JPH0219481A - Mechanical plating method - Google Patents
Mechanical plating methodInfo
- Publication number
- JPH0219481A JPH0219481A JP16677388A JP16677388A JPH0219481A JP H0219481 A JPH0219481 A JP H0219481A JP 16677388 A JP16677388 A JP 16677388A JP 16677388 A JP16677388 A JP 16677388A JP H0219481 A JPH0219481 A JP H0219481A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- brush
- metal
- plating
- metal brush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims description 28
- 239000002184 metal Substances 0.000 claims abstract description 71
- 229910052751 metal Inorganic materials 0.000 claims abstract description 71
- 239000000463 material Substances 0.000 claims abstract description 56
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 17
- 239000000956 alloy Substances 0.000 claims abstract description 17
- 238000009826 distribution Methods 0.000 description 7
- 238000000137 annealing Methods 0.000 description 4
- 238000005097 cold rolling Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910000601 superalloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、被メッキ材料の表面に機械的にメッキを施
すメカニカルメッキ方法に関するものであり、とくにメ
ッキ層の厚さを、メッキ領域の全体にわたって十分均一
ならしめるものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a mechanical plating method for mechanically plating the surface of a material to be plated. This ensures sufficient uniformity over the entire area.
表面処理技術の一種としての金属メッキは、材料２部品
などに耐食性、耐摩耗性、耐熱性などを付与する目的の
下で従来から広く行われており、その方法としては、電
気メッキ、化学メッキ、溶融メッキ、溶射メッキなどが
一般的である。Metal plating as a type of surface treatment technology has been widely used for the purpose of imparting corrosion resistance, wear resistance, heat resistance, etc. to two material parts, etc., and the methods include electroplating, chemical plating, etc. , hot-dip plating, thermal spray plating, etc. are common.
ここで、電気メッキは、金属を溶かしたメッキ液中に、
被メッキ材料を陰極として配置し、この被メッキ材料と
、それに対向させて配置した陽極との間に直流電流を流
すことによって、被メッキ材料の表面にメッキ層を形成
する方法であり、化学メッキは、ガラス、合成樹脂など
の非湛電物質である被メッキ材料の表面に、電解によら
ずメッキ層を形成する方法である。Here, in electroplating, metal is dissolved in a plating solution.
This is a method of forming a plating layer on the surface of the material to be plated by placing the material to be plated as a cathode and passing a direct current between the material to be plated and an anode placed opposite it. is a method of forming a plating layer on the surface of a non-electrostatic material such as glass or synthetic resin without electrolysis.
溶融メッキは、溶融金属中に被メッキ材料を浸漬してメ
ッキ層を形成する方法であり、溶射メッキは、アークも
しくは火炎によって溶融した金属を、高圧のガスによっ
て被メッキ材料に吹き付けてメッキ層を形成する方法で
ある。Hot-dip plating is a method of forming a plating layer by immersing the material to be plated in molten metal, and thermal spray plating is a method of forming a plating layer by spraying molten metal by arc or flame onto the material to be plated using high-pressure gas. This is a method of forming.
ところが、かかる従来技術にあっては、それらのいずれ
の方法によっても、メッキ層と被メッキ材料との固着強
度を十分高めることができないという問題があった他、
メッキ装置が高価であるという問題があり、さらには後
処理その他によって発生する廃液の処理が必要になると
いう問題があった。However, none of these conventional techniques has the problem of not being able to sufficiently increase the adhesion strength between the plating layer and the material to be plated.
There is a problem in that the plating equipment is expensive, and there is also a problem in that it is necessary to treat waste liquid generated from post-processing and other processes.
