JP2009082876A - Liquid agent coating apparatus and liquid agent coating method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid agent coating apparatus with excellent working efficiency enables which transferring of a fine rod of the liquid agent and shortening of a working time. <P>SOLUTION: A predetermined amount of the liquid agent can be fed to an axial hole 15 of a liquid agent delivery guide body 16 by a liquid agent feeding means 16. The liquid agent of the axial hole 15 can be pressed to a liquid agent portion M to be coated by sliding a liquid agent pressing rod 18 through the axial hole in its axial direction. Thereby, the liquid agent is fed to the liquid agent delivery guide body 16 once and the fed liquid agent is pressed by the liquid agent pressing rod 18. It follows that the liquid agent S turns transferred to a pressing surface 18a of the liquid agent pressing rod 18 at pressing, and the liquid agent can be transferred to the liquid agent portion M to be coated by being pressed as intact. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a liquid agent applying apparatus, for example, a liquid agent applying apparatus and a liquid agent applying method for applying a liquid agent to an adhesive bonding portion (member to be bonded) when bonding a semiconductor chip (die) to a lead frame. It is.

  As this type of liquid application device, there is a device that conventionally uses a dispenser (for example, Patent Document 1, Patent Document 2, and Patent Document 3). That is, as shown in FIG. 2, the conventional liquid agent application apparatus includes a syringe 2 having a discharge nozzle (needle) 1 and supplied with a liquid agent (adhesive), and a dispenser that supplies high-pressure air to the syringe 2. 3.

  That is, high pressure air is discharged from the dispenser 3, and high pressure air is sent into the syringe 2. Thereby, the liquid agent (adhesive) in the syringe 2 is extruded from the opening of the nozzle 1. As shown in FIG. 3, the extruded liquid agent is grounded to the mount portion 5 of the lead frame 4, whereby the liquid agent is applied (transferred) to the mount portion 5.

  As another liquid application device, there is a so-called stamp method as shown in FIG. This apparatus includes a rotary table (rotary dish) 10 to which an adhesive (liquid agent) S is applied, and a transfer pin 11 that moves between the rotary dish 10 and the mount portion 5 of the lead frame 4 as indicated by an arrow A. With. The rotating plate 10 rotates around its axis.

That is, the transfer pin 11 is positioned above the liquid application part of the rotating dish 10, and then the transfer pin 11 is lowered to transfer the liquid S to the tip of the transfer pin 11, and then the transfer pin 11 is read. The frame 4 is positioned above the mount 5. Next, the transfer pin 11 is lowered to transfer the liquid agent adhering to the tip of the transfer pin 11 to the mount portion 5.
Japanese Patent Laid-Open No. 5-206179 JP 2000-125672 A JP 2002-110709 A

  As shown in FIG. 2 and FIG. 3, the liquid agent application apparatus using a dispenser has an advantage that the liquid agent S is not easily volatilized because the liquid agent S is stored in the syringe. However, in order to stabilize the amount of application to the mount 5, it is necessary to accurately set the gap G between the tip of the nozzle 1 and the mount 5 of the frame 4. When the gap G is set, it is set based on the thickness of the frame 4. However, the thickness of the frame 4 varies, and the gap G cannot be set accurately.

  Moreover, in the liquid agent coating apparatus using a dispenser, since the liquid agent S is pushed out from the nozzle 1, it is necessary for the nozzle 1 to secure an inner diameter that enables this extrusion. For this reason, there is a limit to the inner diameter of the nozzle 1. Moreover, if the liquid agent S is extruded through the nozzle 1, the liquid agent S extruded between the tip of the nozzle 1 and the mount portion 5 expands to the outer diameter of the nozzle 1. For this reason, it is difficult to transfer minute dots (for example, dots having a diameter of about 0.20 mm) with a liquid agent coating apparatus using a dispenser.

