical resistance, infrared acting on part I; and / or cooling means acting on substrate 2, heat exchanger, cooling coil. In FIG. 2 are shown, for this purpose, heating means I5 of the room I and a temperature probe I6.

According to the invention, it has also been found that the existence of a magnetic field on the filler material M is favorable for obtaining the deposit 3. To this end, the invention provides, as a variant, for placing the 'organ 7 in a magnetic field created for example, by a permanent magnet or electromagnets.

According to the invention, it has also been found that the existence of a difference in electrical potential between the part I and the electrically conductive substrate 2 is favorable to

I "obtaining the deposit 3. The invention therefore provides, as a variant, the presence of an electric source suitably connected to the part I and the substrate 2. In particular, it has been found that this measure makes it possible to contribute to preventing an annoying electric arc between the member 7 and the substrate 2. For example, the electrical potential between the part I and the substrate 2 can be of the order of 3 to 6 volts with an amperage of the order of I0 to 20 amperes, the current being direct.

According to another variant, one can provide a part I organ 7 contact which is not permanent but intermittent and regular (in particular at high frequency), which favors the tearing of the filler material M by the organ 7.

The temperature rise (or temperature gradient), the magnetic field, the potential difference can also be applied temporarily, possibly repeated, and not permanently.

As also follows from the above, the moving member 7 is applied to the substrate 2 under conditions suitable for ensuring the deposition of filler material M previously taken from the part I and transported by the member 7 to the substrate 2.In particular, the member 7 is applied to the substrate with a slight relative pressure just sufficient to ensure the deposition 3 without affecting the substrate 2, in particular without starting it.

The device in question can be a portable or permanent device. It can be integrated into a production line. It can be the subject of variant embodiments depending on the implementation envisaged, the invention applying equally to cases not necessarily requiring great precision (metallurgy) and in cases where, on the contrary, precision is decisive (electronic, optical). In the case of FIG. 2, an organ I7 for adjusting the position of the organ can be provided 7 relative to the substrate 2 and / or to the piece I. In addition, the displacements of the substrate 2 can be ensured by means I3 such as a movable plate with variable advance.

According to another characteristic, the member 7 is in contact with the substrate 2 just the time necessary for the deposition 3 of the filler material M but not substantially more. This effect, the member 7 is in essentially tangential contact, but with sufficient pressure, on the on the substrate 2. Conversely, dimensional contact or excessive duration is avoided between the means 7 and the substrate 2 as it would result, for example, from the use of flexible deformable brushes, sweeping the substrate 2 as provided for in the document US 4 6229I4.

The means 8 for supporting the workpiece I can consist, for example, of claws, tubes, clamps or the like. They are arranged, for example, to allow the movement of the part I as and when it is consumed by the member 7.

Preferably, the means 8 are carried by a frame I4 to which the means 7, I0, II, I3 are also optionally fixed.

The means 9, substrate support 2 may consist, for example, of a conveyor belt or a table.

These means 9 are, for example, fixed, the frame I4 being moved or, on the contrary mobile, the frame I4 being fixed. Or the means 9 and the frame I4 can both be mobile.

The means 8, 9 are naturally adapted to the part I and to the substrate 2, considered in particular by their nature, their shape, their size.

The means II may for example comprise unidirectional elastic means such as a spring or jack cooperating with the means 8 and the part I, in particular for urging the part I towards the member 7 with the appropriate pressure.

The means II may also include heating members, creating a magnetic field, creating a potential difference as already indicated.

The means I2 can also include pressure and drive means adapted to their object as well as cooling members, creation of a magnetic field, creation of a potential difference.

The means I3 can comprise, for example, support means of the frame I4 with respect to the means 9 respectively at substrate 2 such as console, rollers, etc ... and drive means such as motor.

The tangential speed of the member 7 can be of the order of a few meters to the order of a hundred meters per second, depending on the applications. According to the invention, the tangential speed of the member 7 (or at least the relative speeds of member 7 / part I and member 7 / substrate 2) is quite large. For example, member 7 pivots with a speed of rotation of around 3000 to 5000 revolutions per minute.

