JPH0225813Y2 - - Google Patents
Info
- Publication number
- JPH0225813Y2 JPH0225813Y2 JP1985130901U JP13090185U JPH0225813Y2 JP H0225813 Y2 JPH0225813 Y2 JP H0225813Y2 JP 1985130901 U JP1985130901 U JP 1985130901U JP 13090185 U JP13090185 U JP 13090185U JP H0225813 Y2 JPH0225813 Y2 JP H0225813Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- spool
- bonding
- flange
- corrosion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000576 coating method Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000005260 corrosion Methods 0.000 claims description 11
- 230000007797 corrosion Effects 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 239000010407 anodic oxide Substances 0.000 claims description 8
- 238000001514 detection method Methods 0.000 description 10
- 238000004804 winding Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000004040 coloring Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000587161 Gomphocarpus Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
- Filamentary Materials, Packages, And Safety Devices Therefor (AREA)
- Wire Bonding (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案はボンデイングワイヤーを巻き付けてワ
イヤーボンダーに供するためのボンデイングワイ
ヤー用スプールに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a bonding wire spool for winding a bonding wire and applying it to a wire bonder.
半導体素子上の電極とリード端子とを接続する
ため、直径10〜50ミクロンの金、アルミニウム等
の極細線（以下ボンデイングワイヤーという）が
用いられている。このようなボンデイングワイヤ
ーは通常円筒状の胴部の少なくとも一端にフラン
ジを有するスプールの該胴部に巻き付けてワイヤ
ーボンダーに供給される。該スプール材質は軽く
て加工性に富み、しかも比較的安価であるアルミ
ニウムが一般的で、耐食性を付与するためその表
面は全面に亘つてアルマイト処理が施され、陽極
酸化被膜で覆われている。
Ultrafine wires (hereinafter referred to as bonding wires) made of gold, aluminum, or the like and having a diameter of 10 to 50 microns are used to connect electrodes on semiconductor elements and lead terminals. Such a bonding wire is usually supplied to a wire bonder by winding it around a spool having a flange at at least one end of the cylindrical body. The spool material is generally aluminum, which is light, easy to work with, and relatively inexpensive.The entire surface of the spool is alumite-treated and covered with an anodic oxide film to provide corrosion resistance.
近年ワイヤーボンダーの改良によりボンデイン
グ速度が著るしく向上して来たが、それに伴なつ
てスプールに巻き付けるワイヤー長さも長尺化さ
れて来た。この長尺化は整列巻方式をクロス巻方
式とすることにより実現されている（例えば実開
昭55−155760、実開昭57−93144等）。クロス巻の
利点は整列巻に比べて多層にした場合上層のワイ
ヤーが下層のワイヤー間に食い込む機会が少な
く、ワイヤーボンデイング中の断線及びワイヤー
の折れ曲り頻度が著るしく減少する点にある。し
かしながらこのようなクロス巻によつてもボンデ
イング中の断線を皆無にすることはできていな
い。このためボンダーに断線検出装置を備え、断
線を検出すればボンダーを停止すると共にオペレ
ーターに警報を発する方法を採つているのが実状
である。 In recent years, improvements in wire bonders have significantly improved the bonding speed, and along with this, the length of the wire wound around the spool has also become longer. This lengthening has been achieved by changing the aligned winding method to a cross winding method (for example, Utility Model Application No. 55-155760, Utility Model Application No. 57-93144, etc.). The advantage of cross winding, compared to aligned winding, is that when multiple layers are used, there is less chance of upper layer wires digging into the lower layer wires, and the frequency of wire breakage and wire bending during wire bonding is significantly reduced. However, even with such cross winding, it has not been possible to completely eliminate wire breakage during bonding. For this reason, the current situation is that the bonder is equipped with a wire breakage detection device, and if a wire breakage is detected, the bonder is stopped and a warning is issued to the operator.
