JP2000244100A - Flame spray circuit body and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a frame spray circuit body which is excellent in moldability and weight reduction of an insulating substrate itself, and eliminates a base material treatment process. SOLUTION: A masking plate 11 having an aperture part 11a whose form is identical to a specified circuit pattern is arranged on a polyamide based resin substrate 10. By spaying conductive material on the substrate 10 on which the masking plate 11 is arranged, a specified circuit part 15 is formed. From above the specified circuit part 15, insulating material is sprayed on the polyamide based resin substrate 10, and an insulating part is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thermal spray circuit for forming a circuit portion on an insulating substrate by thermal spraying of a conductive material, and a thermal spray circuit.

[0002]

2. Description of the Related Art In a conventional method for manufacturing a sprayed circuit body, a metal plate having a ceramic coating formed thereon as an insulating substrate,
A ceramic plate or a resin plate has been used. An insulating substrate using a metal plate or a ceramic plate on which a ceramic coating is formed has excellent adhesion of a thermal spray coating, but has problems in terms of moldability and weight reduction of the insulating substrate itself. Conversely, an insulating substrate using a resin plate is excellent in terms of moldability and weight reduction of the insulating substrate itself, but is mainly used for ABS (acrylonitrile-butadiene-styrene copolymer) and PP (polypropylene). With resin, the adhesion of the thermal spray coating is very poor.
Therefore, conventionally, it has been necessary to perform a base treatment in order to improve the adhesion of the thermal spray coating to the insulating substrate.

[0003] As a conventional method of manufacturing a sprayed circuit body to be subjected to a base treatment, Japanese Patent Application Laid-Open No. 3-59913 shown in FIGS.
Is disclosed in Japanese Patent Application Laid-Open Publication No. HEI 9-203 (1995). Briefly describing this manufacturing method, as shown in FIG. 6, a predetermined circuit pattern 2a is formed on an insulating substrate 1 by printing using an adhesive 2, and a metal powder is formed on the circuit pattern 2a of the adhesive 2. 7 and the like, and then the circuit pattern 2a of the adhesive 2 is cured. After performing such a base treatment, the conductive metal 5 is sprayed on the insulating substrate 1 using the spraying device 4 as shown in FIG. Then, the sprayed conductive metal 5 firmly adheres only to the circuit pattern 2 a of the adhesive 2, thereby forming a predetermined circuit portion 6. In addition, a base treatment may be performed by using a conductive paste instead of the adhesive 2 and a metal filler instead of the adhesion reinforcing agent 3.

[0004]

However, in the above-mentioned conventional method for manufacturing a thermal sprayed circuit body, a resin plate is used as the insulating substrate, so that the insulating substrate itself is excellent in moldability and weight reduction. It had to be troublesome.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a method of manufacturing a thermal sprayed circuit body, which is excellent in moldability and weight reduction of an insulating substrate itself and can reduce the number of steps of a base treatment, and It is an object to provide a thermal spray circuit body.

[0006]

According to the first aspect of the present invention, a mask having an opening having the same shape as a predetermined circuit pattern is formed on a polyamide resin substrate, and the masked polyamide resin substrate is electrically conductive. A predetermined circuit portion is formed by spraying a substance.

In this method of manufacturing a thermal spray circuit, a polyamide resin substrate is used as the insulating substrate, so that the insulating substrate itself is excellent in moldability and weight reduction, and the polyamide resin substrate is excellent in adhesion of the thermal spray coating. Therefore, by spraying a conductive material directly on the polyamide resin substrate, a circuit portion made of a conductive film can be formed.

According to a second aspect of the present invention, there is provided the method of manufacturing a thermal sprayed circuit body according to the first aspect, wherein after the predetermined circuit portion is formed, the polyamide resin substrate is placed on the predetermined circuit portion. The insulating portion is formed by spraying an insulating material.

According to the method for manufacturing a thermal spray circuit, a first aspect of the present invention is provided.
In addition to the effects of the invention, the polyamide resin substrate is excellent in the adhesion of the thermal spray coating, so that the insulating portion of the insulating coating can be formed by spraying an insulating material on the circuit portion of the conductive coating.

