JPS60136138U - Spool for bonding wire - Google Patents

Spool for bonding wire

Info

Publication number
JPS60136138U
JPS60136138U JP2373484U JP2373484U JPS60136138U JP S60136138 U JPS60136138 U JP S60136138U JP 2373484 U JP2373484 U JP 2373484U JP 2373484 U JP2373484 U JP 2373484U JP S60136138 U JPS60136138 U JP S60136138U
Authority
JP
Japan
Prior art keywords
spool
bonding wire
flanges
discontinuously
conductive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2373484U
Other languages
Japanese (ja)
Other versions
JPH023624Y2 (en
Inventor
伸一 阿部
時田　正憲
健次 森
Original Assignee
タツタ電線株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by タツタ電線株式会社 filed Critical タツタ電線株式会社
Priority to JP2373484U priority Critical patent/JPS60136138U/en
Publication of JPS60136138U publication Critical patent/JPS60136138U/en
Application granted granted Critical
Publication of JPH023624Y2 publication Critical patent/JPH023624Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案のボンディングワイヤー用スプールの縦
断面図、第２図は同側面図で、第３図はスプールの胴部
から鍔部へ至る部分の拡大図であり、図中の符号は次の
通りである。 １・・・スプール素材、２・・・鍔、３・・・切欠部、
４・・・着色アルマイト層、５・・・溶射ステンレス層
、１１・・・胴部。Fig. 1 is a longitudinal cross-sectional view of the bonding wire spool of the present invention, Fig. 2 is a side view of the same, and Fig. 3 is an enlarged view of the portion from the body of the spool to the flange. It is as follows. 1... Spool material, 2... Tsuba, 3... Notch,
4... Colored alumite layer, 5... Thermal sprayed stainless steel layer, 11... Body.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 胴部の両端または片端に鍔を有するアルマイト処理を施
したアルミニウム製ボンディングワイヤー用スプールの
少なくとも一方の前記鍔部または該鍔部と前記胴部内面
に連続または不連続に導電性物質を溶射してなることを
特徴とするボンディングワイヤー用スプール。A conductive material is sprayed continuously or discontinuously on at least one of the flanges of an aluminum bonding wire spool subjected to alumite treatment, or on the flanges and the inner surface of the body. A spool for bonding wire that is characterized by:
JP2373484U 1984-02-20 1984-02-20 Spool for bonding wire Granted JPS60136138U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2373484U JPS60136138U (en) 1984-02-20 1984-02-20 Spool for bonding wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2373484U JPS60136138U (en) 1984-02-20 1984-02-20 Spool for bonding wire

Publications (2)

Publication Number Publication Date
JPS60136138U true JPS60136138U (en) 1985-09-10
JPH023624Y2 JPH023624Y2 (en) 1990-01-29

Family

ID=30517234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2373484U Granted JPS60136138U (en) 1984-02-20 1984-02-20 Spool for bonding wire

Country Status (1)

Country Link
JP (1) JPS60136138U (en)

Also Published As

Publication number Publication date
JPH023624Y2 (en) 1990-01-29

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