CN216857179U

CN216857179U - Wafer-level glue dispensing device

Info

Publication number: CN216857179U
Application number: CN202221140695.XU
Authority: CN
Inventors: 张勇庆; 余启川; 王吉
Original assignee: Meidikai Zhejiang Intelligent Photoelectric Technology Co ltd
Current assignee: Meidikai Zhejiang Intelligent Photoelectric Technology Co ltd
Priority date: 2022-05-13
Filing date: 2022-05-13
Publication date: 2022-07-01
Anticipated expiration: 2032-05-13

Abstract

The utility model discloses a wafer-level glue dispensing device, which comprises an upper die and a lower die, wherein a contraposition structure is arranged between the upper die and the lower die, the upper die and the lower die are combined in a contraposition mode through the contraposition structure, a dipping die is installed at the bottom of the upper die, glue dispensing bulges are respectively and correspondingly arranged on glue dispensing points of a workpiece on the dipping die, a mounting position is arranged on the contraposition dipping die on the lower die, a tray and the workpiece can be mounted in the mounting position in a contraposition mode, a glue filling opening is formed in the tray and corresponds to the glue dispensing bulges, glue dispensing bulges are filled with glue liquid in the glue filling opening, the tray is mounted on the lower die, when the upper die and the lower die are combined, the glue dispensing bulges are contacted with the glue liquid when the upper die and the lower die are combined, and the glue dispensing bulges are contacted with the glue dispensing points on the workpiece. The wafer-level dispensing device is simple to manufacture and low in cost, dispensing of all dispensing points is completed at one time, and dispensing efficiency is high; the dispensing time is short, and the dispensing uniformity is improved.

Description

Wafer-level glue dispensing device

Technical Field

The utility model relates to the technical field of micro-optical module packaging and micro-optical wafer manufacturing, in particular to a wafer-level glue dispensing device.

Background

The most common fluid dispensing process in the market mainly comprises: the single nozzle contact type glue dispensing and non-contact type glue spraying process. For high-density wafer-level micro-optical module packaging and micro-optical wafers, single-nozzle contact type dispensing is still adopted at present, and the single-nozzle fluid dispensing process needs longer processing time to complete the dispensing process of the whole wafer. And the long dispensing process can affect the uniformity of dispensing shape. Therefore, how to realize one-time dispensing of the whole wafer to shorten the process time, thereby improving the uniformity of the glue formation on the whole wafer is a technical problem which needs to be solved urgently.

SUMMERY OF THE UTILITY MODEL

In order to solve the above technical problems, the present invention provides a wafer level dispensing device.

The utility model adopts the following technical scheme:

the utility model provides a wafer level adhesive deposite device, including last mould and lower mould, it is provided with counterpoint structure to go up between mould and lower mould, it merges through counterpoint structure counterpoint to go up mould and lower mould, it installs the flooding mould to go up the mould bottom, the point of gluing that corresponds the work piece on the flooding mould corresponds respectively and is provided with the point arch of gluing, the flooding mould of counterpointing is provided with the setting position on the lower mould, can counterpoint on the setting position and settle tray and work piece, it is provided with the mouth of gluing to correspond the point arch on the tray, it has the glue solution to fill in the glue filling mouth, the tray is settled on the lower mould, when going up mould and lower mould and merging, the protruding contact glue solution of point is glued to the point on the protruding contact work piece of point of gluing, the time of going up mould and lower mould and merging, the point is glued to the point on the protruding contact work piece.

Preferably, the glue solution is epoxy resin, conductive glue, adhesive or welding flux.

Preferably, the lower die is provided with a placement groove matched with the workpiece and the tray for installation, and the lower die is detachably connected with the workpiece and the tray through the placement groove.

Preferably, the workpiece and the tray are provided with clamping pieces which are connected with the placing grooves in a clamping mode.

The utility model has the beneficial effects that: (1) the utility model designs a wafer-level dispensing device which is simple to manufacture and low in cost, and can complete dispensing of all dispensing points at one time, so that the dispensing efficiency is high; (2) the dispensing time is short, and the dispensing uniformity is improved.

