CN111017864A - MEMS packaging part based on 3D printing and packaging method - Google Patents
MEMS packaging part based on 3D printing and packaging method Download PDFInfo
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- CN111017864A CN111017864A CN201910923585.7A CN201910923585A CN111017864A CN 111017864 A CN111017864 A CN 111017864A CN 201910923585 A CN201910923585 A CN 201910923585A CN 111017864 A CN111017864 A CN 111017864A
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
- B81B7/0016—Protection against shocks or vibrations, e.g. vibration damping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
- B81B7/0019—Protection against thermal alteration or destruction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0083—Temperature control
- B81B7/009—Maintaining a constant temperature by heating or cooling
- B81B7/0093—Maintaining a constant temperature by heating or cooling by cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
- B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
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Abstract
The invention discloses an MEMS packaging part based on 3D printing, which comprises a substrate, an MEMS device, a lead frame and a hollow packaging cover plate for 3D printing; a bonding pad is arranged on the substrate; the packaging cover plate and the substrate are aligned and bonded to form a hollow packaging body, the MEMS device is arranged in the cavity and fixed on the substrate, the MEMS device is electrically connected with a bonding pad on the substrate, and the bonding pad is electrically connected with the lead frame; one side of the packaging cover plate, which is far away from the MEMS device, is printed with a containing groove, and a getter is placed in the containing groove. The invention also discloses a packaging method, which comprises the following steps: s01, printing the hollow packaging cover plate through a 3D printing technology; thinning or scribing the wafer to obtain a substrate; s02, fixing the MEMS device on the substrate, connecting the MEMS device with a bonding pad on the substrate, and connecting the bonding pad with the lead frame; and S03, aligning and bonding the package cover plate and the substrate to form a package body. The packaging piece and the packaging method have the advantages of low cost, good thermal conductivity, good shock resistance, high vacuum degree, simple process and the like.
Description
Technical Field
The invention mainly relates to the technical field of MEMS packaging, in particular to an MEMS packaging piece based on 3D printing and a packaging method.
Background
MEMS packaging refers to a housing for mounting a MEMS device, which is connected by wires to pins of the package housing through contacts on the device, which in turn are connected to other devices through sockets on a printed circuit board. MEMS packaging functions to protect the delicate integrated circuits from mechanical and environmental aggressions, and to ensure the transfer of energy and the transformation of signals between the inside and outside of the device and between the components, which is generally carried out in four major steps of device preparation, surface bonding, wire bonding and packaging. Currently, MEMS bonding technology is the most challenging and important technology in MEMS packaging. The bonding technology comprises anodic bonding, silicon fusion bonding, glass slurry bonding, eutectic bonding, cold pressure welding bonding and other bonding technologies.
At present, the packaging cover plates adopted by the MEMS packaging bonding technology are solid and simple in structure, the requirements of application scenes such as getter placement in a sealed cavity, multi-channel MEMS device packaging and the like cannot be met, the die sinking cost is high, and the research and development period is long. The conventional getter is directly arranged on the substrate, on one hand, the getter occupies the space of the MEMS package, which results in lower yield than the MEMS package without the getter, and on the other hand, the heat generated by the getter directly arranged on the substrate when being heated and activated is greatly transferred to the MEMS device through the package substrate.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: aiming at the technical problems in the prior art, the invention provides the 3D printing-based MEMS packaging part which is low in cost, good in heat conductivity, good in impact resistance and high in vacuum degree, and correspondingly provides the packaging method with simple steps.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
a MEMS packaging part based on 3D printing comprises a substrate, an MEMS device, a lead frame and a 3D printed hollow packaging cover plate; a bonding pad is arranged on the substrate; the packaging cover plate and the substrate are aligned and bonded to form a hollow packaging body, the MEMS device is installed in a cavity of the packaging body and fixed on the substrate, a signal pin of the MEMS device is electrically connected with a bonding pad on the substrate, and the bonding pad is electrically connected with the lead frame; an accommodating groove is printed on one side, far away from the MEMS device, of the packaging cover plate, and a getter is placed in the accommodating groove.
As a further improvement of the above technical solution:
the hollow structure of the packaging cover plate is a honeycomb structure, an inwards concave quadrilateral structure, a chiral structure or a circular structure.
The packaging cover plate and the substrate are aligned and bonded to form a plurality of cavities, and adjacent cavities are sealed mutually or provided with vent grooves.
The invention also discloses a packaging method of the MEMS packaging part based on 3D printing, which comprises the following steps:
s01, printing the hollow packaging cover plate through a 3D printing technology; thinning or scribing the wafer to obtain a substrate;
s02, fixing the MEMS device on a substrate, connecting the MEMS device with a bonding pad on the substrate through a signal pin, and connecting the bonding pad with a lead frame;
and S03, aligning and bonding the package cover plate and the substrate to form a package body.
As a further improvement of the above technical solution:
in step S02, the MEMS device is adhered and fixed to the substrate, and the specific processes sequentially include: dispensing, sticking, curing and baking; and the MEMS device signal pin is electrically connected with the bonding pad of the substrate through wire bonding or cold brazing.
In step S03, performing alignment bonding of the package cover plate and the substrate in a vacuum environment, wherein the bonding is cold solder bonding, organic adhesive bonding or glass paste bonding; wherein the metal solder adopted by cold brazing bonding is tin, lead or silver; the organic adhesive used for bonding the organic adhesive is epoxy resin; the glass slurry bonding mode adopts glass slurry.
In step S03, printing an epoxy adhesive pattern by screen printing, attaching the package cover plate to the substrate, and directly bonding with epoxy resin in a vacuum environment; or the packaging cover plate is firstly bonded with glass, ceramics, silicon oxide or silicon carbide or lithium phosphate material and then indirectly bonded with the substrate.
After step S03, package post-processing is performed according to process requirements, where the post-processing includes injection molding, electroplating, or trimming.
In step S01, the materials required for printing the package cover plate include 40 parts of cyanate ester resin, 30 parts of epoxy resin, 28 parts of acrylate, 1.5 parts of photoinitiator, 0.2 part of defoaming agent, 0.2 part of polymerization inhibitor and 0.1 part of light absorber.
In step S01, the printed package cover is further post-processed: carrying out secondary exposure when the packaging cover plate is made of resin material; and when the packaging cover plate is made of a ceramic material, later-stage sintering is carried out, and when the packaging cover plate is made of a metal material, annealing and shot blasting are carried out.
Compared with the prior art, the invention has the advantages that:
according to the MEMS packaging part and the packaging method based on 3D printing, the hollow packaging cover plate is integrally formed by adopting the micro-nano 3D printing technology, and compared with the traditional micro-processing mode of the packaging cover plate, the mold opening cost and the injection molding process can be saved, so that the packaging cost is reduced, and the product research and development period is shortened; the packaging cover plate adopts a hollow structure, so that the heat conductivity, the impact resistance and the strength/mass ratio of the packaging cover plate are improved; the getter is arranged in the cavity of the packaging body, so that the vacuum degree in the cavity of the packaging body is improved, meanwhile, the getter is placed in the accommodating groove of the packaging cover plate far away from one side of the MEMS device, the packaging space for directly placing the getter can be omitted, and meanwhile, the phenomenon that the heat generated when the getter is activated is transferred to the MEMS device to influence the normal work of the MEMS device is avoided.
Aiming at research and development and batch production of novel MEMS sensors, the invention creatively combines the advantages of the 3D printing technology with MEMS packaging, designs and optimizes a more reasonable and more economic MEMS packaging structure meeting specific application scenes, and applies the 3D printing technology to form an MEMS packaging cover plate at one time so as to be indirectly or directly bonded with a substrate; the mold opening cost and the injection molding process of the traditional packaging cover plate are saved, the packaging method is suitable for packaging the MEMS sensor with less batches, multiple varieties and customization, the development period of the sensor is shortened, and the heat conductivity, the impact resistance and the strength/quality of the packaging can be improved by designing and optimizing the packaging cover plate structure.
Drawings
Fig. 1 is a schematic structural view of a MEMS package of the present invention in an embodiment (a package cover plate of a honeycomb structure).
Fig. 2 is a schematic structural diagram of a MEMS package according to an embodiment of the present invention (a package cover plate with a concave quadrilateral structure).
Fig. 3 is a schematic structural diagram of a MEMS package according to an embodiment of the present invention (a package cover plate with a circular structure).
Fig. 4 is a schematic structural diagram (with receiving groove) of the MEMS package according to an embodiment of the invention.
Fig. 5 is a schematic structural view (double cavity) of a MEMS package of the present invention in an embodiment.
