JPH0365201U - - Google Patents
Info
- Publication number
- JPH0365201U JPH0365201U JP12652789U JP12652789U JPH0365201U JP H0365201 U JPH0365201 U JP H0365201U JP 12652789 U JP12652789 U JP 12652789U JP 12652789 U JP12652789 U JP 12652789U JP H0365201 U JPH0365201 U JP H0365201U
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- mild steel
- outer periphery
- steel wire
- copper plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910001209 Low-carbon steel Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Non-Insulated Conductors (AREA)
Description
第１図は本考案に係るリード線を有する固定抵
抗器の平面図、第２図はリード線の断面拡大図、
第３図は連設単位体の一例を示す一部切欠平面図
である。
１……固定抵抗器、２……鉄製キヤツプ、３…
…リード線、４……軟鋼線、５……銅メツキ層、
６……半田メツキ層、７……台紙、８……貼着テ
ープ。
FIG. 1 is a plan view of a fixed resistor having a lead wire according to the present invention, FIG. 2 is an enlarged cross-sectional view of the lead wire,
FIG. 3 is a partially cutaway plan view showing an example of the continuous unit. 1...Fixed resistor, 2...Iron cap, 3...
... Lead wire, 4 ... Mild steel wire, 5 ... Copper plating layer,
6... Solder plating layer, 7... Mounting paper, 8... Adhesive tape.
Claims (1)
キ層と、該銅メツキ層の外周に形成された半田メ
ツキ層とからなることを特徴とする固定抵抗器の
リード線。 A lead wire for a fixed resistor comprising a mild steel wire, a copper plating layer formed on the outer periphery of the mild steel wire, and a solder plating layer formed on the outer periphery of the copper plating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12652789U JPH0365201U (en) | 1989-10-31 | 1989-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12652789U JPH0365201U (en) | 1989-10-31 | 1989-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0365201U true JPH0365201U (en) | 1991-06-25 |
Family
ID=31674333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12652789U Pending JPH0365201U (en) | 1989-10-31 | 1989-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0365201U (en) |
-
1989
- 1989-10-31 JP JP12652789U patent/JPH0365201U/ja active Pending
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