  In the stamp system shown in FIG. 4, the transfer pin 11 is pressed against the frame 4, so that the position movement control of the transfer pin 11 with respect to the frame 4 is easy. In addition, stable transfer is possible even if the thickness of the frame 4 varies and the supply height varies. Moreover, since the liquid S is not extruded into the nozzle hole, but transferred to the tip of the transfer pin 11, it is possible to form minute dots.

  However, it is necessary to move the transfer pin 11 as shown by an arrow A shown in FIG. 4, and this movement distance becomes large. For this reason, a space for securing the moving distance is required, resulting in an increase in size of the entire apparatus, and it takes time to move the transfer pin 11, and thus productivity cannot be improved. Furthermore, it is necessary to adjust the timing of the transfer operation of the liquid agent on the rotating dish 10 by the transfer pin 11 and the transfer operation of the liquid agent to which the transfer pin 11 is adhered to the mount portion 5 of the frame 4, which causes a problem in controllability. There is. Further, the transfer pin 11 is moved in a state where the liquid agent S is attached to the tip of the transfer pin 11. If the transfer agent 11 is moved at a high speed, the attached liquid agent may be scattered from the transfer pin 11. For this reason, it is necessary to slow down the moving speed of the transfer pin 11, and there is a problem that the working time becomes longer.

  In view of the above-described problems, the present invention provides a liquid agent coating apparatus capable of transferring a micro rod of a liquid agent and reducing work time and having excellent work efficiency.

  A liquid agent application apparatus according to the present invention includes a liquid agent discharge guide body having an axial hole, a liquid supply means for supplying a predetermined amount of liquid agent to the axial hole of the liquid agent discharge guide body, and a liquid agent discharge guide body A liquid extrusion rod that slides in the axial direction hole of the liquid crystal along the axial direction and extrudes the liquid agent in the axial direction hole from the discharge port of the liquid agent discharge guide body to the liquid application site. It is.

  According to the liquid agent coating apparatus of the present invention, a predetermined amount of liquid agent can be supplied to the axial hole of the liquid agent discharge guide body by the liquid agent supply means. Further, the liquid agent in the axial direction hole can be extruded to the liquid application site by sliding the liquid extrusion rod in the axial direction hole along the axial direction. That is, once the liquid agent is supplied to the liquid agent discharge guide body and the supplied liquid agent is extruded by the liquid agent extrusion rod, the liquid agent is transferred to the extrusion surface of the liquid agent extrusion rod during the extrusion. In this state, the liquid agent can be extruded and transferred to the liquid agent application site.

  The liquid agent supply means can be constituted by a dispenser device including a syringe that supplies the liquid agent to the axial center direction hole of the liquid agent discharge guide body. By configuring the liquid agent supply means with the dispenser device, the liquid agent in the syringe can be supplied to the axial hole of the liquid agent discharge guide body with the high-pressure air from the dispenser.

  The axial hole in the guide for discharging the liquid agent may be a circular hole, and the rod for extruding the liquid may be a round bar that is in sliding contact with the inner diameter surface of the axial hole. In this case, the liquid agent that is extruded from the liquid agent discharge guide body and transferred to the liquid agent application site has a disk shape.

  The axial hole of the liquid agent discharge guide body may be a square hole, and the liquid extrusion rod may be a square bar whose side faces are in sliding contact with the inner surface of the axial hole. In this case, the liquid material that is extruded from the liquid material discharge guide body and transferred to the liquid material application site has a square (eg, square) flat plate shape.

  The liquid agent extrusion surface of the liquid agent extruding rod may come into contact with the liquid agent application site at the time of liquid agent extruding by the liquid agent extruding rod. Thus, the liquid agent extruded by the liquid agent extrusion rod can be stably transferred to the liquid agent application site by bringing the liquid agent extrusion surface of the liquid agent extrusion rod into contact with the liquid agent application site during extrusion.

  The diameter of the liquid extrusion surface of the liquid extrusion rod can be set from 0.15 mm to 0.50 mm.