しかも、電気メッキでは、合金のメッキが困難であり、
化学メッキではメッキ層を厚くできないことに加え、値
段の高い薬剤の使用が必要となり、また、溶融メッキで
は、メッキ層の厚さの調整が難しく、さらに、溶射メッ
キではメッキ層が多孔質になり易い他、金属粒子が酸化
されるという、各方法に固有の問題があった。Moreover, it is difficult to plate alloys with electroplating,
In addition to not being able to thicken the plating layer with chemical plating, it requires the use of expensive chemicals; with hot-dip plating, it is difficult to adjust the thickness of the plating layer; and with thermal spray plating, the plating layer becomes porous. In addition to being easy to use, each method had its own problems in that the metal particles were oxidized.
そこで、出願人は、従来技術のこれらの問題点の解決手
段としてのメカニカルメッキ法を、特開昭６２−２６７
４８０号（特願昭６１−１０７７６４号）として先に提
案した。Therefore, the applicant proposed a mechanical plating method as a means of solving these problems of the prior art in Japanese Patent Laid-Open No. 62-267.
It was previously proposed as No. 480 (Japanese Patent Application No. 107764/1983).
このメカニカルメッキ方法は、金属ブラシと被メッキ材
料とを摩擦接触させて、金属ブラシの純金属または合金
を、被メッキ材料の表面に機械的にメ・２キする方法で
あり、この方法によれば、上述した従来技術の問題点の
それぞれを極めて有利に解決することができる。This mechanical plating method is a method in which the pure metal or alloy of the metal brush is mechanically plated onto the surface of the material to be plated by bringing the metal brush into frictional contact with the material to be plated. For example, each of the problems of the prior art described above can be solved very advantageously.
しかしながら、このようなメカニカルメッキ方法を大気
中で実施した場合には、金属ブラシの純金属または合金
が、被メッキ材料に摩擦接触して加熱されることにより
、金属ブラシの、被メッキ材料との接触表面の酸化に起
因するメッキ層厚さの不均一化が生じるという問題があ
った。However, when such a mechanical plating method is carried out in the atmosphere, the pure metal or alloy of the metal brush comes into frictional contact with the material to be plated and is heated, causing the contact between the metal brush and the material to be plated. There is a problem in that the thickness of the plating layer becomes non-uniform due to oxidation of the contact surface.
この発明は、メカニカルメッキ方法のかかる問題点を解
決することを目的とし、メッキ領域全体にわたって、メ
ッキ層の厚さを十分均一ならしめることができる、新規
なメカニカルメッキ方法を提供するものである。The present invention aims to solve these problems with mechanical plating methods, and provides a novel mechanical plating method that can make the thickness of the plating layer sufficiently uniform over the entire plating area.
この発明にかかるメカニカルメッキ方法は、純金属もし
くは合金をブラシ状に形成して金属ブラシとし、この金
属ブラシと被メッキ材料とを相対運動させて、それらを
摩擦接触させることにより、被メッキ材料の表面を活性
化させるとともに、金属ブラシの純金属もしくは合金を
その被メッキ材料の表面に機械的にメッキするメカニカ
ルメッキ方法において、
前記金属ブラシの被メッキ材料との接触表面の酸化物を
除去しながらメッキを行うことを特徴とするものである
。The mechanical plating method according to the present invention involves forming a pure metal or an alloy into a brush shape to form a metal brush, and moving the metal brush and the material to be plated relative to each other to bring them into frictional contact. In a mechanical plating method in which the surface of the metal brush is activated and the pure metal or alloy of the metal brush is mechanically plated on the surface of the material to be plated, oxides on the surface of the metal brush in contact with the material to be plated are removed. It is characterized by plating.
