JPH0231801Y2 - - Google Patents
Info
- Publication number
- JPH0231801Y2 JPH0231801Y2 JP1985140292U JP14029285U JPH0231801Y2 JP H0231801 Y2 JPH0231801 Y2 JP H0231801Y2 JP 1985140292 U JP1985140292 U JP 1985140292U JP 14029285 U JP14029285 U JP 14029285U JP H0231801 Y2 JPH0231801 Y2 JP H0231801Y2
- Authority
- JP
- Japan
- Prior art keywords
- porous
- dielectric material
- multilayer printed
- boards
- tetrafluoroethylene resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Waveguides (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985140292U JPH0231801Y2 (enrdf_load_stackoverflow) | 1985-09-13 | 1985-09-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985140292U JPH0231801Y2 (enrdf_load_stackoverflow) | 1985-09-13 | 1985-09-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6249277U JPS6249277U (enrdf_load_stackoverflow) | 1987-03-26 |
JPH0231801Y2 true JPH0231801Y2 (enrdf_load_stackoverflow) | 1990-08-28 |
Family
ID=31047004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985140292U Expired JPH0231801Y2 (enrdf_load_stackoverflow) | 1985-09-13 | 1985-09-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0231801Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2605306B2 (ja) * | 1987-11-02 | 1997-04-30 | 株式会社村田製作所 | 多層回路基板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5920825B2 (ja) * | 1978-10-03 | 1984-05-15 | 鹿島建設株式会社 | ケ−ソン工事システム |
JPS55133597A (en) * | 1979-04-06 | 1980-10-17 | Hitachi Ltd | Multilayer circuit board |
JPS5819159A (ja) * | 1981-07-23 | 1983-02-04 | Kiichiro Yagi | 自力浮力発電方法 |
JPS6249275U (enrdf_load_stackoverflow) * | 1985-09-12 | 1987-03-26 |
-
1985
- 1985-09-13 JP JP1985140292U patent/JPH0231801Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6249277U (enrdf_load_stackoverflow) | 1987-03-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4755911A (en) | Multilayer printed circuit board | |
EP0282625A3 (en) | Method for producing rigid-type multilayer printed wiring board | |
JPH0231801Y2 (enrdf_load_stackoverflow) | ||
JPH0231802Y2 (enrdf_load_stackoverflow) | ||
WO2004114730A3 (en) | Metal foil composite structure for producing clad laminate | |
JPH0368149A (ja) | Icパッケージ | |
JP2928008B2 (ja) | 高速信号用プリント配線板 | |
JPH0231795Y2 (enrdf_load_stackoverflow) | ||
JPS61183998A (ja) | フレキシブル印刷配線基板の製造方法 | |
JPH03239389A (ja) | プリント回路基板 | |
JP4785473B2 (ja) | 多層プリント配線板、多層プリント配線板の製造方法、及び電子装置 | |
JPS62128597A (ja) | 多層印刷配線板 | |
JPS6149499A (ja) | フレキシブル多層配線基板 | |
JP2534983B2 (ja) | 積層基板 | |
KR970064913A (ko) | 구리- 피복 라미네이트, 다층 구리- 피복 라미네이트 및 그의 제조방법 | |
JPS6022889U (ja) | 多層プリント配線板 | |
JPH0546296Y2 (enrdf_load_stackoverflow) | ||
JPH07249876A (ja) | 金属芯入り多層プリント配線板 | |
JP2782734B2 (ja) | 多層プラスチックチップキャリア | |
JP3324660B2 (ja) | 多層配線板およびそれに用いる接着フィルム | |
JPS6273937A (ja) | 多層プリント板 | |
JPH0738209A (ja) | 低誘電率フレキシブル基板 | |
JPS59158364U (ja) | 複合多層配線基板 | |
JPS63100796A (ja) | 弗素樹脂多層プリント板の製造方法 | |
JPH05343822A (ja) | 両面回路基板およびその製造方法 |