JPH05145220A - Conductor film and manufacture thereof - Google Patents

Abstract

PURPOSE:To prevent a conductor film formed on a substrate from coming off by forming the cross section of the conductor film into an angle shape with wide base. CONSTITUTION:An insulating layer 2 is thermally sprayed onto a substrate 1 so that an insulating substrate 10 is formed, and a mask 4 is arranged in front of this insulating substrate 10 with a gap of 0.2-1.5mm between. Then, when a conductor is sprayed by a thermally spraying gun from the front of this mask 4, a conductor layer 3 is formed on the insulating layer 2. As the substrate 1, metal substrates of Al, Fe, Cu, etc., and ceramic substrates of Al2O3, SiO2, etc., are used and ceramics such as Al2O3 and SiO2 are used as the insulating layer 2. Further, Ni-Cr, Fe-Cr, Ni-Al, etc., are used as the conductor layer 3. The cross section of the conductor layer 3 formed in this manner is shaped into an angle with wide base on the side, where the conductor layer comes into close contact with the insulating layer 2, and the contact area between the two layers is large so that a high bond strength can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductor film used as a heater for heating, a hair dryer, a hair curler, etc., and also used for wiring and a method for producing the conductor film.

[0002]

2. Description of the Related Art As this type, a conductor film and a method for manufacturing the same, a technique described in, for example, Japanese Patent Application Laid-Open No. 1-117287 is known. According to this conventional technique, as shown in FIG. The insulating film 22 is formed on the surface of the body 21, then the mask 24 is arranged so as to be in close contact with the insulating film 22, and the conductor film 23 is formed from the front surface of the mask 24 by the spray gun 25.

[0003]

However, according to the above-mentioned conventional technique, when the mask 24 is in close contact with the surface of the insulating substrate 26, as shown in FIG. When thermal spraying is performed, the conductor film 23 is formed along the inner wall of the mask hole, so that the conductor film 23 has a rectangular cross section and a contact area with the insulating film 22 as shown in FIG. 4B. Therefore, there is a problem that the adhesive strength is low and peeling is easy. Further, according to the conventional technique, when the mask 24 is removed after the thermal spraying work, the mask 2
There was a problem that the conductor adhered to the wall surface of No. 4 and was easily separated from the insulating film 22. The present invention has been made to solve such a problem, and an object thereof is to provide a conductor film and a method for manufacturing the conductor film, which can prevent the conductor film formed on a substrate from peeling off. Especially.

[0004]

In order to achieve the above-mentioned object, the present invention is characterized in that, as a first constitution, the cross section of a conductor film formed on a substrate is a mountain with a wide skirt. .. A second configuration is characterized in that when a conductor film is formed on a substrate by thermal spraying, a mask is arranged on the front surface of the substrate and a gap is provided between the mask and the substrate to perform thermal spraying.

[0005]

According to the present invention, since the cross section of the conductor film has a mountain shape with a wide skirt due to the first structure, the contact area on the substrate side is large, and therefore the adhesion strength is also high and peeling is easy. There is an advantage that there is no. Further, according to the second configuration, when the conductive film is formed on the substrate by thermal spraying,
Since an appropriate gap is provided between the mask and the substrate for thermal spraying, the sprayed conductor material spreads to the substrate side, and the conductor film thus formed has a skirt on the side close to the substrate. It becomes a wide Yamagata. Therefore, the contact area on the substrate side is increased, the adhesion strength is high, there is no risk of peeling, and there is no risk of the conductor adhering to the wall surface of the mask.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings. In this embodiment, the term "conductor film" is used as a concept including a resistance film used for a heater or the like. FIG. 1 shows a state in which a conductor pattern is formed on the insulating substrate 10 by thermal spraying. That is, the insulating layer 2 is sprayed on the substrate 1 to form the insulating substrate 10, and the insulating substrate 10 is formed.
The mask 4 is arranged on the front surface of the above with a gap of 0.2 to 1.5 mm. Then, when a conductor is sprayed from the front surface of the mask 4 by a spray gun, the conductor layer 3 is formed on the insulating layer 2.