これを具体的に説明すると、純金属もしくは合金をブラ
シ状に形成して金属ブラシとし、この金属ブラシと被メ
ッキ材料とを、大気中、非酸化性ガス中、真空中の何れ
か１つの雰囲気中で、−２０℃〜３００℃の温度範囲に
おいて、相対運動させて、それらを摩擦接触させること
により、メッキ材料の表面を活性化させるとともに、金
属ブラシの純金属または合金を被メッキ材料の表面に機
械的にメッキする際に、金属ブラシの被メッキ材料との
接触表面の酸化物を、砥石、切削工具などによって除去
しながらメッキを行うものである。To explain this specifically, a metal brush is formed by forming a pure metal or an alloy into a brush shape, and the metal brush and the material to be plated are placed in one of the following atmospheres: air, non-oxidizing gas, or vacuum. In the temperature range of -20℃ to 300℃, the surface of the plating material is activated by making them move relative to each other and bringing them into frictional contact, and the pure metal or alloy of the metal brush is transferred to the surface of the material to be plated. When mechanically plating a metal brush, plating is performed while removing oxides on the surface of the metal brush that comes in contact with the material to be plated using a grindstone, cutting tool, etc.
この発明方法をさらに具体的に説明すると、Ｚｎ。To explain this invention method more specifically, Zn.
Ｎｉ、 ＡＩ、 Ｃｕ、 Ｔｉおよびそれらの合金、ス
テンレス鋼、超合金などの純金属あるいは合金よりなる
ワイヤ、リボン、テープなどをブラシ状にし、金属ブラ
シと被メッキ材料を大気中もしくは非酸化性ガス中ある
いは真空中で、−２０℃〜３００°Ｃの温度範囲におい
て、金属ブラシの回転・走行あるいは、金属ブラシの回
転と被メッキ材料の走行もしくは、金属ブラシの回転走
行と被メッキ材料の走行の同時作業により、金属ブラシ
と被メッキ材料を摩擦接触させ、被メッキ材料表面を活
性化し、金属ブラシの純金属または合金を被メッキ材料
表面に、機械的にメッキするメカニカルメッキ方法であ
る。Wires, ribbons, tapes, etc. made of pure metals or alloys such as Ni, AI, Cu, Ti and their alloys, stainless steel, superalloys, etc. are shaped into brushes, and the metal brushes and the material to be plated are exposed to air or non-oxidizing gas. The rotation and running of the metal brush, the rotation of the metal brush and the running of the material to be plated, or the rotation and running of the metal brush and the running of the material to be plated, in a temperature range of -20°C to 300°C inside or in a vacuum. This is a mechanical plating method in which the metal brush and the material to be plated are brought into frictional contact with each other through simultaneous operations, the surface of the material to be plated is activated, and the pure metal or alloy of the metal brush is mechanically plated onto the surface of the material to be plated.
さらに本発明は、前記メカニカルメッキを施した後に５
％以上の冷間圧延を施したり、この５％以上の冷間圧延
を施す処理の後、さらに１００〜１２００℃の温度範囲
で焼なましを施したり、また単に １００〜１２００℃
の温度範囲で焼なましを施したり、−旦１００〜１２０
０℃の温度範囲で焼なましを施したのちに５％以上の冷
間圧延を施したりすることもできるメカニカルメッキ方
法に関するものである。Further, in the present invention, after applying the mechanical plating,
% or more of cold rolling, or after this 5% or more cold rolling treatment, further annealing is performed at a temperature range of 100 to 1200°C, or simply annealing at a temperature of 100 to 1200°C
Annealing in the temperature range of -100 to 120 degrees
The present invention relates to a mechanical plating method in which cold rolling of 5% or more can be performed after annealing in a temperature range of 0°C.
この方法では、金属ブラシ、すなわち、それを構成する
純金属もしくは合金の、酸化されていない清浄な表面を
、被メッキ材料に摩擦接触させることができるので、そ
れらの両者を大気中で摩擦接触させる場合であっても、
被メッキ材料の表面に層厚の均一なメッキを施すことが
可能となる。In this method, the clean, unoxidized surface of the metal brush, i.e., the pure metal or alloy that constitutes it, can be brought into frictional contact with the material to be plated, so that both of them are brought into frictional contact in the atmosphere. Even if
It becomes possible to plate the surface of the material to be plated with a uniform layer thickness.
以下にこの発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described below based on the drawings.