  It can be used for application of a bonding agent for bonding a chip-shaped workpiece to a member to be bonded.

  In the liquid agent application method of the present invention, after a predetermined amount of liquid agent is once supplied to the axial hole of the liquid agent discharge guide body, the liquid agent in the axial hole is pushed to the liquid application site by the liquid extrusion rod. It is something to be issued.

  According to the liquid agent application method of the present invention, the liquid agent in the axial hole is extruded to the liquid agent application site by the liquid agent extruding rod, so that the liquid agent is transferred to the extrusion surface of the liquid agent extruding rod during this extrusion. In this state, the liquid agent can be extruded and transferred to the liquid application site.

  In the present invention, the liquid agent in the liquid agent discharge guide body is extruded by the liquid agent extruding rod, and the liquid agent can be pressed against the liquid agent application portion in this state. That is, the liquid agent extruding rod can function as a conventional transfer pin to form minute dots. Moreover, the liquid agent extrusion rod slides along the axial center hole of the liquid agent discharge guide body, and the movement of the liquid agent extrusion rod is simple (only moves up and down). For this reason, there is no possibility that the liquid agent transferred onto the extruded surface of the rod for extruding the liquid agent will be scattered to other parts, and transfer work at high speed is possible, resulting in excellent productivity.

  In addition, a predetermined amount of the liquid agent is supplied into the liquid agent discharge guide body by the liquid agent supply means, and the transfer amount of the liquid agent to the liquid application site by the liquid agent extruding rod is stabilized. In particular, when the liquid supply means is constituted by a dispenser device, the liquid supply to the liquid discharge guide body is stable and a highly reliable liquid application device can be configured.

  By making the hole in the axial direction of the guide for discharging the liquid agent into a circular hole and the rod for extruding the liquid agent as a round bar, the liquid agent can be transferred to the liquid application site in a disk shape. Further, the axial hole in the axial direction of the guide for discharging the liquid agent is a square hole and a square bar, so that the liquid agent can be transferred to the liquid agent application site in the form of a square (for example, a square) flat plate. That is, by changing the cross-sectional shape of the axial hole of the liquid agent discharge guide body and the rod for extruding the liquid agent, the liquid agent can be transferred according to the shape of the liquid agent application site, and work after transfer (for example, a die) Stable work).

  By bringing the solution extrusion surface of the solution extrusion rod into contact with the solution application site during extrusion, the solution extruded by the solution extrusion rod can be stably transferred to the solution application site. When the rod is brought into contact with the liquid application site, the gap between the rod and the liquid application site, the gap between the liquid discharge guide body and the liquid application site, etc. need not be set to constant values. For this reason, stable transfer is possible without considering variations in the thickness of the frame.

  The diameter of the liquid extruding surface of the liquid extruding rod can be set from 0.15 mm to 0.50 mm, whereby fine dots of the liquid agent having a diameter of about 0.15 mm to 0.50 mm can be formed.

  For this reason, the liquid agent coating apparatus of the present invention is an optimal apparatus for solvent (bonding agent) coating work used for bonding agent bonding for bonding a chip-shaped workpiece to a member to be bonded.

  Hereinafter, an embodiment of the present invention will be described with reference to FIG.

  FIG. 1 shows a simplified cross-sectional view of a liquid application device according to the present invention. This liquid application device is, for example, a bonding agent to a lead frame in a die bonder that bonds a die as a chip-shaped workpiece to a lead frame as a member to be bonded. Used for coating. The liquid agent application apparatus includes a liquid agent discharge guide body 16 having an axial hole 15 and a predetermined amount of liquid S in the axial hole of the liquid agent discharge guide body 16 (for a die bonder, a paste-like solder). The liquid agent supply means 17 for supplying the liquid agent) and the axial direction hole 15 of the liquid agent discharge guide body 16 slide along the axial direction and the liquid agent S in the axial direction hole 15 is applied to the liquid application site M. And a liquid extruding rod 18 for extruding. Here, the liquid agent application site M is the island portion 19a of the lead frame 19 in the present embodiment.