Fig. 6 is a graph comparing the energy absorption effect of the MEMS packages of the present invention.
The reference numbers in the figures denote: 1. a substrate; 2. a binder; 3. a silicon wafer; 4. a MEMS device; 5. a pad; 6. a lead frame; 7. packaging the cover plate; 8. a cavity; 9. a vent channel; 10. and (6) accommodating the tank.
Detailed Description
The invention is further described below with reference to the figures and the specific embodiments of the description.
As shown in fig. 1 to 5, the MEMS package based on 3D printing of the present embodiment includes a substrate 1, a MEMS device 4, a lead frame 6, and a 3D printed hollow package cover plate 7; a bonding pad 5 is arranged on the substrate 1; the packaging cover plate 7 is aligned and bonded with the substrate 1 to form a hollow packaging body, the MEMS device 4 is arranged in a cavity 8 of the packaging body and fixed on the substrate 1, a signal pin of the MEMS device 4 is electrically connected with a bonding pad 5 on the substrate 1, the bonding pad 5 is electrically connected with a lead frame 6, and the lead frame 6 is connected with the outside; the side of the package cover plate 7 remote from the MEMS device 4 is printed with a receiving cavity 10, and a getter (not shown in the figure) is placed in the receiving cavity 10.
According to the MEMS packaging part based on 3D printing, the hollow packaging cover plate 7 is integrally formed by adopting a micro-nano 3D printing technology, and compared with the traditional micro-processing mode of the packaging cover plate 7, the micro-processing method can save the die sinking cost and the injection molding process, thereby reducing the packaging cost and shortening the product research and development period; the packaging cover plate 7 adopts a hollow structure, so that the heat conductivity, the shock resistance and the strength/mass ratio of the packaging cover plate 7 are improved; the getter is arranged in the cavity 8 of the packaging body, the vacuum degree in the cavity 8 of the packaging body is improved, meanwhile, the getter is placed in the accommodating groove 10 of the packaging cover plate 7 far away from one side of the MEMS device 4, the packaging space for directly placing the getter can be omitted, and meanwhile, the situation that the normal work of the MEMS device 4 is influenced due to the fact that heat generated when the getter is activated is transferred to the MEMS device 4 is avoided.
In this embodiment, the hollow structure of the package cover plate 7 is a honeycomb structure, an inwardly concave quadrilateral structure, a chiral molecular structure or a circular structure, and the heat conductivity, the impact resistance and the strength/mass ratio are improved by the above structures. In addition, the whole shape of the package cover plate 7 is square or dome-shaped, or the package cover plate 7 is an integrally formed package cover plate 7 with a plurality of cavities 8 connected by vent grooves 9, the package cover plate 7 is aligned and bonded with the substrate 1 to form a plurality of cavities 8, adjacent cavities 8 are communicated through the vent grooves 9, and naturally, the cavities 8 can be sealed. By comparing the energy absorption effect obtained by the package cover plate 7 with the above structure in the finite element software ABAQUS with the same material parameters and boundary conditions, it can be seen that the energy absorption capacity is as follows: circular structure > indent quadrangle ═ honeycomb structure > solid construction.
The invention also correspondingly discloses a packaging method of the MEMS packaging part based on 3D printing, which comprises the following steps:
s01, printing the hollow packaging cover plate 7 by a 3D printing technology; thinning or scribing the wafer to obtain a substrate 1;
s02, fixing the MEMS device 4 on the substrate 1, connecting the MEMS device with a bonding pad 5 on the substrate 1 through a signal pin, and connecting the bonding pad 5 with the lead frame 6;
and S03, aligning and bonding the packaging cover plate 7 and the substrate 1 to form a packaging body, wherein the MEMS device 4 is packaged in a cavity of the packaging body and is connected with the outside of the packaging body through the lead frame 6.
In this embodiment, after step S03, post-processing, such as injection molding, electroplating or rib cutting, is performed according to the process requirement.
In this embodiment, the micro-nano 3D printing technology in step S01 may be a Stereolithography 3D printing technology (SLA), a Selective Laser Sintering (SLS), a Fused Deposition Modeling (FDM), a Layered Object Manufacturing (LOM), a Direct Metal Laser Sintering (DMLS), or an Electron Beam Melting (EBM); in addition, in order to ensure the bonding quality and the process requirement of the MEMS, the material is high-temperature resistant and high-strength. The printed package cover plate 7 is subjected to post-treatment, such as secondary exposure of resin materials, post-sintering of ceramic materials, annealing and shot blasting of metal materials, and the like.
