JPH0230839Y2 - - Google Patents

Info

Publication number
JPH0230839Y2
JPH0230839Y2 JP1985199187U JP19918785U JPH0230839Y2 JP H0230839 Y2 JPH0230839 Y2 JP H0230839Y2 JP 1985199187 U JP1985199187 U JP 1985199187U JP 19918785 U JP19918785 U JP 19918785U JP H0230839 Y2 JPH0230839 Y2 JP H0230839Y2
Authority
JP
Japan
Prior art keywords
package
bonding
carrier unit
pedestal
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985199187U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62107450U (ru
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985199187U priority Critical patent/JPH0230839Y2/ja
Publication of JPS62107450U publication Critical patent/JPS62107450U/ja
Application granted granted Critical
Publication of JPH0230839Y2 publication Critical patent/JPH0230839Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Wire Bonding (AREA)
JP1985199187U 1985-12-26 1985-12-26 Expired JPH0230839Y2 (ru)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985199187U JPH0230839Y2 (ru) 1985-12-26 1985-12-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985199187U JPH0230839Y2 (ru) 1985-12-26 1985-12-26

Publications (2)

Publication Number Publication Date
JPS62107450U JPS62107450U (ru) 1987-07-09
JPH0230839Y2 true JPH0230839Y2 (ru) 1990-08-20

Family

ID=31160573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985199187U Expired JPH0230839Y2 (ru) 1985-12-26 1985-12-26

Country Status (1)

Country Link
JP (1) JPH0230839Y2 (ru)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577135A (en) * 1980-06-16 1982-01-14 Mitsubishi Electric Corp Wire bonding apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS626687Y2 (ru) * 1981-05-20 1987-02-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577135A (en) * 1980-06-16 1982-01-14 Mitsubishi Electric Corp Wire bonding apparatus

Also Published As

Publication number Publication date
JPS62107450U (ru) 1987-07-09

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