According to a third aspect of the present invention, there is provided the method for manufacturing a thermal spray circuit according to the second aspect, wherein the predetermined circuit portion is formed by spraying a conductive material, and the insulating portion is formed by spraying an insulating material. Is repeated at least twice on the same surface of the polyamide resin substrate to laminate a plurality of circuit portions.

According to this method of manufacturing a sprayed circuit body, claim 2 is provided.
In addition to the function of the invention of the first aspect, a laminated circuit can be formed by repeating the steps of forming the conductive film and the insulating film.

According to a fourth aspect of the present invention, a predetermined circuit portion is formed directly on a polyamide resin substrate by spraying a conductive material.

In this thermal spray circuit, since the polyamide resin substrate is used as the insulating substrate, the insulating substrate itself is excellent in moldability and weight reduction. In addition, since the polyamide resin substrate has excellent adhesion of the thermal spray coating, The undercoating process can be reduced.

According to a fifth aspect of the present invention, there is provided the thermal spray circuit according to the fourth aspect, wherein an insulating portion is formed by spraying an insulating material on the polyamide resin substrate from above the predetermined circuit portion. I do.

In this thermal spray circuit, in addition to the effect of the fourth aspect of the present invention, since the polyamide resin substrate has excellent adhesion of the thermal spray coating, insulation by thermal spraying of an insulating material from above the circuit portion by the conductive coating. A part can be formed.

According to a sixth aspect of the present invention, there is provided the thermal spray circuit according to the fifth aspect, wherein a plurality of layers each including the predetermined circuit portion formed by spraying a conductive material and the insulating portion formed by spraying an insulating material are stacked. It is characterized by the following.

In this thermal spray circuit, in addition to the function of the invention of claim 5, a plurality of layers composed of a circuit portion and an insulating portion of the conductive coating are laminated.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIG. 1A relates to an embodiment of the present invention.
FIG. 4 is a cross-sectional view showing a state in which a conductive material is being sprayed by the thermal spraying device 12; FIG. 4B is an enlarged cross-sectional view of the polyamide resin substrate 10; FIG. 2 is an enlarged cross-sectional view, FIG. 2 is a cross-sectional view showing a state in which an insulating material is sprayed by a spraying device 13, and FIG. FIG.

Referring to FIGS. 1 to 3, a polyamide resin substrate 10 is used as an insulating substrate when manufacturing a thermal spray circuit body.
A masking plate 11 having an opening 11a having the same shape as a predetermined circuit pattern is prepared. A thermal spraying device 12 for thermal spraying a conductive material such as a copper material as a thermal spraying device,
Thermal spraying device 1 for thermal spraying insulating materials such as resin and ceramic
3 are used.

Next, a method of manufacturing a thermal spray circuit will be described. As shown in FIG. 1 (A), a masking plate 11 is arranged on a polyamide resin substrate 10, and a conductive material is thermally sprayed by a thermal spraying device 12. Then, the molten metal particles 14 of the conductive substance are sprayed onto the polyamide resin substrate 10 from the openings 11 a of the masking plate 11.

Next, when the masking plate 11 is removed from the polyamide resin substrate 10, the sprayed molten metal particles 14 cause the thermal spray coating to be formed on the polyamide resin substrate 10.
The circuit part 1 of the first layer
5 is formed on the polyamide resin substrate 10.

Next, as shown in FIG. 2, an insulating material is sprayed on the entire surface of the polyamide resin substrate 10 on which the first circuit portion 15 is formed by a thermal spraying device 13. Then, the molten insulating particles 17 of the insulating material are sprayed on the polyamide resin substrate 10 including the upper surface of the circuit portion 15. The sprayed molten insulating particles 17 make the thermal spray coating adhere tightly to the polyamide resin substrate 10, and a first insulating portion 18 of the thermal spray coating is formed on the polyamide resin substrate 10.

When only one circuit portion 15 is formed, the first circuit portion 15 or the first circuit portion 15 and the first insulating portion 18 are formed on the polyamide resin substrate 10 as described above. However, when two or more circuit portions are formed, as shown in FIG. 3, two circuit portions are formed on the polyamide resin substrate 10 on which the first circuit portion 15 and the first insulating portion 18 are formed. A masking plate 19 for the second layer circuit portion is arranged, and a conductive material is sprayed by the thermal spraying device 12 to form the second layer circuit portion 20. Thereafter, a second-layer insulating portion (not shown) is formed by spraying an insulating material in the same manner as described above. By repeating this, a laminated circuit such as a third layer and a fourth layer can be formed.

The adhesion of the thermal spray coating to the polyamide resin substrate 10 in the thermal spray circuit body manufactured in this manner is far superior to that of the polypropylene (PP) resin substrate as shown in FIG. Generally, the surface of the resin substrate is a rough surface having a large number of concave portions 10a as shown in FIG. 1B. However, the concave portions 10a are lost due to surface smoothening due to thermal deformation during thermal spraying, so that the adhesion is low. Is thought to be weaker. However, since the polyamide-based resin substrate 10 has a higher melting point (about 250 degrees Celsius) than other resins, as shown in FIG. 1C, surface smoothening due to thermal deformation during thermal spraying is suppressed. This is considered to be because the anchoring effect can be maintained without the recess 10a being lost.

As described above, according to the present invention, since the polyamide resin substrate 10 is used as the insulating substrate, the insulating substrate itself is excellent in moldability and weight reduction.
No. 0 is excellent in the adhesion of the thermal spray coating, and therefore, by spraying a conductive substance directly on the polyamide resin substrate 10, the circuit portion 15 of the conductive coating can be formed, and the undercoating process can be reduced.

Further, according to the present invention, since the polyamide resin substrate 10 is excellent in the adhesion of the thermal spray coating, the insulating portion 18 is formed by spraying an insulating material on the circuit portion 15 of the conductive coating. The circuit part 15 and the insulating part 18
Can be formed by thermal spraying, and the manufacturing process can be simplified and simplified. Since the thermal spray coating has great versatility as a coating material, the circuit portion 15 and the insulating portion 18 can be formed in the same process.

Further, according to the present invention, a laminated circuit can be easily formed by repeating the steps of forming the circuit section 15 and the insulating section 18.

Further, as shown in FIG. 5, the thickness of the thermal sprayed coating can be increased to about 1 mm as compared with other coatings, so that there is an advantage that the conductor cross-sectional area can be increased with a narrow line width. . For example, a conductor cross-sectional area equivalent to an electric wire equivalent to 1 sq with a line width of 1 mm can be obtained.

[0030]

As described above, according to the first aspect of the present invention, a mask having an opening having the same shape as a predetermined circuit pattern is formed on a polyamide resin substrate, and the masked polyamide resin is formed. Since a predetermined circuit portion was formed by spraying a conductive material on the substrate, a polyamide resin substrate was used as the insulating substrate, so the moldability and weight of the insulating substrate itself were excellent, and the polyamide resin substrate was spray-coated. Because of its excellent adhesion, a circuit portion made of a conductive film can be formed by directly spraying a conductive material on the polyamide resin substrate, and the number of steps of the base treatment can be reduced.

According to a second aspect of the present invention, in the method of manufacturing a thermal sprayed circuit body according to the first aspect, after forming the predetermined circuit portion, the polyamide resin is formed on the predetermined circuit portion. Since the insulating portion is formed by spraying an insulating material on the substrate, in addition to the effect of the invention of claim 1, since the polyamide resin substrate has excellent adhesion of the sprayed coating, the polyamide resin substrate can be formed from above the circuit portion by the conductive coating. By spraying an insulating material, an insulating portion made of an insulating film can be formed, and both the circuit portion and the insulating portion can be formed by spraying, thereby simplifying and simplifying the manufacturing process.

According to a third aspect of the present invention, there is provided the method for manufacturing a sprayed circuit body according to the second aspect, wherein the predetermined circuit portion is formed by spraying a conductive material, and the insulating portion is formed by spraying an insulating material. The step of forming is repeated at least twice on the same surface of the polyamide resin substrate to laminate a plurality of circuit portions, so that in addition to the effects of the invention of claim 2, a step of forming a conductive film and an insulating film By repeating the above, a laminated circuit can be formed.

