JPH023558B2 - - Google Patents

Info

Publication number
JPH023558B2
JPH023558B2 JP58109672A JP10967283A JPH023558B2 JP H023558 B2 JPH023558 B2 JP H023558B2 JP 58109672 A JP58109672 A JP 58109672A JP 10967283 A JP10967283 A JP 10967283A JP H023558 B2 JPH023558 B2 JP H023558B2
Authority
JP
Japan
Prior art keywords
conductive path
resistor
resin
printed
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58109672A
Other languages
English (en)
Japanese (ja)
Other versions
JPS601858A (ja
Inventor
Masakazu Yamagishi
Akira Kazami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP58109672A priority Critical patent/JPS601858A/ja
Publication of JPS601858A publication Critical patent/JPS601858A/ja
Publication of JPH023558B2 publication Critical patent/JPH023558B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP58109672A 1983-06-17 1983-06-17 多層混成集積回路 Granted JPS601858A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58109672A JPS601858A (ja) 1983-06-17 1983-06-17 多層混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58109672A JPS601858A (ja) 1983-06-17 1983-06-17 多層混成集積回路

Publications (2)

Publication Number Publication Date
JPS601858A JPS601858A (ja) 1985-01-08
JPH023558B2 true JPH023558B2 (enrdf_load_stackoverflow) 1990-01-24

Family

ID=14516240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58109672A Granted JPS601858A (ja) 1983-06-17 1983-06-17 多層混成集積回路

Country Status (1)

Country Link
JP (1) JPS601858A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2699980B2 (ja) * 1988-06-27 1998-01-19 富士通株式会社 膜素子を内層した配線基板
JP2020064999A (ja) * 2018-10-18 2020-04-23 日本特殊陶業株式会社 配線基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5773959A (en) * 1980-10-27 1982-05-08 Hitachi Ltd Manufacture of thick film hybrid integrated circuit board

Also Published As

Publication number Publication date
JPS601858A (ja) 1985-01-08

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