JPH0365201U - - Google Patents

Info

Publication number
JPH0365201U
JPH0365201U JP12652789U JP12652789U JPH0365201U JP H0365201 U JPH0365201 U JP H0365201U JP 12652789 U JP12652789 U JP 12652789U JP 12652789 U JP12652789 U JP 12652789U JP H0365201 U JPH0365201 U JP H0365201U
Authority
JP
Japan
Prior art keywords
plating layer
mild steel
outer periphery
steel wire
copper plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12652789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12652789U priority Critical patent/JPH0365201U/ja
Publication of JPH0365201U publication Critical patent/JPH0365201U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Non-Insulated Conductors (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係るリード線を有する固定抵
抗器の平面図、第2図はリード線の断面拡大図、
第3図は連設単位体の一例を示す一部切欠平面図
である。 1……固定抵抗器、2……鉄製キヤツプ、3…
…リード線、4……軟鋼線、5……銅メツキ層、
6……半田メツキ層、7……台紙、8……貼着テ
ープ。
FIG. 1 is a plan view of a fixed resistor having a lead wire according to the present invention, FIG. 2 is an enlarged cross-sectional view of the lead wire,
FIG. 3 is a partially cutaway plan view showing an example of the continuous unit. 1...Fixed resistor, 2...Iron cap, 3...
... Lead wire, 4 ... Mild steel wire, 5 ... Copper plating layer,
6... Solder plating layer, 7... Mounting paper, 8... Adhesive tape.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 軟鋼線と、該軟鋼線の外周に形成された銅メツ
キ層と、該銅メツキ層の外周に形成された半田メ
ツキ層とからなることを特徴とする固定抵抗器の
リード線。
A lead wire for a fixed resistor comprising a mild steel wire, a copper plating layer formed on the outer periphery of the mild steel wire, and a solder plating layer formed on the outer periphery of the copper plating layer.
JP12652789U 1989-10-31 1989-10-31 Pending JPH0365201U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12652789U JPH0365201U (en) 1989-10-31 1989-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12652789U JPH0365201U (en) 1989-10-31 1989-10-31

Publications (1)

Publication Number Publication Date
JPH0365201U true JPH0365201U (en) 1991-06-25

Family

ID=31674333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12652789U Pending JPH0365201U (en) 1989-10-31 1989-10-31

Country Status (1)

Country Link
JP (1) JPH0365201U (en)

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