JPH02103994A - Method for applying viscous substance on minute portion of chip part - Google Patents
Method for applying viscous substance on minute portion of chip partInfo
- Publication number
- JPH02103994A JPH02103994A JP63257507A JP25750788A JPH02103994A JP H02103994 A JPH02103994 A JP H02103994A JP 63257507 A JP63257507 A JP 63257507A JP 25750788 A JP25750788 A JP 25750788A JP H02103994 A JPH02103994 A JP H02103994A
- Authority
- JP
- Japan
- Prior art keywords
- pin
- applying
- workpiece
- solder
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 10
- 239000011345 viscous material Substances 0.000 title abstract description 20
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 16
- 239000006071 cream Substances 0.000 abstract description 12
- 238000010008 shearing Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coating Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子部品におけるチップ部品への粘体微小塗
布方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for applying a small amount of viscous material to chip components in electronic components.
従来の技術
近年、セット商品の小型化に伴ない、電子部品のチップ
化が進んでいる。その電子部品の製造上重要な粘体の塗
布においても、微小量かつ定量の塗布が必要とされてい
る。BACKGROUND OF THE INVENTION In recent years, as set products have become smaller, electronic components have been increasingly made into chips. Even in the application of viscous material, which is important in the production of electronic components, it is necessary to apply a minute amount and a fixed amount.
以下に従来のチップ部品への粘体微小塗布方法及び装置
について説明する。A conventional method and apparatus for applying a small amount of viscous material to chip components will be described below.
第４図は、従来のチップ部品への粘体微小塗布方法を示
すものである。第４図において、１１は塗布ピン、１２
は粘体、１３は被塗布ワークである。１４はスキージプ
レートで粘体を塗布ピン１１の上部のポット穴部へ押し
込む働きをする。FIG. 4 shows a conventional method of applying a small amount of viscous material to chip components. In Fig. 4, 11 is a coating pin, 12
1 is a sticky substance, and 13 is a workpiece to be coated. A squeegee plate 14 serves to push the sticky substance into the pot hole above the application pin 11.
１６はポットで粘体１２を留めておく。１６はワーク保
持体である。16 holds the viscous substance 12 in a pot. 16 is a work holder.
以上のように構成されたチップ部品への粘体微小塗布方
法について以下その動作について説明する。The operation of the method for applying a small amount of viscous material to a chip component configured as described above will be described below.
まず、スキージプレート１４が移動して塗布ビン１１上
部にあるポット１６の穴部に粘体１２を押し込む。次に
、塗布ピン１１が上昇することによって、粘体１２は塗
布ピン１１の先端に転写した後、被塗布ワーク１３に押
し当てられる。次に、塗布ピン１１は降下しスキージプ
レート１４も移動し元の状態に戻る。First, the squeegee plate 14 moves to push the sticky substance 12 into the hole of the pot 16 above the coating bottle 11. Next, as the applicator pin 11 rises, the sticky substance 12 is transferred to the tip of the applicator pin 11 and then pressed against the workpiece 13 to be coated. Next, the applicator pin 11 descends and the squeegee plate 14 also moves to return to its original state.
発明が解決しようとする課題
しかしなか、上記の従来の構成では、第６図に示すよう
にただ粘体１２を第５図ａ、第５図すに示すように被塗
布ワーク１３に押し当て塗布ピン１１を下降しているだ
けであり、被塗布ワーク１３と粘体１２の間にゴミ・油
膜等の異物の付着や、塗布ピン１１が降下する際の粘体
１２の不確実な分割位置（第５図ｃ 、 ｄ 、ｅ）に
示すように、被塗布ワーク１３への粘体残存量（塗布量
）にバラツキが生じる。Problems to be Solved by the InventionHowever, in the above conventional configuration, as shown in FIG. 6, the viscous material 12 is simply pressed against the workpiece 13 to be coated as shown in FIGS. 11 is only being lowered, there may be adhesion of foreign matter such as dust or oil film between the workpiece 13 and the sticky material 12, or an uncertain dividing position of the sticky material 12 when the applicator pin 11 is lowered (see Fig. 5). As shown in c, d, and e), variations occur in the amount of viscous remaining (coating amount) on the workpiece 13 to be coated.
本発明は上記従来の課題を解決するもので、定量塗布を
得られるチップ部品への粘体微小塗布方法及び装置を提
供することを目的とする。The present invention is intended to solve the above-mentioned conventional problems, and aims to provide a method and apparatus for applying a small amount of viscous material to a chip component, which enables quantitative application.