Drawings

FIG. 1 is a schematic view of a configuration of the present invention without the pallet and workpiece positioned;

FIG. 2 is a schematic diagram of a structure of the tray of the present invention;

FIG. 3 is a schematic view of a structure for placing the tray according to the present invention;

FIG. 4 is a schematic view of one configuration of an immersion die dip tray of the present invention;

FIG. 5 is a schematic view of one configuration of the impregnation die of the present invention off the tray;

FIG. 6 is a schematic view of a structure of the present invention in which a workpiece is placed;

FIG. 7 is a schematic view of a structure of the present invention for pressing the dipping mold and the workpiece;

FIG. 8 is a schematic view of a configuration of the immersion die of the present invention away from the workpiece;

in the figure: 1. the method comprises an upper die, 2, a lower die, 3, a dipping die, 4, a dispensing bulge, 5, a tray, 6, a glue filling port, 7, glue solution, 8, a workpiece, 9 and a dispensing point.

Detailed Description

The technical scheme of the utility model is further described in detail by the following specific embodiments in combination with the attached drawings:

example (b): as shown in fig. 1, a wafer level adhesive deposite device, including last mould 1 and lower mould 2, it is provided with the counterpoint structure to go up between mould and the lower mould, it merges through the counterpoint structure counterpoint to go up mould and lower mould, go up the mould bottom and install impregnation mould 3, the point of glue 9 that corresponds the work piece on the impregnation mould corresponds respectively and is provided with some glue arch 4, counterpoint impregnation mould is provided with the position of settling on the lower mould, can counterpoint on the position of settling tray 5 and work piece 8, it is provided with out jiao kou 6 to correspond some glue arch on the tray, it is filled with glue solution 7 to fill in the jiao kou, the tray is settled on the lower mould, when going up mould and lower mould and merging, the protruding contact glue solution of point on the work piece is glued to the point. The glue solution is epoxy resin, conductive glue, adhesive or welding flux. The lower die is provided with a placement groove matched with the workpiece and the tray for installation, and the lower die is detachably connected with the workpiece and the tray through the placement groove. The workpiece and the tray are provided with clamping pieces which are connected with the placing grooves in a clamping manner.

The wafer-level glue dispensing device comprises the following use processes:

as shown in fig. 2, the glue solution is filled into the glue filling opening corresponding to the dispensing protrusion on the tray.

As shown in fig. 3, the dipping mold with the dispensing protrusion of the specific customized pattern is arranged corresponding to the workpiece, and the tray filled with the glue solution is aligned.

As shown in fig. 4, the aligned dispensing bumps of the dipping dies are dipped into a tray filled with glue solution.

As shown in fig. 5, the dispensing projection of the dipping mold dipped with the glue solution is separated from the tray, and the glue solution is transferred to the dispensing projection of the dipping mold after separation.

As shown in fig. 6, the dipping mold with the glue is aligned with the work (working mold, chip, electronic component, etc.).

As shown in fig. 7, the aligned impregnation die is combined with the workpiece by the upper and lower dies.

The combined impregnation die and workpiece are separated again as shown in fig. 8. At the moment, the glue solution can be transferred to the glue dispensing points of the workpiece from the glue dispensing bulges of the dipping die, and the whole integral one-time glue dispensing process of all the glue dispensing points is completed.

The above-described embodiments are only preferred embodiments of the present invention, and are not intended to limit the present invention in any way, and other variations and modifications may be made without departing from the spirit of the utility model as set forth in the claims.

Claims

1. The utility model provides a wafer level adhesive deposite device, includes mould and lower mould, is provided with counterpoint structure between mould and lower mould, goes up mould and lower mould and merges through counterpoint structure counterpoint, characterized by, go up the mould bottom and install the flooding mould, the point of gluing that corresponds the work piece on the flooding mould corresponds respectively and is provided with the point arch of gluing, counterpoint flooding mould is provided with the position of settling on the lower mould, can counterpoint on the position of settling tray and work piece, it is provided with the mouth of gluing to correspond the point arch on the tray, the mouth of gluing is filled with the glue solution to fill, the tray is settled on the lower mould, when going up mould and lower mould and merging, the protruding contact glue solution of gluing is settled on the work piece, when going up mould and lower mould and merging, the point of gluing on the protruding contact work piece.

2. The wafer level dispensing apparatus of claim 1, wherein the glue solution is an epoxy, a conductive glue, an adhesive or a flux.

3. The wafer level glue dispensing device as claimed in claim 1, wherein the lower mold is provided with a placement groove for accommodating the workpiece and the tray, and the lower mold is detachably connected with the workpiece and the tray through the placement groove.

4. The wafer level dispensing apparatus as claimed in claim 1, wherein the workpiece and the tray are provided with engaging members for engaging with the slots.