According to the fourth aspect of the present invention, since the predetermined circuit portion is formed directly on the polyamide-based resin substrate by spraying a conductive material, the polyamide-based resin substrate is used as the insulating substrate. Since the moldability and the weight are excellent, and the polyamide resin substrate is excellent in the adhesion of the thermal spray coating, the undercoating process can be reduced.

According to a fifth aspect of the present invention, in the thermal spray circuit according to the fourth aspect, the insulating portion is formed by spraying an insulating material on the polyamide resin substrate from above the predetermined circuit portion. In addition to the effect of the invention of claim 4, the polyamide resin substrate is excellent in the adhesion of the thermal spray coating, so that the insulating portion can be formed by spraying an insulating material on the circuit portion by the conductive coating, and the insulating portion is insulated from the circuit portion. Both parts can be formed by thermal spraying, which simplifies and simplifies the manufacturing process.

According to a sixth aspect of the present invention, there is provided the thermal spray circuit according to the fifth aspect, wherein the predetermined circuit portion formed by thermal spraying of the conductive material and the insulating portion formed by thermal spraying of the insulating material have a plurality of layers. Since the layers are stacked, in addition to the effect of the invention of claim 5, since a plurality of layers composed of the circuit portion and the insulating portion of the conductive film are stacked, a stacked circuit can be formed.

[Brief description of the drawings]

FIG. 1A is a cross-sectional view showing a state in which a conductive material is sprayed by a spraying apparatus according to an embodiment of the present invention;
(B) is an enlarged cross-sectional view of a polyamide resin substrate according to an embodiment of the present invention, and (C) is an enlarged cross-sectional view showing a state of forming a thermal spray coating on the polyamide resin substrate according to an embodiment of the present invention. FIG.

FIG. 2 is a cross-sectional view showing a state where an insulating material is being sprayed by a spraying apparatus according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a state in which a conductive material is sprayed by a spraying device to form a second-layer circuit portion according to the embodiment of the present invention.

FIG. 4 is a view showing the adhesion of a copper sprayed coating between a polyamide (PA) resin substrate and a polypropylene (PP) resin substrate.

FIG. 5 is a diagram showing the thickness of various coatings.

FIG. 6 is a perspective view for explaining a conventional method for manufacturing a thermal spray circuit body.

FIG. 7 is a perspective view for explaining a conventional method of manufacturing a thermal spray circuit body.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Polyamide resin board 15 Circuit part of the first layer 18 Insulating part 20 Circuit part of the second layer

Claims (6)

[Claims] 1. A predetermined circuit portion is formed on a polyamide resin substrate by performing masking having an opening having the same shape as a predetermined circuit pattern, and spraying a conductive material on the masked polyamide resin substrate. A method for manufacturing a thermal spray circuit body, characterized in that: 2. The method according to claim 1, wherein after forming the predetermined circuit portion, an insulating material is sprayed onto the polyamide resin substrate from above the predetermined circuit portion. A method for manufacturing a thermal spray circuit, wherein an insulating portion is formed. 3. The method according to claim 2, wherein the step of forming the predetermined circuit portion by spraying a conductive material and forming the insulating portion by spraying an insulating material is performed. A method for manufacturing a thermal spray circuit, wherein a plurality of circuit portions are laminated by repeating at least twice on the same surface of the polyamide resin substrate. 4. A sprayed circuit body wherein a predetermined circuit portion is formed directly on a polyamide resin substrate by spraying a conductive substance. 5. The thermal spray circuit according to claim 4, wherein an insulating portion is formed by spraying an insulating material on the polyamide resin substrate from above the predetermined circuit portion. 6. The thermal spray circuit body according to claim 5, wherein a plurality of layers each including the predetermined circuit portion formed by thermal spraying of a conductive material and an insulating portion formed by thermal spraying of an insulating material are laminated. Thermal spray circuit.