JPH0233452U - - Google Patents
Info
- Publication number
- JPH0233452U JPH0233452U JP10998488U JP10998488U JPH0233452U JP H0233452 U JPH0233452 U JP H0233452U JP 10998488 U JP10998488 U JP 10998488U JP 10998488 U JP10998488 U JP 10998488U JP H0233452 U JPH0233452 U JP H0233452U
- Authority
- JP
- Japan
- Prior art keywords
- tip
- integrated circuit
- semiconductor integrated
- circuit device
- molten solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
図面は本考案の一実施例を示す斜視図である。 １……本体、２……端子、２１……切り込み。 The drawing is a perspective view showing an embodiment of the present invention. 1...Body, 2...Terminal, 21...Notch.
Claims (1)
する半導体集積回路装置において、各端子の先端
部に該先端部を溶融半田に漬すと溶融半田が吸い
込まれて充満される細い切り込みを設けたことを
特徴とする半導体集積回路装置。 In a semiconductor integrated circuit device whose terminals are soldered and mounted on a printed wiring board, etc., a thin cut is provided at the tip of each terminal so that when the tip is immersed in molten solder, the molten solder is sucked in and filled. A semiconductor integrated circuit device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10998488U JPH0233452U (en) | 1988-08-24 | 1988-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10998488U JPH0233452U (en) | 1988-08-24 | 1988-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233452U true JPH0233452U (en) | 1990-03-02 |
Family
ID=31346729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10998488U Pending JPH0233452U (en) | 1988-08-24 | 1988-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233452U (en) |
-
1988
- 1988-08-24 JP JP10998488U patent/JPH0233452U/ja active Pending