JPH02301184A - Application of small amount of viscous body to chip component - Google Patents

Abstract

PURPOSE:To enable a fixed quantity of application to the minute part of a chip component by inserting an application pin, for applying viscous body on a work to be applied, up to the midway of a through hole from below the through hole, which is opened vertically in a plate holding viscous body on the surface, and providing a minute recess which can determine a fixed volume. CONSTITUTION:A doctor 4 is shifted parallel pushing against the top of a plate 5 so as to fill viscous body 2 in a minute recess 8 formed by a through hole 5 of the plate and an application pin 1. Next, the application pin rises and it holds the viscous body 2 of thermosetting adhesives at the top of the application pin 1. Next, the viscous body 2 held by the top of the application pin 1 is applied, by pushing it against, on a work 3 to be applied, and then the application pin is lowered. By making the application pin 1 hold a fixed quantity of viscous body 2 at the top, the viscous body 2 can be applied in a fixed quantity on a terminal 3 of a integral body.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for applying a small amount of viscous material to chip components in electronic components.

BACKGROUND OF THE INVENTION In recent years, as set products have become smaller, electronic components have been increasingly made into chips. Even in the application of viscous material, which is important in the production of electronic components, it is necessary to apply a very small amount and a fixed amount.

A conventional method of applying a small amount of viscous material to chip components will be described below.

FIG. 3 shows a conventional apparatus for applying a small amount of viscous material to chip components. In FIG. 3, 11 is a viscous substance, 12 is a nozzle, and 13 is a pipe through which the viscous substance flows. Reference numeral 14 is a viscous ejector that makes a movement to eject the viscous stored inside at a set timing. 15 is a workpiece to be coated, and 16 is a workpiece holder.

The operation of the bag N1 for applying a small amount of viscous material to a chip component configured as described above will be explained below.

First, the nozzle 12 moves and approaches the application part of the workpiece 15 (.Next, the viscous substance 11 is ejected by the viscous jetter 14 and adheres to the application part of the workpiece 15.Next, The nozzle 12 moves and returns to its original state.

Problems to be Solved by the Invention However, in the conventional configuration described above, due to changes in the piping resistance of the nozzle 12 and the piping 13, the amount of viscous 11 spouted by the viscous jetter 14 changes slightly, resulting in a small amount of viscosity. No coating is obtained.

Furthermore, when the machine is introduced into an automatic machine for chamfering a large number of chamfers, the machine becomes expensive and the viscous substance 11 solidifies inside the nozzle 12 due to the ejection pressure, requiring maintenance and inspection of the machine.

The present invention solves the above-mentioned conventional problems, and aims to provide a method for applying a small amount of viscous material to chip components, which enables quantitative application.

Means for Solving the Problem In order to solve this problem, the method of applying a small amount of viscous to a chip component of the present invention is to apply a small amount of viscous to a workpiece from below a through hole made vertically in a plate that holds a viscous on the upper surface. By inserting the applicator bottle for applying the viscous substance halfway into the through hole, a minute recess that can secure a constant volume is created, and by moving the doctor in the horizontal direction while pressing the doctor against the top surface of the plate, the recess is removed. After filling the container with the viscous material and removing the viscous material exceeding the volume of the recess, the application bottle is raised, and the application bottle, which has a predetermined amount of the viscous material held at its tip, is moved to the workpiece held by the workpiece holder. This is a method for applying a fixed amount of viscous material to a workpiece by pressing it against the workpiece.

Function: In this method, a controlled amount of viscous material can always be held at the tip of the coating bottle by connecting the through hole of the plate with the minute recess formed by the coating bottle. In addition, by sharing the mechanism that performs the series of operations described above in an automatic machine, it is possible to easily manufacture a multi-piece automatic machine.Furthermore, since the external pressure on the viscous material is small, the occurrence of coagulation of the viscous material is reduced.

EXAMPLE An example of the present invention will be described below with reference to the drawings.

FIG. 1 shows the application of a thermosetting adhesive (hereinafter referred to as sticky material) to a chip component in an embodiment of the present invention, in which 1 is a coating bottle, 2 is sticky material, 3 is a workpiece to be coated, 4 is a doctor,
5 is a plate having a through hole 7 in the vertical direction, and 6 is a work holder.

The operation will be explained below using FIGS. 2a to 2d.

First, the doctor 4 is moved horizontally while pressing against the upper surface of the plate 5, and as shown in FIG. Fill with viscous material 2 as follows. Next, as shown in FIG. 2C, the applicator bottle 1 is raised to hold the thermosetting adhesive 2 at the tip of the applicator pin 1. Next, as shown in FIG. 2d, the sticky substance 2 held at the tip of the coating bottle 1 is applied to the workpiece
After applying by pressing it against the surface, it descends.

As described above, according to this embodiment, by holding a fixed amount of the viscous material 2 at the tip of the coating bottle 1, it is possible to apply a fixed amount of the viscous material 2 to the continuum terminal 3.

Note that in this example, the thermosetting adhesive may be replaced with another viscous material.

Effects of the Invention As described above, the present invention maintains a certain amount of viscous material in a minute recess made up of a through hole on a plate and a coating bottle, and retains a fixed amount of viscous substance at the tip of the coating bottle. It is possible to apply a fixed amount to minute parts of parts, and its practical effects are great.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of the method of applying a small amount of viscous material to a chip component according to the present invention, FIG. FIG. 1... Application bottle, 2... Viscous, 3...
...Workpiece to be coated, 4...Doctor, 5.
...Plate, 6...Work holder, 7
...Through hole, 8...Minute recess. Name of agent: Patent attorney Shigetaka Awano and 18 other drugs l Figure 2

Claims (1)

[Claims] By inserting the applicator pin that applies the viscous material onto the work to be coated halfway into the through-hole from below the through-hole vertically drilled in the plate that holds the viscous material on the top surface, a minute recess that can secure a constant volume is created. By moving the doctor in the horizontal direction while pressing the doctor against the top surface of the plate, the recesses are filled with the viscous material and the viscous material exceeding the volume of the recesses is removed, and then the application pin is raised to remove the tip. A method for applying a fixed amount of viscous material onto a workpiece by pressing the applicator pin holding a certain amount of viscous material onto the workpiece held by a workpiece holder. How to apply a small amount of viscous material.