課題を解決するだめの手段
この課題を解決するために本発明のチップ部品への粘体
微小塗布方法は、円周方向に溝部を有する回転式ローラ
に斜め上方よシドクターを押し当てることによって、前
記回転式ロー２の溝部全周に渡って粘体を充てんさせ、
塗布ピンを前記回転式ローラの溝部に挿入することによ
って、前記塗布ピンの先端に粘体を転写する。次に前記
塗布ピンをワーク保持体によって保持された被塗布ワー
クに押し当てた後、前記被塗布ワークの端面を通過する
まで前記塗布ピンまたは被塗布ワークを水平移動させて
、被塗布ワークへの粘体の塗布を行う方法としている。Means for Solving the Problem In order to solve this problem, the method of applying a small amount of viscous material to a chip component according to the present invention involves pressing a doctor diagonally upward against a rotary roller having grooves in the circumferential direction. Fill the entire circumference of the groove of the formula row 2 with viscous material,
By inserting the applicator pin into the groove of the rotary roller, the sticky substance is transferred to the tip of the applicator pin. Next, after pressing the coating pin against the work to be coated held by the work holder, the coating pin or the work to be coated is horizontally moved until it passes the end face of the work to be coated. The method is to apply a sticky substance.
作用
この方法の中で、前記ドクターと、前記回転式ローラの
回転動作によシ、前記回転式ローラの溝部に常に定量の
粘体を保有することができて、塗布ピン先端への粘体の
転写量は定量を確保できる。Operation In this method, due to the rotational action of the doctor and the rotary roller, a certain amount of the viscous material can always be kept in the groove of the rotary roller, and the amount of the viscous material transferred to the tip of the applicator pin can be controlled. can ensure quantification.
次に１塗布ピン先端へ定量転写された粘体を被塗布ワー
クに押し当て、その端面を通過するまで塗布ピンまたは
被塗布ワークを水平移動させることにより、粘体を被塗
布ワークに押し当てながら、せん断力によって被塗布ワ
ークの端面部で分割させることが可能となるため、粘体
の分割位置を一定にさせ被塗布ワークへの粘体の残存量
（塗布量を定量にすることができる。Next, the sticky substance that has been quantitatively transferred to the tip of the first coating pin is pressed against the workpiece to be coated, and the coating pin or the workpiece to be coated is moved horizontally until it passes the end face, thereby shearing while pressing the sticky substance against the workpiece to be coated. Since it is possible to divide the workpiece at the end face using force, the dividing position of the sticky substance can be kept constant, and the remaining amount of the sticky substance (coating amount) on the workpiece can be quantified.
実施例
以下本発明の一実施例について、図面を参照しながら説
明する。EXAMPLE An example of the present invention will be described below with reference to the drawings.
第１図は本発明の一実施例におけるチップ部品のクリー
ム半田塗布を示すものである。第１図において、１は塗
布ピン、２は粘体としてのクリーム半田、３は連続体端
子、４はドクター、５は局面に溝５ａを形成した回転式
ローラ、６はワーク保持体である。FIG. 1 shows the application of cream solder to a chip component in one embodiment of the present invention. In FIG. 1, 1 is a coating pin, 2 is cream solder as a viscous substance, 3 is a continuous terminal, 4 is a doctor, 5 is a rotary roller having grooves 5a formed on its curved surface, and 6 is a workpiece holder.
以下その動作を説明する。The operation will be explained below.
まず、回転式ロー２５が回転してドクター４によってク
リーム半田２を回転式ローラ５の溝５１Ｌ部へ充てんす
る。次に、塗布ピン１が回転式ローラ６の真下に移動し
て、これと同時に回転式ロー２５は回転を停止する。次
に、塗布ピン１が上昇して回転式ローラ６の溝Ｓａ部に
挿入することによシ塗布ピン１の先端にクリーム半田２
を転写した後、塗布ピン１は降下してこれと同時に回転
式ロー２５は回転を開始する。次に塗布ピン１は連続体
端子３の塗布部真下に移動した後、上昇して塗布ピン１
の先端に転写されたクリーム半田２を連続体端子３の塗
布部に押し当て、その後連続体端子３の端面を通過する
まで塗布ピン１は水平移動して連続体端、子３にクリー
ム半田２を塗布し降下する。First, the rotary roller 25 rotates and the doctor 4 fills the groove 51L of the rotary roller 5 with cream solder 2. Next, the applicator pin 1 moves directly below the rotary roller 6, and at the same time, the rotary roller 25 stops rotating. Next, the applicator pin 1 rises and is inserted into the groove Sa of the rotary roller 6, so that the cream solder 2 is applied to the tip of the applicator pin 1.
After transferring, the applicator pin 1 descends, and at the same time, the rotary row 25 starts rotating. Next, the applicator pin 1 moves to just below the applicator part of the continuum terminal 3, and then rises to form the applicator pin 1.
The cream solder 2 transferred to the tip of the continuum terminal 3 is pressed against the applied part of the continuum terminal 3, and then the applicator pin 1 moves horizontally until it passes the end face of the continuum terminal 3, and the cream solder 2 is applied to the continuum end and the child 3. Apply and descend.
また、第２図ａ Ｎａは本発明の実施例における塗布ピ
ン１とクリーム半田２、連続体端子３の関係を、作用の
順に第１図におけるＸ −Ｘ断面で表わした状態図であ
る。第２図においてム部は、塗布ピン１を連続体端子３
の端面を通過するまで水平移動したことにより、クリー
ム半田２が安定して分割される位置を示す。Further, FIG. 2A is a state diagram showing the relationship among the applicator pin 1, cream solder 2, and continuum terminal 3 in the embodiment of the present invention, in the order of action, taken along the line X--X in FIG. 1. In FIG.