In this embodiment, the wafer thinning in step S01 may be thinning by a thinning machine or Chemical Mechanical Polishing (CMP), and the scribing may be wheel scribing, laser scribing, or plasma scribing.
In this embodiment, in step S02, the MEMS device 4 is fixed to a predetermined position of the silicon wafer 3 on the substrate 1 by the adhesive 2, and the specific processes sequentially include: dispensing, sticking, curing and baking; the signal pins of the MEMS device 4 are electrically connected to the pads 5 of the substrate 1 by wire bonding or cold soldering or other electrical connection methods.
In this embodiment, in step S03, the alignment bonding of the package cover plate 7 and the substrate 1 is performed in a vacuum environment, and the bonding manner is cold solder bonding, epoxy bonding, or glass paste bonding. Wherein, the cold brazing adopts metal solders such as common low-temperature metal solders of tin, lead, silver and the like; organic binders such as epoxy resins used for organic binder bonding; the glass slurry bonding mode adopts glass slurry and the like. The printing method of the metal paste, the organic binder and the glass paste may be screen printing, mask printing, cast printing, etc.
The above method of the invention is further illustrated below with reference to a complete example, in particular:
(1) encapsulation cover plate 7 modeling
The packaging cover plate 7 is a hemisphere with the radius of 2.5mm and the wall thickness of 1mm, and 12 honeycomb structures with the circumcircles of 0.5mm are uniformly distributed in the packaging cover plate 7;
(2) model section
The model was centered and sliced at 20 micron layer thickness with sliceshop slicing software;
(3) material selection
In order to ensure the bonding quality of the MEMS, the material is high-temperature resistant resin which comprises 40 parts of cyanate ester resin, 30 parts of epoxy resin, 28 parts of acrylate, 1.5 parts of photoinitiator, 0.2 part of defoaming agent, 0.2 part of polymerization inhibitor and 0.1 part of light absorbent;
(4)3D print platform places
Selecting P140 (molar material, Shenzhen) P mu SL 3D printing equipment, and cleaning and horizontally placing the printing platform;
(5) 3D printing parameter setting and printing of packaging cover plate 7
Setting different printing parameters according to different resin materials, optical machine parameters and layer thicknesses, and starting printing by taking light intensity of 45mw/mm2, exposure time of 4s and printing layer thickness of 20 mu m as specific parameters;
(6) removing the encapsulation cover 7 and post-treating
Taking out the packaging cover plate 7, carrying out ultrasonic treatment by using alcohol, carrying out ultrasonic treatment, and then putting into a secondary curing box to be cured for half an hour to 2 hours;
(7) wafer thinning/dicing
Thinning the common plastic package integrated circuit wafer, scribing by adopting a diamond blade, and controlling the scribing cutting feed speed to be less than 10 mm/s;
(8) adhesive sheet
The MEMS device 4 is bonded on the lead frame 6 by adopting an IC device bonding technology, and the specific technological process comprises the following steps: dispensing, sticking, curing and baking;
(9) wire bonding
Placing a lead frame 6, and electrically connecting a bonding pad 5 of the MEMS device 4 with the lead frame 6 by adopting an ultrasonic ball welding 70-micron gold wire;
(10) bonding of
Printing an epoxy bonding pattern in a screen printing mode, buckling the 3D printing packaging cover plate 7 and the substrate 1, and directly bonding by adopting epoxy resin in a vacuum environment. In other embodiments, the package cover 7 may also be indirectly bonded to the substrate 1, such as bonding the package cover 7 to the substrate 1 after bonding the package cover 7 to the substrate 1.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to be limited thereto. Those skilled in the art can make numerous possible variations and modifications to the present invention, or modify equivalent embodiments to equivalent variations, without departing from the scope of the invention, using the teachings disclosed above. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention should fall within the protection scope of the technical scheme of the present invention, unless the technical spirit of the present invention departs from the content of the technical scheme of the present invention.
