JPH0475318B2 - - Google Patents

Description

[Detailed description of the invention]

[Industrial Field of Application] The present invention relates to a method for manufacturing metal-plated plates and shapes in which no blistering occurs on the metal-plated surfaces. [Prior Art] Conventionally, metal-plated plates and strips (hereinafter these are collectively referred to as metal-plated plates and will be explained with reference to plates) are first hot-rolled into metal ingots of predetermined dimensions. This process is applied to obtain a plate material of a predetermined thickness, which is then subjected to surface cutting, followed by annealing and pickling.
Forming a plate material of a predetermined thickness by cold rolling, which consists of performing one cycle of oil rolling one or more times depending on the hardness required for the final plate material,
Subsequently, either continuously or after a predetermined period of time has elapsed, the oil adhering to the surface of the plate material during the oil rolling is removed by degreasing treatment, then etching treatment is performed, and finally metal plating is applied. It is manufactured by [Problems to be solved by the invention] However, in the metal-plated plate material manufactured by this conventional manufacturing method, when it is heated for wire bonding or die bonding in the manufacturing process of semiconductor devices, for example, , the occurrence of blistering on the metal plated surface was significant, and there was a strong desire to improve this problem. [Means for Solving the Problems] Therefore, from the above-mentioned viewpoint, the present inventors have solved the problem.
As a result of conducting research to obtain a metal-plated sheet material with no blistering on the metal-plated surface, we found that (a) the cause of blistering in metal-plated sheets is metal oxidation formed on the surface of the material during annealing. Pickling is performed to remove the material film, but
In this case, a compound (hereinafter referred to as a pickling compound) is formed on the surface of the material after pickling due to the chemical reaction between the pickling solution, the metal oxide, and the material metal, and the presence of this pickling compound What's in it. In other words, if oil rolling is performed with the pickling compound present on the material surface, the oil-containing pickling compound will firmly adhere to the material surface after oil rolling, and this oil-containing pickling compound will adhere firmly to the material surface after oil rolling. Pickling compounds containing Since plating will be applied, blistering will occur due to the pickling compound. On the other hand, it may be possible to perform a strong etching treatment to completely remove the oil-containing pickling compound, but if such a strong etching treatment is applied, the surface of the board will become extremely rough, and it will not be smooth. This is undesirable because a metal-plated surface cannot be obtained. (b) Therefore, the surface of the material after annealing and pickling in the cold rolling process is subjected to mechanical polishing such as polishing with a normal rotating brush, milling, lathe grinding, and saper polishing, If the pickling compounds formed by pickling were completely removed, metal-plated plates would not develop blisters, but in reality, metal blisters are caused by minute metal powder generated during mechanical polishing. Blisters begin to appear on the board. In other words, this metal powder tends to adhere to the surface of the material, and if oil rolling is performed with metal powder attached to the surface of the material, metal coated with oil will appear on the surface of the sheet material after oil rolling. The metal powder from the oil coating cannot be completely removed by normal degreasing and etching processes, so the metal plating remains on the surface of the plate, so the remaining oil from the previous stage is removed. Blistering occurs in metal-plated plate materials due to metal powder in the coating. (c) However, the material after mechanical polishing is subjected to rolling without the use of rolling oil, that is, dry rolling, to integrally press and bond the fine metal powder adhering to the surface generated during mechanical polishing to the surface of the material. The plate material in this state is rolled with oil,
After degreasing and etching,
This result can be obtained by metal plating or, if the desired hardness is obtained by the dry rolling, by subsequent light degreasing and etching treatment, and by metal plating. There shall be no blistering on the plated metal plate materials. (d) Items (a) to (c) above apply not only to plates but also to shapes, bars, or wires with circular, square, rectangular, or irregular cross-sectional shapes (these are collectively referred to as The same applies to shapes (referred to as shapes). The findings shown in sections (a) to (d) above were obtained. The present invention has been made based on the above knowledge, and consists of forming a plate or shape by a normal rolling process and then applying a normal metal plating to the metal-plated plate and shape. In the manufacturing method of the material, at least the final step in the cold rolling process,
Either the process consists of annealing - pickling - mechanical polishing - dry rolling - oil rolling, or if the specified hardness can be obtained by dry rolling, annealing - without oil rolling.
The process consists of pickling, mechanical polishing, and dry rolling, thereby eliminating the occurrence of any blistering on the metal-plated surface of metal-plated plates or shapes. . [Example] Next, the method of the present invention will be specifically explained with reference to Examples. First, each material is shown in Table 1,
An ingot with dimensions of thickness: 160 mm x width: 370 mm x thickness: 1400 mm is subjected to normal hot rolling and cold rolling to form a plate material with plate thickness: 1 mm x width: 370 mm. Methods 1 to 6 of the present invention and conventional methods 1 to 6 were carried out by setting the final process conditions in the cold rolling process applied to this plate material to the conditions shown in Table 1. . In addition, in the annealing process in Table 1, the annealing time of 1 hour or more is when a batch type bright annealing furnace is used.

〔Effect of the invention〕

The plate materials with a thickness of 0.5 mm manufactured by the above-mentioned methods 1 to 6 of the present invention and conventional methods 1 to 6 were plated with metal to a layer thickness of 2 μm as shown in Table 1, and the resulting When the metal-plated plate materials were heated under the conditions shown in Table 1 and the occurrence of blisters in the plate materials after heating was observed, no blisters occurred in the metal-plated plate materials prepared by methods 1 to 6 of the present invention. On the other hand, many blisters occurred in the metal-plated plates prepared by conventional methods 1 to 6, and they could not be used. As described above, according to the method of the present invention, metal-plated plates and shapes can be produced with simple operations and at low cost, and are completely free from blistering. It exhibits excellent performance when used in the manufacture of electronic components for electronics such as devices.

Claims (1)

[Claims] 1. A metal ingot is hot-rolled and cold-rolled into a plate or a shape, and then the plate or shape is subjected to degreasing and etching treatment,
In a method for manufacturing a metal-plated plate material or shape by a basic process consisting of finally applying metal plating, the pickling process is performed after annealing and pickling in at least the final step of the cold rolling process. mechanical polishing to completely remove the pickling compound formed on the surface of the material; and dry rolling to integrally bond the metal powder adhering to the surface generated by the mechanical polishing to the surface of the material. A method for manufacturing metal-plated plates and shapes, characterized in that the occurrence of blistering on the metal-plated surface of the metal-plated plates or shapes is completely eliminated by performing the following steps.