The invention can be the subject of numerous application variants: metallization of circuits for electronics, coating of strips, transfer of supra or semiconductor materials, production of electrical resistances on supports, probes , decoration of earthenware, porcelain, jewelry; of building materials, making alloys, obtaining mirrors, making cells and batteries.

In these fields of variant applications, the invention allows doping of semiconductors, deposition on stainless steel of metals or graphite, decomposition or reduction of certain oxides.

It is also possible to metallize and use new technical elements such as composite materials based on carbon fibers and glass or Kevlar fabrics, these fabrics being used alone or alloyed with resins can be covered with metals or graphite.

In many mechanical and metallurgical sectors, the invention allows, under special conditions, to increase the sliding effect and to decrease the friction coefficients.

Moving the substrate opposite to the rotation of the deposition member constitutes a means of depositing the filler metal in thicker layers. Examples of realizations

Example I: Decoration:

Deposit of gold or silver on earthenware and porcelain. A set consisting of a brush made of 0.16 mm diameter steel fis rotating at 3000 rpm and connected by a hose to a known power unit in itself, allows you to instantly make the golden or silver fillet around the plates without using the usual pasta that must be baked.

In the case of fine decorations, the wire brush is replaced by a hard steel disc whose diameter can vary from 5 to I7 mm for a thickness of I mm. As for the brush, the metal is maintained in effect of friction rubbing on the tool; the use of a hose or a mini-drill allows you to work with the precision required for decorations and designs on glass and porcelain.

Example 2: Mechanics:

It is possible to make refills of different metals in thickness ranging from I to 6 mm in order to subsequently be able to carry out grinding machining.

The most commonly used metals are aluminum, copper, sine; in this kind of application, the first layer or adhesion layer is produced with a brush rotating at a speed of 3000 revolutions / minute.

Then, in order to thicken the layer, it is necessary to heat the filler metal before causing this friction effect on the brush. To this end the support of the filler metal is arranged in order to receive either an oxy-fuel torch. acetylene, or turns connected to a high frequency transmitter.

Means are used to control the preheated metal in order to avoid its uncontrolled diffusion; the metal heating temperature at 60 ° C below the melting temperature of each metal, ie: 600 ° C for aluminum

1000 ° C for copper

360 ° C for Zinc

I380 ° C for nickel

Since preheating has the effect of softening even the hardest metals, the number of metals that can be used is not limited.

The speed of rotation of the brushes for applying this metal in prefusion must not exceed '1500 revolutions / minute in order to avoid any projection and loss of control of the homogeneity of the applied layer.

This thickness application can be carried out on slowly rotating metal shafts as well as on flat and fixed surfaces.

Example 3: Metallization of technical ceramics:

Deposits of metals on ceramics in pure alumina or mixed with different oxides currently remain very expensive and dangerous because of chemicals brought into contact because the ceramic creates a phenomenon of rejection on many metals.

The method according to the invention makes it possible to simplify and solve this important problem because there is no means of transferring aluminum on ceramic as easily.

According to the invention, aluminum is deposited and adheres intimately to the ceramic, its deep bond experiencing no rejection phenomenon; aluminum can therefore serve as a bonding undercoat for all possible metals such as copper, silver, etc .; ..., the process allowing deposition in successive layers of different metals.

The rotation speed of the brushes is 3000 revolutions / minute and the pressure of the filler metal on the tool is 285 grams per cm2. Example 4: Optics:

The process for depositing aluminum on glass makes it possible to produce mirrors of different types at low cost: simple mirrors, converging or diverging lens mirrors.

The mirror can be internal to the deposit, ie on the glass side or external on the upper part of the deposited metal.

The process employs a steel brush whose wires have a diameter of 0.16 mm, a slow rotation speed of 400 revolutions / minute, a pressing force on the filler metal of 500 grams cm2.

For a 4.5 cm diameter brush, the tangential speed is I, I6 per second.

If a speed of 1500 rpm is used, the glass is scratched and the mirror effect is produced on the external surface of the deposited metal.

Such mirror lenses can be used in lasers.

Example 5: production of alloys:

The process according to the invention makes it possible to use one or more different filler metals, for example aluminum and copper. This then results in the formation of an aluminum bronze.