第１図は、この発明の一実施例を示す路線側面図であり
、図中１は金属ブラシを、２は研削砥石を、そして３は
プレート状の被メッキ材料をそれぞれ示す。FIG. 1 is a side view showing one embodiment of the present invention, in which 1 indicates a metal brush, 2 a grinding wheel, and 3 a plate-shaped material to be plated.
ここで、この例の金属ブラシ１は、Ｚｎ、 Ｎｉ、 Ａ
Ｉ。Here, the metal brush 1 in this example is made of Zn, Ni, A
I.
Ｃｕ、 Ｔｉもしくはこれらのいずれかの合金、ステン
レス鋼、超合金、はんだなどの純金属または合金からな
るワイヤを、第２図に斜視図で示すようにローラ状に形
成したものである。A wire made of pure metal or alloy such as Cu, Ti, or an alloy of these, stainless steel, superalloy, or solder is formed into a roller shape as shown in a perspective view in FIG.
なお、研削砥石２は、金属ブラシ表面、ひいてはブラシ
ｌを構成する各ワイヤ先端面の酸化物を十分に除去し得
る限りにおいて、適宜のものを選択することができ、被
メッキ材料３としては、メッキ処理に必要な各種の材料
、例えば、ステンレス鋼、Ｎｉ合金鋼、普通鋼などを用
いることができる。Note that the grinding wheel 2 can be appropriately selected as long as it can sufficiently remove the oxides on the surface of the metal brush and, ultimately, on the tip surface of each wire constituting the brush 1, and as the material 3 to be plated, Various materials necessary for plating treatment, such as stainless steel, Ni alloy steel, and ordinary steel, can be used.
この例でのメッキ層の形成は、被メッキ材料３の表面に
、所定の圧力で押圧した金属ブラシ１を、図示しない駆
動手段によって、図では時計回りに、例えば周速約２０
００ ｍ／ｍｉｎで高速回転させるとともに、その被メ
ッキ材料３を、図の右方へ水平移動させることによって
、金属ブラシ１と被メッキ材料３との摩擦接触をもたら
し、そして、被メッキ材料３から離間した金属ブラシｌ
の表面を、その金属ブラシｌと同方向へ高速回転される
研削砥石２によって研削して、金属ブラシ１の、その後
に被メッキ材料３と接触する表面部分から酸化物を完全
に除去することにより行われ、この結果として、被メッ
キ材料３の表面には、金属ブラシ１の構成材料からなる
均一厚さのメッキ層４が形成されることになる。The formation of the plating layer in this example is performed by moving the metal brush 1 pressed against the surface of the material 3 to be plated at a predetermined pressure clockwise in the figure by a driving means (not shown) at a circumferential speed of about 20, for example.
By rotating at a high speed of 00 m/min and horizontally moving the material 3 to be plated to the right in the figure, frictional contact is brought about between the metal brush 1 and the material 3 to be plated, and the material 3 is removed from the material 3 to be plated. spaced metal brushes
By grinding the surface of the metal brush 1 with a grinding wheel 2 that rotates at high speed in the same direction as the metal brush 1, oxides are completely removed from the surface portion of the metal brush 1 that will subsequently come into contact with the material to be plated 3. As a result, a plating layer 4 of uniform thickness made of the constituent material of the metal brush 1 is formed on the surface of the material 3 to be plated.
第３図は、他の実施例を示す路線側面図であり、この例
は、金属ブラシ１の表面を、ヘッドプーリ及びテールプ
ーリに掛は渡されて水平に走行する研削ベル１−１２に
よって研削することとし、そして、被メッキ材料１３を
、パイプ状もしくは柱状部材としたものである。FIG. 3 is a side view of a route showing another embodiment, in which the surface of a metal brush 1 is ground by a grinding bell 1-12 that is passed through a head pulley and a tail pulley and runs horizontally. In this case, the material to be plated 13 is a pipe-shaped or columnar member.