As the substrate 1, a metal substrate of Al, Fe, Cu or the like or a ceramic substrate of Al ₂ O ₃ or SiO ₂ is used, and as the insulating layer 2, Al ₂ O ₃ or SiO _{2 is used.} Etc. ceramics are used. Furthermore, the conductor layer 3
For example, Ni-Cr, Fe-Cr, Ni-Al, or the like is used. The conductor layer 3 formed in this manner has a cross section in a mountain shape with a wide skirt on the side in close contact with the insulating layer 2 and a large contact area with the insulating layer 2, so that a strong adhesion strength can be obtained.

2A to 2F show specific manufacturing steps of the conductor layer 3. As shown in FIG. That is, as shown in FIG. 2B, the insulating layer 2 is sprayed on the surface of the metal substrate 1 as shown in FIG. 2A to form the insulating substrate 10. If the substrate 1 is a ceramic substrate, the thermal spraying of the insulating layer 2 is not always necessary. This is because the substrate itself has an insulating property.

Next, as shown in FIG. 2C, the insulating substrate 10
The mask 4 is set on the front surface of the through the spacer 5. At this time, the spacer 5 preferably has a thickness of about 0.2 to 1.5 mm. Next, as shown in FIG. 2D, a conductor is sprayed from the front surface of the mask 4 toward the substrate 1 using a spray gun.
In this case, since there is an appropriate gap between the insulating substrate 10 and the mask 4, the sprayed conductor spreads toward the insulating substrate 10 side, and as a result, the cross section of the formed conductor layer 3 has an insulating substrate. Yamagata has a wide skirt on the side close to 10.

For this reason, if the mask 4 is removed, as shown in FIG.
As shown in (e), the conductor layer 3 having a chevron cross section is formed on the insulating substrate 10. Moreover, at this time, since the conductor to be sprayed is not likely to adhere to the wall surface of the mask hole,
The conductor does not adhere to the wall surface of the mask 4, and therefore the mask 4
The conductor does not peel off from the insulating layer 2 even when it is removed. Since the conductor layer 3 thus formed has a large contact area, it has a high adhesion strength and a conductor pattern that is difficult to peel off is obtained. Further, as shown in FIG. 2F, if the insulating layer 6 is further sprayed and sealed on the formed conductor layer 3, more stable adhesion strength can be obtained.

In the above embodiments, the case where the conductor film is formed on one side of the substrate 1 has been described. In addition to this, for example, when the conductor film is formed on both front and back surfaces of the substrate 1, one side of the substrate 1 is described. After the conductor film is formed on the substrate 1, the above steps may be repeated, or the same treatment may be performed on both surfaces of the substrate 1 in each step.

[0012]

As described above, according to the present invention, a conductor film formed on a substrate has a cross section with a chevron shape having a wide skirt, so that a contact area is increased and a conductor film having high adhesion strength is obtained. You can Further, when the conductor film is formed on the substrate by thermal spraying, a mask is arranged on the front surface of the substrate, and a space is provided between the mask and the substrate to perform thermal spraying. The same effect is obtained, and since the conductor is not attached to the wall surface of the mask hole, the conductor layer is not peeled off even when the mask is removed after spraying the conductor.

[Brief description of drawings]

FIG. 1 is a diagram showing a state in which a conductor film is formed on a substrate.

2 (a) to (f) are diagrams showing a specific manufacturing process of a conductor film.

FIG. 3 is an external view showing a part of the conventional manufacturing process of the conductor film.

FIG. 4A is a diagram showing a conventional conductive film manufacturing process, and FIG. 4B is a diagram showing a cross section of the conductive film formed on a substrate.

[Explanation of symbols]

 1 ... Substrate 2, 6 ... Insulating layer 3 ... Conductor layer 4 ... Mask 5 ... Spacer 10 ... Insulating substrate

Claims (2)

[Claims] 1. A conductor film formed by forming a cross section of the conductor film formed on a substrate into a mountain shape having a wide skirt. 2. A method of manufacturing a conductor film, comprising the steps of: when a conductor film is formed on a substrate by thermal spraying, a mask is arranged on the front surface of the substrate, and a gap is provided between the mask and the substrate. ..