Eacemple 6: Use of a reverse polarity current:

The fact of sending a direct current in the filler metal on the positive side and in the substrate on the negative side allows an increase in yield of the deposit. The voltage used is for example 6 volts with an intensity of 10 amperes.

Example 1: Electronics:

To deposit, for example, gold in points which will receive different components and welds, the inventive method makes it possible to eliminate the bath of gold cyanide and not to have to hide the places you don't want to deal with.

To make a deposit on copper, a steel or titanium nitride disc with a diameter of I7 mm and a thickness of 0.5 mm is used, the speed of rotation being 1,500rpm, gold in as long as the filler metal is applied to the rotary tool with a force of 600 grams per cm2, the temperature increase of the filler metal quickly reaches 300 ° C.

The disc does not stay in the same place on the copper, it is cut up permanently so that it does not heat up the substrate; gold being harder than copper, only the thermal difference created allows obtaining the result.

Example 8: Creation of new circuits:

In the sector of circuits on glass and rectified ceramics, the process brings an important technological evolution.

In the case where it is not useful to have very fine circuits, that is to say composed of lines greater than a millimeter as a width, it is possible to make stencil circuits: a metal stencil comprising the an imprint of the whole of a given circuit is placed between the brush and the ceramic, the deposition of aluminum is carried out as an undercoat and then a deposition of copper and silver is possible.

In the case of the establishment of a so-called precision circuit with fine lines, for example 500 microns in width usually produced in screen printing with Paiadium pastes and glass beads which are passed through the oven, it is possible to proceed as follows:

The holes in the ceramic are drilled at the locations of the components using a laser.

A tracing unit connected to a computer and composed of a thin steel disc of I7 mm in diameter and 500 microns thick in friction with its filler metal completes the aluminum circuit in seconds.

On this circuit and where tin soldering has to be carried out, the process enables copper to be deposited selectively on aluminum; the thickness of the lines depends on the intensities requested and can reach 2 to 10 microns

The rotational speed of the rotary tool is 1500 rpm and the contact pressure of the filler metal is

200 g / cm2 for aluminum and 300g / cm2 for copper

On such a circuit produced at a very low cost price, successive deposits of metals are of course conceivable.

Example 9: Solar cells:

In this sector, two possibilities are offered for depositing metals on silicon by depositing aluminum with a brush rotating at a speed of 300 revolutions / minute and a pressure of the filler metal of 300g / cm2, that to metallize the bottom of the cell.

As for the upper grid, a steel disc guided either by a stencil or controlled by a computer with a tracing head, rotates at the speed of 300 revolutions / minute and realizes the aluminum grid, the pressure of the filler metal on the tool being 200g / cm2.

It is desirable not to exceed the speed of 300 rpm because silicon is a fragile substrate.

Example I0: Transfer of silicon:

To deposit thin layers I to 2 microns in silicon or germanium on glass or ceramics for elements from 5 to 10 cm2, a steel brush rotating at

1500 revolutions / minute and having a dry friction effect of the silicon on the brush with a pressing pressure of 500g / cm2 is used. To make deposits by points in order to obtain diodes, transistors, a steel disc is used rotating at 200 revolutions / minute and the silicon is pressed on the tool by a pressure of 500g / cm2.

With this means, junctions can be made, for example with a width of one millimeter and in superimposed layers of positive doped or negative doped silicon.

After a silicon deposit, it is possible to produce aluminum lines which serve as connections, without damaging the semiconductor deposit.

In this field of electronics, this process constitutes a means of producing both the circuit and the various components: resistors, diodes, transistors, etc.

To transfer sintered oxides, for example, superconductors and for Galium arsenide a steel disc not exceeding I00 RPM and with a pressure of the filler material on the tool of I50g / cm2

The deposition of metals on these same sintered oxides can be carried out under the same conditions in order to obtain weldable connections.