この例では、金属ブラシ１及び被メッキ材料１３を、と
もに時計回り回転させ、そして研削ヘルド１２の、金属
ブラシｌとの接触部を図の左方向へ走行させることによ
り、前述の例と同様、被メッキ材料１３の表面に、所期
した通りの厚さを有するメッキ層４が、全体的に均一に
形成されることになる。In this example, the metal brush 1 and the material to be plated 13 are both rotated clockwise, and the contact portion of the grinding heald 12 with the metal brush 1 is moved to the left in the figure, as in the previous example. The plating layer 4 having the desired thickness is uniformly formed on the surface of the material 13 to be plated.
以下に、この発明方法によるメッキ層４の厚さ分布と、
金属ブラシ１の酸化物を除去しない場合の、メッキ層の
厚さ分布との比較例について述べる。Below, the thickness distribution of the plating layer 4 according to the method of this invention,
A comparative example of the thickness distribution of the plating layer when the oxide of the metal brush 1 is not removed will be described.
〔比較例１〕 直径０．２φの銅線を多数植設した、外径２５０φ。[Comparative example 1] Outer diameter 250φ with many 0.2φ diameter copper wires.
長さ１００鶴のローラ状の金属ブラシを２５００ｒｐｍ
で回転させ、この金属ブラシを厚さがｌ、０＊ｎ、幅が
１００龍で、２ｍ／ｍｉｎの速度で移動するＳＯ５３０
４の帯板上へ押圧してメッキした場合の、板幅方向への
メッキ層厚さの分布は第４図に示す通りとなった。A roller-shaped metal brush with a length of 100 cranes at 2500 rpm.
This metal brush is rotated by SO530 with a thickness of l, 0*n, a width of 100 mm, and moves at a speed of 2 m/min.
When plated by pressing onto the strip plate No. 4, the distribution of the plating layer thickness in the width direction of the plate was as shown in FIG.
なお、図中黒丸は、金属ブラシを、第１図に示すように
して研削砥石に接触させた発明方法による結果を示し、
白丸は、金属ブラシを砥石に接触させない場合の結果を
示す。In addition, the black circles in the figure indicate the results obtained by the invented method in which the metal brush was brought into contact with the grinding wheel as shown in FIG.
The white circles show the results when the metal brush was not brought into contact with the grindstone.
〔比較例２〕 直径０．３φのＡ１線を多数植設した、外径３００φ。[Comparative example 2] Outer diameter 300φ with many A1 wires with a diameter of 0.3φ.
長さ５００鶴のローラ状の金属ブラシを２００Ｏｒｐｍ
で回転させ、この金属ブラシを外径が５０φ、長さが５
００ＭＭ、肉厚が１．０鰭で０．５ ｍ／ｗｉｎの周速
で回転するＳＵＳ ４３０のパイプ上へ押圧してメッキ
した場合の、パイプの長平方向のメッキ層厚さの分布は
第５図に示す通りとなった。A roller-shaped metal brush with a length of 500 mm and a rotation speed of 200 rpm.
Rotate this metal brush with an outer diameter of 50φ and a length of 5mm.
When plated by pressing onto a SUS 430 pipe with a thickness of 1.0 mm and a wall thickness of 1.0 m/win rotating at a circumferential speed of 0.5 m/win, the distribution of the plating layer thickness in the longitudinal direction of the pipe is 5th. The result is as shown in the figure.
図中黒丸は、金属ブラシを、第３図に示すように、研削
ベルトによって研削した場合の厚さ分布を示し、白丸は
、研削しない場合の厚さ分布を示す。In the figure, black circles indicate the thickness distribution when the metal brush is ground by a grinding belt as shown in FIG. 3, and white circles indicate the thickness distribution when the metal brush is not ground.