  The liquid agent discharge guide body 16 is formed of a cylindrical body, has a lateral hole 20 communicating with the axial hole 15 in the peripheral wall 16a, and the liquid agent S is passed through the horizontal hole 20 from the liquid agent supply means 17 through the axial hole. 15 is supplied. In this case, the axial center hole 15 is a round hole having a circular cross section.

  The liquid agent supply means 17 can be configured by a dispenser device 22 including a syringe 21 that supplies the liquid agent S to the axial hole 15 of the liquid agent discharge guide body 16. That is, the dispenser device 22 controls the syringe 21 communicated with the lateral hole 20 through the communication passage 23, the dispenser 24 that supplies high-pressure air to the syringe 21, the air pressure to the dispenser 24, and the like. And an omitted controller.

  For this reason, when the high pressure air controlled by the controller is supplied from the dispenser 24 to the syringe 21, the liquid agent S in the syringe 21 is transferred to the axial hole 15 through the communication path 23 in FIG. Extruded as in b). In this case, the discharge amount of the high-pressure air supplied from the dispenser 24 to the syringe 21 is controlled, and the extrusion amount of the liquid S extruded from the lateral hole 20 into the axial hole 15 is a predetermined amount, that is, the island of the lead frame 19 This is the required application amount of the liquid S (solder) to the part 19a.

  The liquid extruding rod 18 is a round bar having a circular cross section, and reciprocates along the axial direction as indicated by arrows A and B through the axial hole 15 via the driving means 25. The driving means 25 can be constituted by a solenoid as shown in the figure, for example. That is, the driving means 25 in this case includes a main body portion 26 having a coil portion, and a plunger 27 that reciprocates along the axial direction by causing a current to flow through the coil portion of the main body portion 26. For this reason, when the plunger 27 slides in the arrow A direction from the state shown in FIG. 1B, the liquid extruding rod 18 is pushed down as shown in FIG. 1C. Also, from the state shown in FIG. 1C, the plunger 27 slides in the direction of arrow B as shown in FIG.

  The hole diameter (inner diameter) of the axial hole 15 and the outer diameter of the liquid extruding rod 18 allow the liquid extruding rod 18 to slide in the axial hole 15. The liquid agent does not enter between the inner surface and the outer surface of the liquid extruding rod 18. As an outer diameter of the rod 18 for liquid agent extrusion, it can set to 0.15 mm to 0.50 mm, for example.

  Next, a method for applying the liquid agent S using the liquid agent applying apparatus configured as described above will be described. First, as shown in FIG. 1A, the lower surface 16b of the liquid agent discharge guide body 16 is opposed to the liquid agent application site M (the island portion 19a of the lead frame 19) with a slight gap G1. In this case, the liquid agent discharge guide body 16 is fixed, and the lead frame 19 is intermittently transported by a transport means (transport rail or the like) not shown so that the island portions 19a sequentially face each other. The gap G1 is not always set to a constant value, and varies variously according to variations in the lead frame 19.

  Next, as shown in FIG. 1B, a predetermined amount (optimum amount required for the island portion 19 a) is pushed into the axial hole 15 of the liquid agent discharge guide body 16 by the liquid agent supply means 17. Thereafter, the extrusion rod 18 inserted through the axial hole 15 of the liquid agent discharge guide body 16 slides in the direction of arrow A in FIG. As a result, the liquid S extruded from the lateral hole 20 to the axial hole 15 is scraped off at the extrusion surface 18a of the extrusion rod 18, and the liquid S is moved toward the liquid application site M side at the extrusion surface 18a. It is extruded through the discharge port of the discharge guide body 16 (the lower opening of the axial direction hole 15 of the liquid agent discharge guide body 16).