第２図はこのような断線検出装置を備えたボン
ダーの１例である。ボンデイングワイヤー１を巻
き付けたスプール２はその内面が金属製のスプー
ル保持具３の突出部に嵌合装着されている。この
スプールは前記のように全面アルマイト処理され
ている絶縁性であるため、ボンデイングワイヤー
１の一端（巻き始めの部分）は断線検出装置４の
入力端子Ａと導線で接続された接続端子５に接続
し、ボンデイングワイヤー１の他の一端（巻き終
りの部分）はガイド６を通つてボンデイングキヤ
ピラリー７に保持されている。このようなボンダ
ーは所謂ネイルヘツドボンデイングを行なう装置
であり、水素炎又は電気トーチによつてワイヤー
先端を熔融して球状とし、該先端をキヤピラリー
７の動作によつて先ず半導体素子８上の電極にボ
ールボンデイングし、次いでリード端子９にウエ
ツジボンデイングした後キヤピラリー７を上昇さ
せて上方でワイヤー１をクランプし、ウエツジボ
ンド部でワイヤー１を切断するように動作する。
リード端子９と検出装置４の端子Ｂは接地されて
おり、端子Ａとリード端子９の間に電圧を印加す
ればワイヤー１に電流が流れ、この電流の有無に
よつて断線が検出される。電圧の印加は通常ウエ
ツジボンド開始時からクランプによるワイヤー１
の切断までの間で行なわれ、キヤピラリー７の動
作と連動して印加されるようになつている。 FIG. 2 shows an example of a bonder equipped with such a disconnection detection device. The inner surface of the spool 2 around which the bonding wire 1 is wound is fitted onto a protrusion of a metal spool holder 3. Since this spool is insulating and has been entirely alumite-treated as described above, one end (the beginning of winding) of the bonding wire 1 is connected to the connection terminal 5, which is connected to the input terminal A of the disconnection detection device 4 by a conductor. However, the other end (the end of the winding) of the bonding wire 1 is held by a bonding capillary 7 through a guide 6. Such a bonder is a device that performs so-called nail head bonding, in which the tip of the wire is melted into a sphere using a hydrogen flame or an electric torch, and the tip is first attached to an electrode on a semiconductor element 8 by the operation of a capillary 7. After ball bonding and wedge bonding to the lead terminal 9, the capillary 7 is raised and the wire 1 is clamped above, and the wire 1 is cut at the wedge bond portion.
The lead terminal 9 and the terminal B of the detection device 4 are grounded, and when a voltage is applied between the terminal A and the lead terminal 9, a current flows through the wire 1, and a disconnection is detected based on the presence or absence of this current. Voltage is usually applied to wire 1 by clamping from the start of wedge bonding.
It is applied until the cutting of the capillary 7, and is applied in conjunction with the operation of the capillary 7.
ところで上記の断線検出装置４を使用するには
ワイヤーを巻き付けた新たなスプールに取替える
度にボンデイングワイヤー１の一端を接続端子５
に接続する必要があるが、このワイヤー１は前記
の通り直径10〜50ミクロンと細いもので取扱いが
大変やつかいである。このスプールを耐食性の金
属で、又は耐食性の金属で被覆して構成すれば、
スプール保持具３へスプールを嵌合装着するだけ
でワイヤー１と断線検出装置４の電気的導通が得
られ、ワイヤー１を接続端子５へ接続する作業は
不要となる。ところがこのようなスプールに巻き
付けるボンデイングワイヤーの線径が複数種ある
場合、何らかの目印によつて線径が判るようにす
る必要があるが、上記のようなスプールではそれ
自体に着色することができず、目印となるシール
をフランジ部に貼り付けて区別し得るようにする
外ない。しかしながら、このような目印は貼り付
ける場所の制約から小さいものにならざるを得ず
見落し易いこと、シールが剥離すれば区別の手段
が無くなること、等の欠点があつた。 By the way, in order to use the above-mentioned disconnection detection device 4, each time a new spool with wire wound thereon is replaced, one end of the bonding wire 1 is connected to the connecting terminal 5.
However, as mentioned above, this wire 1 is thin with a diameter of 10 to 50 microns and is difficult to handle. If this spool is made of a corrosion-resistant metal or coated with a corrosion-resistant metal,
Electrical continuity between the wire 1 and the disconnection detection device 4 can be obtained simply by fitting the spool into the spool holder 3, and the work of connecting the wire 1 to the connection terminal 5 becomes unnecessary. However, when there are multiple wire diameters of bonding wire to be wound around such a spool, it is necessary to use some kind of marking to identify the wire diameter, but the spool itself cannot be colored. The only option is to attach a sticker to the flange so that it can be distinguished. However, such marks have disadvantages such as being small because of restrictions on where they can be pasted, making them easy to overlook, and once the sticker peels off, there is no means for distinguishing between them.
本考案は上記従来の欠点を解消し、ワイヤーボ
ンダーのスプール保持具３に嵌合装着するだけで
ワイヤー１と断線検出装置４との電気的導通が得
られ、しかもスプール自体の着色によりワイヤー
線径の区別を可能にしたスプールを提供するもの
である。
The present invention solves the above-mentioned conventional drawbacks, and allows electrical continuity between the wire 1 and the disconnection detection device 4 to be established simply by fitting the wire into the spool holder 3 of the wire bonder.Moreover, by coloring the spool itself, the wire diameter This provides a spool that makes it possible to differentiate between
この目的を達成するため本考案のスプールは、
円筒状の胴部の少なくとも一端にフランジを有す
るアルミニウム製スプールの該胴部内壁面及び／
又はフランジ外側面に耐食性の金属被膜を設けて
導電性を確保すると共にアルミニウム素地の耐食
性の不足を補い、残部の表面に着色された陽極酸
化被膜を設けてアルミニウム素地の耐食性の不足
を補うと共に巻き付けられているワイヤーの線径
を一目で区別できるようにしたものである。
To achieve this purpose, the spool of this invention is
The inner wall surface of the cylindrical body of an aluminum spool having a flange on at least one end thereof and/or
Alternatively, a corrosion-resistant metal coating is provided on the outer surface of the flange to ensure conductivity and compensate for the lack of corrosion resistance of the aluminum base, and a colored anodic oxide coating is provided on the remaining surface to compensate for the lack of corrosion resistance of the aluminum base and wrapped. This makes it possible to distinguish at a glance the diameter of the wire being used.
第１図は本考案のスプールの一実施例を示す図
で、スプール素材１０はアルミニウム製で、円筒
状胴部の両端にフランジを有し、該胴部内壁面及
びフランジ外側面に耐食性金属被膜１１を、残部
の表面に着色された陽極酸化被膜１２を有する。 FIG. 1 shows an embodiment of the spool of the present invention, in which the spool material 10 is made of aluminum, has flanges at both ends of a cylindrical body, and has a corrosion-resistant metal coating 11 on the inner wall surface of the body and the outer surface of the flange. The remaining surface has a colored anodic oxide film 12.
耐食性金属被膜１１と１２はニツケル、クロ
ム、銅等が適当で、これらの金属はアルミニウム
素地に適当な前処理、例えば亜鉛沈着法、を施せ
ば比較的容易に電気メツキで被着せしめることが
できる。耐食性金属被膜１１は胴部内壁面及びフ
ランジ外側面の何れか一方に設ければ良いが、第
１図のように両方に設ければスプール保持具３の
フランジと接触する部分又はスプール胴部内壁面
と接触する突出部の何れか一方が金属面を露出し
ていればスプールと接続端子５は導通する。又ス
プール保持具３が全面を絶縁被膜で覆われている
場合は接続端子５とフランジ接触面の間に導通材
料を介在させれば同様にスプールと接続端子５を
導通させることができる。 The corrosion-resistant metal coatings 11 and 12 are suitably made of nickel, chromium, copper, etc., and these metals can be electroplated relatively easily if the aluminum substrate is subjected to a suitable pretreatment, such as zinc deposition. . The corrosion-resistant metal coating 11 may be provided on either the inner wall surface of the body or the outer surface of the flange, but if it is provided on both as shown in FIG. If either of the contacting protrusions has a metal surface exposed, the spool and the connecting terminal 5 are electrically connected. Further, when the entire surface of the spool holder 3 is covered with an insulating coating, the spool and the connecting terminal 5 can be similarly electrically connected by interposing a conductive material between the connecting terminal 5 and the flange contact surface.