第４．５図に示すところからも明らかなように、この発
明によれば、特に金属ブラシの、被メッキ材料との接触
表面の酸化物を、砥石、切削工具などによって除去しな
がら機械的にメッキを施すことにより、金属ブラシの長
さの全体にわたって、ひいては、メッキ領域の全体にわ
たってメッキ層の厚さを十分均一ならしめることができ
る。As is clear from FIG. 4.5, according to the present invention, the oxides on the surface of the metal brush that comes into contact with the material to be plated are mechanically removed while being removed using a grindstone, a cutting tool, etc. By plating, the thickness of the plating layer can be made sufficiently uniform over the entire length of the metal brush, and thus over the entire plating area.
第１図は、この発明の一実施例を示す路線側面図、
第２図は、金属ブラシを例示する斜視図、第３図は、こ
の発明の他の実施例を示す路線側面図、
第４，５図はそれぞれ、本発明方法と、出願人の先の提
案技術とについての、メッキ層の厚さ分布の比較結果を
示すグラフである。
１・・・金属ブラシ、 ２・・・研削砥石、３．１３・
・・被メッキ材料、
１２・・・研削ベルト。
４・・・メッキ層、
特許出願人 日本冶金工業株式会社
代理人 弁理士 小 川 順 三
同 弁理士 中 村 盛 夫
第１図
第４図
第３図
第５図
パイプエツジからの距離（ｗ）1 is a side view of a route showing one embodiment of the present invention; FIG. 2 is a perspective view illustrating a metal brush; FIG. 3 is a side view of a route showing another embodiment of the present invention; , 5 are graphs showing comparison results of the thickness distribution of the plating layer between the method of the present invention and the technique previously proposed by the applicant. 1... Metal brush, 2... Grinding wheel, 3.13.
...Material to be plated, 12...Grinding belt. 4... Plating layer, Patent applicant Nippon Yakin Kogyo Co., Ltd. Agent Patent attorney Jun Ogawa Patent attorney Morio Nakamura Figure 1 Figure 4 Figure 3 Figure 5 Distance from pipe edge (w)
Claims (1)
シとし、この金属ブラシと被メッキ材料とを相対運動さ
せて、それらを摩擦接触させることにより、被メッキ材
料の表面を活性化させるとともに、金属ブラシの純金属
もしくは合金をその被メッキ材料の表面に機械的にメッ
キするメカニカルメッキ方法において、 前記金属ブラシの被メッキ材料との接触表面の酸化物を
除去しながらメッキを行うことを特徴とするメカニカル
メッキ方法。[Claims] 1. A metal brush is formed by forming a pure metal or an alloy into a brush shape, and the metal brush and the material to be plated are moved relative to each other to bring them into frictional contact, thereby improving the surface of the material to be plated. In a mechanical plating method in which pure metal or alloy of a metal brush is mechanically plated on the surface of the material to be plated, plating is performed while removing oxides on the surface of the metal brush in contact with the material to be plated. A mechanical plating method characterized by performing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16677388A JPH0219481A (en) | 1988-07-06 | 1988-07-06 | Mechanical plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16677388A JPH0219481A (en) | 1988-07-06 | 1988-07-06 | Mechanical plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0219481A true JPH0219481A (en) | 1990-01-23 |
| JPH0563554B2 JPH0563554B2 (en) | 1993-09-10 |
Family
ID=15837421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16677388A Granted JPH0219481A (en) | 1988-07-06 | 1988-07-06 | Mechanical plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0219481A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5087930A (en) * | 1973-12-10 | 1975-07-15 | ||
| JPS62267480A (en) * | 1986-05-13 | 1987-11-20 | Nippon Yakin Kogyo Co Ltd | Mechanical plating method |
-
1988
- 1988-07-06 JP JP16677388A patent/JPH0219481A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5087930A (en) * | 1973-12-10 | 1975-07-15 | ||
| JPS62267480A (en) * | 1986-05-13 | 1987-11-20 | Nippon Yakin Kogyo Co Ltd | Mechanical plating method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563554B2 (en) | 1993-09-10 |
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