  By being pushed out toward the liquid application site M, the liquid S is pressed against the liquid application site M and transferred to the liquid application site M. Thereafter, the extrusion rod 18 is raised and returned to the state shown in FIG. When the extruding rod 18 is returned to the state shown in FIG. 1A, the next liquid agent application site M (island portion 19a) is made to correspond. By sequentially performing the above steps, the liquid S can be sequentially applied to the island portions 19a of the lead frame 19.

  According to the present invention, the liquid agent in the liquid agent discharge guide body 16 is extruded by the liquid agent extruding rod 18, and the liquid agent S can be pressed against the liquid agent application site M in this state. That is, the liquid agent extruding rod 18 can function as a conventional transfer pin to form minute dots. In addition, the liquid agent extrusion rod 18 slides along the axial direction 15 of the liquid agent discharge guide body 16, and the movement of the liquid agent extrusion rod 18 is simple (only moves up and down). For this reason, the liquid agent S in a transfer form on the extrusion surface 18a of the liquid agent extruding rod 18 does not scatter to other parts, and a high-speed transfer operation is possible, resulting in excellent productivity.

  In addition, a predetermined amount of the liquid agent is supplied into the liquid agent discharge guide body 16 by the liquid agent supply means 17, and the transfer amount of the liquid agent S to the liquid agent application site M by the liquid agent extruding rod 18 is stabilized. In particular, when the liquid supply unit 17 is configured by a dispenser device, the supply of the liquid agent into the liquid agent discharge guide body 16 is stable and a highly reliable liquid agent application device can be configured.

  By bringing the liquid material extrusion surface 18a of the liquid material extrusion rod 18 into contact with the liquid material application site M during extrusion, the liquid material extruded by the liquid material extrusion rod 18 can be stably transferred to the liquid material application region M. it can. When the rod 18 is brought into contact with the liquid application site M, the gap between the rod 18 and the liquid application site M and the gap between the liquid agent discharge guide body 16 and the liquid application site M are set to be constant. There is no need. For this reason, stable transfer is possible without taking into account variations in the thickness of the frame 19 or the like.

  The diameter of the liquid agent extrusion surface 18a of the liquid agent extruding rod 18 can be set from 0.15 mm to 0.50 mm. Thereby, the fine dots of the liquid agent S having a diameter of about 0.15 mm to 0.50 mm can be formed.

  For this reason, the liquid coating device of the present invention is an optimal device for bonding agent application work to the lead frame 19 in the die bonder for bonding the die to the lead frame 19.

  In the above-described embodiment, the axial hole 15 is a circular hole and the liquid agent extruding rod 18 is a round bar. However, the axial hole 15 of the liquid agent discharge guide body 16 is a square hole and the liquid agent extruding rod 16 is a liquid hole. The rod 18 can be a square bar. In this way, the liquid agent S is transferred to the liquid agent application site M in a disc shape by making the axial direction hole 15 of the liquid agent discharge guide body 16 into a circular hole and the liquid agent extruding rod 18 as a round bar. be able to. In addition, the axial center hole 15 of the liquid agent discharge guide body 16 is a square hole, and the liquid agent extruding rod 18 is a square bar, so that the liquid agent is applied in a rectangular (eg, square) flat plate shape. It can be transcribed to site M. That is, by changing the cross-sectional shapes of the axial hole 15 of the liquid agent discharge guide body 16 and the rod 18 for liquid agent extrusion, the liquid agent S can be transferred in accordance with the shape of the liquid application portion M, and after the transfer. Work (for example, work to join dies) is stabilized.

  As described above, the embodiment of the present invention has been described. However, the present invention is not limited to the above-described embodiment, and various modifications are possible. For example, the liquid supply unit 17 is a pressure control type dispenser device. Alternatively, a volumetric dispenser device may be used. The pressure control type dispenser device is generally a method (a method according to this embodiment) in which a liquid agent is placed in a pressure vessel, compressed air is directly applied to the liquid agent from a dispenser, and the liquid agent is discharged. The volume metering type dispenser device is a method in which a constant or variable metering chamber is provided in a flow path, and the volume is calculated and discharged. In addition, since a predetermined amount of liquid agent can be supplied, another device such as a gear pump may be used without using a dispenser device.