This shows the position where the cream solder 2 is stably divided by horizontally moving until it passes the end face of.
以上のように本実施例によれば、塗布ピン１を連続体端
子３の端面を通過するまで水平移動させたことによシ、
チップ部品の微小部分へクリーム半田２を定量に塗布す
ることができる。As described above, according to this embodiment, by horizontally moving the applicator pin 1 until it passes the end surface of the continuum terminal 3,
Cream solder 2 can be applied in a fixed amount to minute parts of chip components.
なお本実施例において、クリーム半田２は他の粘体に置
き換えてもよい。また塗布ピン１を水平移動させたが同
一タイミングであれば、被塗布ワークを水平移動させて
もよい。Note that in this embodiment, the cream solder 2 may be replaced with other viscous material. Furthermore, although the coating pin 1 is moved horizontally, the workpiece to be coated may be moved horizontally if the timing is the same.
発明の効果
以上のように本発明は、粘体を回転式ローラから塗布ピ
ンへ定量転写した後、塗布ピンを被塗布ワークの端面を
通過するまで水平移動することによシ、チップ部品の微
小部分への定量塗布ができ、その実用効果は大なるもの
である。Effects of the Invention As described above, the present invention transfers a fixed amount of viscous material from a rotary roller to a coating pin, and then moves the coating pin horizontally until it passes the end surface of the workpiece to be coated. It can be applied in a fixed amount to the skin, and its practical effects are great.
第１図は本発明の実施例におけるチップ部品の粘体微小
塗布方法の構成図、第２図ａＮｃは本発明の実施例を作
用の順で表わした状態図、第３図は回転式ローラの正面
図、第４図は従来のチップ部品の粘体微小塗布方法の構
成図、第５図ａ〜θは従来の粘体微小塗布を作用の順で
表わした状態図である。
１・・・・・・塗布ピン、２・・・・・クリーム半田、
３・・・・・・連続体端子、４・・・・・・ドクター、
５・・・・・・回転式ロー２．５ａ・・・・・・溝、６
・・・・・・ワーク保持体。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名簿
図
窮
図
第
図
第
図
ａ
第
図Fig. 1 is a block diagram of a method for applying a small amount of viscous material to chip parts according to an embodiment of the present invention, Fig. 2 aNc is a state diagram showing the embodiment of the present invention in the order of operation, and Fig. 3 is a front view of a rotary roller. 4 are block diagrams of a conventional method of applying a small amount of viscous material to chip components, and FIGS. 5A to 5 are state diagrams showing the conventional method of applying a small amount of viscous material in the order of operation. 1... Application pin, 2... Cream solder,
3...Continuum terminal, 4...Doctor,
5...Rotary row 2.5a...Groove, 6
・・・・・・Work holding body. Name of agent Patent attorney Shigetaka Awano and 1 other list
Claims (1)
ドクターを押し当てることによって、前記回転式ローラ
の溝部全周に渡って粘体を充てんさせ、塗布ピンを前記
回転式ローラの溝部に挿入することによって、前記塗布
ピンの先端に粘体を転写し、前記塗布ピンをワーク保持
体によって保持された被塗布ワークに押し当てた後、前
記被塗布ワークの端面を通過するまで前記塗布ピンまた
は被塗布ワークを水平移動させて、被塗布ワークへの粘
体の定量塗布を行うことを特徴としたチップ部品への粘
体微小塗布方法。By pressing a doctor from diagonally above against a rotary roller having a groove in the circumferential direction, the entire circumference of the groove of the rotary roller is filled with a sticky substance, and an applicator pin is inserted into the groove of the rotary roller. After transferring the sticky substance to the tip of the coating pin and pressing the coating pin against the workpiece to be coated held by the workpiece holder, the coating pin or the workpiece to be coated is pressed until it passes the end surface of the workpiece to be coated. A method for applying a small amount of viscous to chip parts, the method comprising applying a fixed amount of viscous to a workpiece by horizontally moving the viscosity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63257507A JPH0767009B2 (en) | 1988-10-13 | 1988-10-13 | Micro-viscosity micro-application method for chip parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63257507A JPH0767009B2 (en) | 1988-10-13 | 1988-10-13 | Micro-viscosity micro-application method for chip parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02103994A true JPH02103994A (en) | 1990-04-17 |
| JPH0767009B2 JPH0767009B2 (en) | 1995-07-19 |
Family
ID=17307258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63257507A Expired - Fee Related JPH0767009B2 (en) | 1988-10-13 | 1988-10-13 | Micro-viscosity micro-application method for chip parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0767009B2 (en) |
-
1988
- 1988-10-13 JP JP63257507A patent/JPH0767009B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0767009B2 (en) | 1995-07-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |