JPH0231143U - - Google Patents
Info
- Publication number
- JPH0231143U JPH0231143U JP1988110113U JP11011388U JPH0231143U JP H0231143 U JPH0231143 U JP H0231143U JP 1988110113 U JP1988110113 U JP 1988110113U JP 11011388 U JP11011388 U JP 11011388U JP H0231143 U JPH0231143 U JP H0231143U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- heat sink
- protrusion
- semiconductor device
- exposed surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Description
第１図及び第２図は本考案による半導体装置の
一例を示す半導体装置の部分断面図及び上面図、
第３図は従来の半導体装置の一例を示す半導体装
置の断面図である。 １……外郭体、２……外部リード、３……ヒー
トシンク、４……金属板、５……接着剤、６……
出張り部、７……抜け穴、８……突出部、９……
溝。
一例を示す半導体装置の部分断面図及び上面図、
第３図は従来の半導体装置の一例を示す半導体装
置の断面図である。 １……外郭体、２……外部リード、３……ヒー
トシンク、４……金属板、５……接着剤、６……
出張り部、７……抜け穴、８……突出部、９……
溝。
Claims (1)
- 半導体チツプが搭載される金属板と、前記金属
板の一面を露出して前記半導体チツプを気密封止
してなる外郭体と、露出した前記金属板の面に接
着されるヒートシンクとでなる半導体装置におい
て、露出した前記金属板の面に形成された円形の
周囲から外方に伸る複数の矩形状突出部をもつ出
張り部を有する前記金属板と、前記出張り部とは
め合い前記出張り部と相似の形状の抜け穴を有す
るヒートシンクとを備えたことを特徴とする半導
体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988110113U JPH0231143U (ja) | 1988-08-22 | 1988-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988110113U JPH0231143U (ja) | 1988-08-22 | 1988-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0231143U true JPH0231143U (ja) | 1990-02-27 |
Family
ID=31346977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988110113U Pending JPH0231143U (ja) | 1988-08-22 | 1988-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231143U (ja) |
-
1988
- 1988-08-22 JP JP1988110113U patent/JPH0231143U/ja active Pending
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