  As the driving means 25, various reciprocating mechanisms such as a cylinder mechanism and a ball screw mechanism can be used. Further, an elastic material (a spring or the like) that receives a reaction force when the extrusion surface 18 a comes into contact with the liquid application portion M may be provided on the side opposite to the extrusion side of the liquid agent extrusion rod 18. By this elastic material, the impact of the liquid agent extruding rod 18 at the time of contact can be reduced, and the durability is excellent. Furthermore, the apparatus to be used is not limited to a die bonder, and can be used when various fluids (for example, various oils, resins, greases, pastes and other high viscosity liquids) are applied with fine dots. That is, the chip-shaped workpiece is not limited to the die, but may be other various electronic components, and the avoidance joining member is not limited to the lead frame, but may be a substrate (printed substrate or flexible substrate). There may be.

  In the case where the axial center direction hole 15 of the liquid agent discharge guide body 16 is a square hole and the liquid agent extruding rod 18 is a square bar, it is not limited to a square but may be a pentagon or more. In the above-described embodiment, when the liquid agent extruding rod 18 is transferred to the liquid agent application site M, the extrusion surface 18a of the liquid agent extruding rod 18 is brought into contact with the liquid agent application site M. The liquid agent may be pressed to the liquid application site M at the extrusion surface 18a without being in contact with the liquid agent.

It is a simplified sectional view of a liquid agent application device showing an embodiment of the present invention. It is a simple enlarged view of the conventional liquid agent coating device. It is a principal part enlarged view of the liquid agent coating device of the said FIG. It is a simplified diagram of another conventional liquid application device.

Explanation of symbols

15 Axial direction hole 16 Liquid agent discharge guide body 17 Liquid agent supply means 18 Liquid agent extruding rod 18a Extrusion surface 19 Lead frame M Liquid agent application site S Liquid agent

Claims (8)

  A liquid agent discharge guide body having an axial hole, a liquid supply means for supplying a predetermined amount of liquid agent to the axial hole of the liquid discharge guide body, and an axial hole in the liquid agent discharge guide body A liquid agent application apparatus comprising: a liquid agent extruding rod that slides along an axial direction to extrude a liquid agent in an axial hole from a discharge port of a liquid agent discharge guide body at a liquid agent application site.   The liquid agent application device according to claim 1, wherein the liquid agent supply means is configured by a dispenser device including a syringe that supplies the liquid agent to an axial direction hole of the liquid agent discharge guide body.   The axial hole in the axial direction of the guide for discharging the liquid agent is a circular hole, and the rod for extruding the liquid agent is a round bar that is in sliding contact with the inner diameter surface of the axial hole. Liquid application device.   The axial hole of the guide for discharging the liquid agent is a square hole, and the rod for extruding the liquid agent is a square bar whose side faces are in sliding contact with the inner surface of the axial hole. Item 3. The liquid application device according to Item 2.   The liquid agent coating apparatus according to any one of claims 1 to 4, wherein the liquid agent extrusion surface of the liquid agent extrusion rod abuts on the liquid agent application site during liquid agent extrusion by the liquid agent extrusion rod.   The liquid agent coating apparatus according to any one of claims 1 to 5, wherein the diameter of the liquid agent extrusion surface of the liquid agent extruding rod is 0.15 mm to 0.50 mm.   The liquid agent coating apparatus according to any one of claims 1 to 6, wherein the liquid agent coating apparatus is used for bonding agent application for bonding a chip-shaped workpiece to a member to be bonded.   A liquid agent coating characterized in that after a predetermined amount of liquid agent is once supplied to the axial center hole of the liquid agent discharge guide body, the liquid agent in the axial center hole is extruded to a liquid agent application site by a liquid agent extrusion rod. Method.

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