JPH0230845Y2 - - Google Patents
Info
- Publication number
- JPH0230845Y2 JPH0230845Y2 JP9074084U JP9074084U JPH0230845Y2 JP H0230845 Y2 JPH0230845 Y2 JP H0230845Y2 JP 9074084 U JP9074084 U JP 9074084U JP 9074084 U JP9074084 U JP 9074084U JP H0230845 Y2 JPH0230845 Y2 JP H0230845Y2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- ink
- printed
- silver
- silver ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 17
- 229910052709 silver Inorganic materials 0.000 claims description 17
- 239000004332 silver Substances 0.000 claims description 17
- 238000012360 testing method Methods 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 13
- 229910052799 carbon Inorganic materials 0.000 claims description 13
- 238000007689 inspection Methods 0.000 claims description 8
- 239000000976 ink Substances 0.000 description 26
- 239000004020 conductor Substances 0.000 description 10
- 230000007547 defect Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
Landscapes
- Measurement Of Resistance Or Impedance (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9074084U JPS617058U (ja) | 1984-06-20 | 1984-06-20 | 検査パタ−ン付フレキシブルプリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9074084U JPS617058U (ja) | 1984-06-20 | 1984-06-20 | 検査パタ−ン付フレキシブルプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS617058U JPS617058U (ja) | 1986-01-16 |
| JPH0230845Y2 true JPH0230845Y2 (de) | 1990-08-20 |
Family
ID=30646001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9074084U Granted JPS617058U (ja) | 1984-06-20 | 1984-06-20 | 検査パタ−ン付フレキシブルプリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS617058U (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5375493B2 (ja) * | 2009-09-30 | 2013-12-25 | カシオ計算機株式会社 | フレキシブル配線基板 |
-
1984
- 1984-06-20 JP JP9074084U patent/JPS617058U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS617058U (ja) | 1986-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH09152457A (ja) | 電気的配線検査方法及び装置 | |
| JPH0230845Y2 (de) | ||
| EP0909117B1 (de) | Verfahren zur Herstellung von Dickfilmschaltungen | |
| US5198778A (en) | Method for inspecting printed circuit boards with through-holes | |
| JPS6156486A (ja) | 厚膜基板 | |
| US3308376A (en) | Area measurement of irregular shapes | |
| JPH02198186A (ja) | プリント配線板シールド層検査方法と検査手段 | |
| KR0118730Y1 (ko) | 하이브리드 집적회로의 저항치 검사용 저항시트 | |
| JPH0515068B2 (de) | ||
| JP2952641B2 (ja) | 集積回路装置の試験装置およびその試験方法 | |
| JPH03196698A (ja) | 絶縁層等の検査部を有するプリント配線板 | |
| SU1359658A1 (ru) | Контрольный образец | |
| JP2537888B2 (ja) | 回路基板 | |
| JPH07283532A (ja) | プリント配線板製造用基板 | |
| JPH077271A (ja) | プリント配線板の検査方法およびテストパターン | |
| JPH03297189A (ja) | スルーホールを有するプリント配線板 | |
| JPS61180153A (ja) | プリント配線基板の試験装置およびその方法 | |
| JPS6066119A (ja) | 厚膜多層印刷基板の印刷ずれ検査方法 | |
| KR100337524B1 (ko) | 미세회로 기판의 단선측정을 위한 비접촉 센서 | |
| JPH046221Y2 (de) | ||
| JPH07202375A (ja) | 厚膜回路基板の製造方法 | |
| JPH06294815A (ja) | 実装部品の検査方法 | |
| JPS58158564A (ja) | 印刷配線板の布線試験方法 | |
| JPH05299900A (ja) | 回路基板および当該回路基板を用いた混成集積回路装置並びに回路基板における欠損検出方法 | |
| JPH0325966A (ja) | 圧膜回路基板の製造方法 |