Claims (10)
1. The MEMS packaging part based on 3D printing is characterized by comprising a substrate (1), an MEMS device (4), a lead frame (6) and a 3D printed hollow packaging cover plate (7); a bonding pad (5) is arranged on the substrate (1); the packaging cover plate (7) is aligned and bonded with the substrate (1) to form a hollow packaging body, the MEMS device (4) is installed in a cavity (8) of the packaging body and fixed on the substrate (1), a signal pin of the MEMS device (4) is electrically connected with a bonding pad (5) on the substrate (1), and the bonding pad (5) is electrically connected with the lead frame (6); an accommodating groove (10) is printed on one side, far away from the MEMS device (4), of the packaging cover plate (7), and a getter is placed in the accommodating groove (10).
2. The MEMS package based on 3D printing according to claim 1, characterized in that the hollow structure of the package cover plate (7) is a honeycomb structure, an inwardly concave quadrilateral structure or a circular structure.
3. The MEMS package based on 3D printing according to claim 1, characterized in that the package cover plate (7) and the substrate (1) are aligned and bonded to form a plurality of cavities (8), and adjacent cavities (8) are sealed from each other or provided with vent grooves (9).
4. A method of packaging a MEMS package based on 3D printing according to claim 1 or 2 or 3, characterized in that it comprises the steps of:
s01, printing the hollow packaging cover plate (7) through a 3D printing technology; processing the wafer by thinning or scribing to obtain a substrate (1);
s02, fixing the MEMS device (4) on a substrate (1), connecting the MEMS device with a bonding pad (5) on the substrate (1) through a signal pin, and connecting the bonding pad (5) with a lead frame (6);
and S03, aligning and bonding the package cover plate (7) and the substrate (1) to form a package body.
5. The packaging method according to claim 4, wherein in step S02, the MEMS device (4) is adhesively fixed on the substrate (1) by the following steps: dispensing, sticking, curing and baking; and the signal pin of the MEMS device (4) is electrically connected with the bonding pad (5) of the substrate (1) through wire bonding or cold brazing.
6. The encapsulation method according to claim 4, wherein in step S03, the aligned bonding of the encapsulation cover plate (7) and the substrate (1) is performed in a vacuum environment, wherein the bonding is cold solder bonding, organic adhesive bonding or glass paste bonding; wherein the metal solder adopted by cold brazing bonding is tin, lead or silver; the organic adhesive used for bonding the organic adhesive is epoxy resin; the glass slurry bonding mode adopts glass slurry.
7. The encapsulation method according to claim 4, wherein in step S03, printing an epoxy adhesive pattern by screen printing, butting the encapsulation cover plate (7) against the substrate (1), and directly bonding with epoxy resin under vacuum; or the packaging cover plate (7) is bonded with glass, ceramics, silicon oxide or silicon carbide or lithium phosphate material, and then is indirectly bonded with the substrate (1).
8. The packaging method according to any one of claims 4 to 7, wherein after step S03, package post-processing is performed according to process requirements, and the post-processing includes injection molding, electroplating or rib cutting.
9. The packaging method according to any one of claims 4 to 7, wherein in step S01, the materials required for printing the package cover plate (7) include 40 parts of cyanate ester resin, 30 parts of epoxy resin, 28 parts of acrylate, 1.5 parts of photoinitiator, 0.2 part of defoamer, 0.2 part of polymerization inhibitor and 0.1 part of light absorber.
10. The encapsulation method according to any one of claims 4 to 7, wherein in step S01, the printed encapsulation cover plate (7) is subjected to post-processing: carrying out secondary exposure when the packaging cover plate (7) is made of resin material; and (3) performing post sintering when the packaging cover plate (7) is made of a ceramic material, and performing annealing and shot blasting when the packaging cover plate (7) is made of a metal material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910923585.7A CN111017864A (en) | 2019-09-27 | 2019-09-27 | MEMS packaging part based on 3D printing and packaging method |
| PCT/CN2020/096328 WO2021057109A1 (en) | 2019-09-27 | 2020-06-16 | 3d-printing-based mems package and packaging method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910923585.7A CN111017864A (en) | 2019-09-27 | 2019-09-27 | MEMS packaging part based on 3D printing and packaging method |
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| CN111017864A true CN111017864A (en) | 2020-04-17 |
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| WO (1) | WO2021057109A1 (en) |
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| WO2021057109A1 (en) * | 2019-09-27 | 2021-04-01 | 株洲国创轨道科技有限公司 | 3d-printing-based mems package and packaging method |
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| DE102021109180A1 (en) | 2021-04-13 | 2022-10-13 | Tdk Corporation | Cap, MEMS sensor device and manufacturing method |
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