JPH0578896A - Production of stripe-plated bar - Google Patents

Abstract

PURPOSE:To subject a material having low electric conductivity to normal plating. CONSTITUTION:A material 2 sent from each of a pair of payoff reels through a power supply roll is electrolytically degreased, masking tapes 4 are stuck to the material 2 and Ag plating is carried out to produce a stripe-plated bar. In this method, an auxiliary electrode 12 formed by bundling Ag plated fine Cu wires 12a is brought into contact with the surface of the degreased material 2 to be plated and Cu striking is carried out. Electric current for plating supplied to the material 2 is stabilized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing striped strips.

[0002]

2. Description of the Related Art In order to manufacture a conventional striped strip, as shown in FIG. 2, a material 2 sent from a payoff 1 is electrolytically degreased in an organic solvent or an alkaline solution in a degreasing tank 3. Then, the masking tape 4 is attached to the degreased material, and the tape 4 is applied only to the plated surface.
Is peeled off, the two materials 2 are pasted together in a bag shape by the ears of the masking tape 4, and the partial degreasing by the partial degreasing tank 5 is performed.
Pickling in pickling tank 6, Cu in Cu strike tank 7
Strike, Ag strike in the Ag strike tank 8, and Ag plating in the Ag plating tank 9 were performed. At this time, in order to set the material 2 to the negative side, one power supply roll 10 and 11 were installed on each payoff 1 side and take-up side.

[0003]

When the material for applying the stripe plating strip in the above-mentioned prior art is copper and copper alloy, since the electric conductivity is high, the power feeding roll has one feeding roll on the pay-off side and one feeding roll on the take-up side. Was enough, but 4
When a material with low conductivity such as 2-alloy is used, a stray current flows in the plating tank and the pretreatment tank between the power supply rolls. Apparently, the specified current flows, but Cu strike and Ag strike undercoating is not normally performed normally, and there is a problem that heat resistance cannot be satisfied.

The present invention has been made in view of the above points, and an object of the present invention is to provide a method of manufacturing a striped plating strip that enables normal plating of a material having a low conductivity. .

[0005]

[Means for Solving the Problems] The above object is to carry out Cu strike by contacting an auxiliary electrode formed by bundling thin metal wires on the surface to be plated of the material before Cu strike after partial degreasing. Is achieved by

[0006]

Since the above means is provided, the plating current flowing through the material is stabilized.

[0007]

EXAMPLES Next, the present invention will be specifically described by way of examples.

[Embodiment 1] FIG. 1 shows an embodiment of the present invention. Note that the same parts as those of the related art are denoted by the same reference numerals, and the description thereof will be omitted. In this embodiment, partial degreasing is performed and C
The Cu strike was performed by bringing the auxiliary electrode 12 formed by bundling thin metal wires into contact with the plated surface of the material 2 before the u strike. By doing so, the plating current flowing through the material 2 is stabilized, and it is possible to obtain a method for manufacturing a striped plating strip capable of performing normal plating on a material having a low conductivity.

That is, immediately after the partial degreasing, before the Cu strike, that is, immediately after the partial degreasing, just before entering the Cu strike, the auxiliary electrode 12 was installed. Auxiliary electrode 12 is φ
0.1 to 0.2 Ag plated Cu wire 12a 20 to 10
0 terminals are bundled and the terminals are put together by the crimp terminal 12b (see FIG. 11B). This is fixed to a stand as shown in FIG. 4A and adjusted so as to hit the surface to be plated.

By installing the auxiliary electrode in this way, it is possible to perform plating work with a conventional strip plating strip manufacturing apparatus even with a material having a low conductivity.

The auxiliary electrode will be described below.

(1) The auxiliary electrode may be located anywhere between the partial degreasing tank and the Cu strike tank.

(2) Since the material of the auxiliary electrode is bag-shaped by the masking tape, the auxiliary electrode is brought into contact with the exposed portion of the material, that is, the surface to be plated.

(3) If this auxiliary electrode is installed after the Cu strike to bring the auxiliary electrode into contact with the surface to be plated, the underlying plating layer will be damaged and the plating characteristics will not be obtained.

(4) As the auxiliary electrode, a bundle of thin metal wires is suitable because it can supply power even to a narrow plated surface.

(5) A material having a high conductivity is suitable for the metal wire, and a copper alloy wire such as a copper wire or a brass wire is particularly suitable. Further, a material having a spring property is more preferable.

(6) The metal wire may be plated.

(7) For example, a Cu wire coated with Ag plating is suitable.

[0019]

As described above, according to the present invention, after partial degreasing, C
u Strike a Cu strike by contacting an auxiliary electrode formed by bundling thin metal wires on the surface to be plated of the material before the strike, so that the plating current flowing through the material is stabilized and the conductivity It is possible to obtain a method for manufacturing a striped strip, which enables normal plating of a material having a low heat resistance.

[Brief description of drawings]

FIG. 1 shows an auxiliary electrode according to an embodiment of a method for manufacturing a striped plating strip of the present invention, in which FIG. 1 (a) shows a state in which an Ag-plated Cu wire of the auxiliary electrode is in contact with a surface to be plated. A perspective view and the same figure (b) are side views of an auxiliary electrode formed by bundling Ag-plated Cu wires.

FIG. 2 is an explanatory view of a conventional method for manufacturing striped plating strips.

[Explanation of symbols]

 1 Payoff 2 Material 3 Degreasing tank 4 Masking tape 5 Partial degreasing tank 6 Pickling tank 7 Cu strike tank 8 Ag strike tank 9 Ag plating tank 10, 11 Power supply roll 12 Auxiliary electrode 12a Ag plating Cu wire 12b Crimp terminal

Claims (1)

[Claims] 1. A material sent from a pair of payoffs through a power supply roll is electrolytically degreased in a degreasing tank, a masking tape is attached to the degreased material, and the tape is peeled off only on the surface to be plated. The above materials are pasted together in a bag shape with the ears of the masking tape, partial degreasing, pickling, Cu strike and Ag strike are performed in this order, then Ag plating is performed, and then the masking tape is peeled off and provided on the take-up side. In the method for manufacturing striped strips in which each of the Ag-plated materials is taken up through a feeding roll, a thin metal wire is bundled on the surface to be plated of the material after the partial degreasing and before the Cu strike. The stripe plating strip is characterized in that the formed auxiliary electrode is brought into contact with and strikes Cu. Production method.