本考案のスプールにおいて胴部内壁面及び／又
はフランジ外側面以外の表面は着色された陽極酸
化被膜で覆われている。アルミニウムの陽極酸化
被膜の着色法には、染料による方法、顔料による
方法等があり、種々の色調の着色が行なわれてい
る。本考案のスプール着色にはこのような公知技
術が適用できる。 In the spool of the present invention, surfaces other than the inner wall surface of the body and/or the outer surface of the flange are covered with a colored anodic oxide coating. Methods for coloring aluminum anodic oxide films include methods using dyes, methods using pigments, etc., and coloring in various tones is performed. Such known techniques can be applied to the spool coloring of the present invention.
上記のような耐食性金属被膜及び着色陽極酸化
被膜の形成は、何れを先に行なつても良く、又、
一旦何れか一方の被膜を全面に施した後、必要な
部分にマスキングを施して露出部分の被膜を除去
し、露出したアルミニウム素地に他方の被膜を施
すようにすることもできる。 Either of the above-mentioned corrosion-resistant metal coating and colored anodic oxide coating may be formed first, or
It is also possible to once apply one of the coatings to the entire surface, mask the necessary portions, remove the coating on the exposed portions, and then apply the other coating to the exposed aluminum substrate.
このようなスプールの金属被膜１１にボンデイ
ングワイヤーの巻き始めの端部を接着テープなど
で仮留しておけば、ワイヤーを巻き付けたスプー
ルをボンダーのスプール保持具３に嵌合装着する
だけでワイヤー１と断線検出装置４を導通させる
ことができる。又、ワイヤーの線径毎に着色陽極
酸化被膜の色調を決めておけば、ワイヤーの線径
をスプールの色調で知ることができ、間違いを生
じる恐れがない。
If the starting end of the bonding wire is temporarily fastened to the metal coating 11 of the spool with adhesive tape, the wire 1 can be removed by simply fitting and attaching the spool with the wire wound onto the spool holder 3 of the bonder. The disconnection detection device 4 can be electrically connected to the disconnection detection device 4. Furthermore, if the color tone of the colored anodic oxide coating is determined for each wire diameter, the wire diameter can be known from the color tone of the spool, and there is no risk of making a mistake.
なお、ボンデイングワイヤーは線径の種類の外
に、特性上でも複数種類あるが、そのような特性
上の区別も多種の色調のスプールを用いれば、誤
りなく管理することが可能となる。 Note that there are multiple types of bonding wires in terms of characteristics as well as types of wire diameter, but such distinctions in characteristics can be managed without error by using spools of various colors.
本考案によりワイヤーボンダーのスプール交換
の作業能率が向上し、線径及び特性上のワイヤー
管理が極めて容易になつた。
The present invention improves the efficiency of replacing the wire bonder spool, and makes it extremely easy to manage the wire in terms of wire diameter and characteristics.
第１図は本考案のスプールの一実施例を示す説
明図である。第２図は断線検出装置を備えたボン
ダーの一例の説明図である。
FIG. 1 is an explanatory diagram showing one embodiment of the spool of the present invention. FIG. 2 is an explanatory diagram of an example of a bonder equipped with a disconnection detection device.
Claims (1)
するアルミニウム製スプールの該胴部内壁面及
び／又はフランジ外側面に耐食性の金属被膜を有
し、残部の表面に着色された陽極酸化被膜を有す
るボンデイングワイヤー用スプール。 For bonding wire, the aluminum spool has a flange on at least one end of the cylindrical body, and has a corrosion-resistant metal coating on the inner wall surface of the body and/or the outer surface of the flange, and a colored anodic oxide coating on the remaining surface. spool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985130901U JPH0225813Y2 (en) | 1985-08-29 | 1985-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985130901U JPH0225813Y2 (en) | 1985-08-29 | 1985-08-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6241782U JPS6241782U (en) | 1987-03-12 |
| JPH0225813Y2 true JPH0225813Y2 (en) | 1990-07-16 |
Family
ID=31028845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985130901U Expired JPH0225813Y2 (en) | 1985-08-29 | 1985-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0225813Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS577753B2 (en) * | 1973-08-22 | 1982-02-12 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS577753U (en) * | 1980-06-17 | 1982-01-14 |
-
1985
- 1985-08-29 JP JP1985130901U patent/JPH0225813Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS577753B2 (en) * | 1973-08-22 | 1982-02-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6241782U (en) | 1987-03-12 |
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