Claims

I) Method for depositing a solid filler material M originally in the form of a solid part (l) consisting of particles of at least one metal, alloy, metalloid, minerals, oxides, on a substrate ( 2) solid, characterized by the succession of steps consisting in:

a) Driving in movement a metallic transfer member (7) of said filler material.

b) Apply with friction the part (l) of filler material (M) on the transfer member (7) in movement, under conditions of reciprocal pressure, temperature, relative speed, capable of achieving physical conditions, in particular of the filler material (M) from the part (I): c) Apply the transfer member (7) in motion on the substrate (2), downstream of the part of filler material (M) with a pressure less than or equal to the pressure of reciprocal application piece (I) of filler material. these physical conditions of reciprocal pressure and temperature being able to allow the deposition of particles of filler material (M) located on the transfer member (7) in movement on the substrate (2): and where appropriate, d ) Relatively move the moving transfer member (7) and the substrate (2) thus applied to it along a certain path corresponding to the shape of the deposit (3) of filler material (M) to be produced and with a relative speed adapted to the thickness desired for this deposition, the direction of movement of the substrate relative to the direction of rotation of the transfer member (7) constitutes a variant of thickness.

2) Method according to claim I, characterized in that one uses a filler material (M) having a hardness equal to or less than that of the substrate (2). 3) Method according to any one of claims Ià3, characterized in that the part I is heated and the substrate (2) is cooled.

4) Method according to any one of claims I to 3,

characterized in that the part I and the substrate or the transfer member are brought to electrical potentials of opposite polarity, possibly reinforced by a magnetic field.

5) A method according to any one of claims 4 there characterized in that the member 7 is degreased beforehand and it is given some wear.

6) Method according to any one of claims from I to 5 characterized in that several filler materials (M) are deposited simultaneously or successively, superimposed or not.

7) Method according to any one of claims I to 7, characterized in that one performs a point deposition, or filiform, or surface: continuous or discontinuous.

8) Method according to any one of claims from I to 7, characterized in that deposits are made on sensitive and fragile substrates including: glass, wood, semiconductors (NP doping), minerals , ceramics, superconductors, composites, carbon fibers, Kevlar.

9) Method according to any one of claims 8, characterized in that one uses rotary tools metallic or not, but electrically conductive (metal brushes, thin steel discs, cylinders)

I0) Apparatus for depositing filler material in the form of stationary or portable machines which may have flexible transmissions: manual or fully or partially automated assemblies.

II) Apparatus for depositing a solid filler material (M) originally in the form of a part (I) consisting of particles of at least one metal, alloy, metalloid, on a solid substrate for the implementation of the method, according to one of claims I to I0, characterized in that it comprises: a) means (8) supporting the part (I) of filler material b) means (9) supporting the substrate (2); c) a movable metallic transfer member (7) for the filler material (M); d) means (I0) for driving the organ in movement

transfer (7); e) means (II) associated with the support means (8) of the

piece (I) of filler material and to the transfer member (7) for frictionally applying the piece (I) of filler material to the transfer member (7) under conditions of reciprocal pressure, temperature , relative speed capable of causing a thermal shock of the filler material (M) allowing the transfer member (7) to take particles of filler material (M) from the part (I); f) means (I2) associated with the support means (9) of the substrate (2) and the transfer member (7) for applying the transfer member (7) to the substrate (2) under pressure conditions reciprocal, temperature capable of allowing the deposition of particles of filler material (M) located on the transfer member (7) in motion on the substrate. and, where appropriate, g) means (I3) for relative displacement of the transfer member (7) and of the substrate (2) along a certain path corresponding to the shape of the deposit (3) of material d 'contribution (M) to be made, with a relative speed corresponding to the desired thickness of the deposit (3).

I2 Apparatus according to claim II, characterized in that the transfer member (7) is movable in rotation or in

translation. I3) Apparatus according to any one of claims II, I2, characterized in that the transfer member (7) is rotatable such as a brush or a disc or an endless band.

I4) Apparatus according to any one of claims II to I3, characterized in that the transfer member (7) is narrow or axially extended.

I5) Apparatus according to any one of claims II to I4, characterized in that it comprises heating means acting on the part (I) and / or cooling means acting on the substrate (2).

I6) Apparatus according to any one of claims II to I5, characterized in that it comprises means for creating a magnetic field.

I7) Apparatus according to any one of claims II to I6, characterized in that it comprises an electric source, of direct current, suitably connected to the part (I) and the substrate (2).

I8) Apparatus according to any one of claims II to I7, characterized in that it has several fixings of different metals, these different metals being in friction on the same transfer member (7) in order to obtain alloys.