JPH0230021B2 - - Google Patents

Info

Publication number
JPH0230021B2
JPH0230021B2 JP55078937A JP7893780A JPH0230021B2 JP H0230021 B2 JPH0230021 B2 JP H0230021B2 JP 55078937 A JP55078937 A JP 55078937A JP 7893780 A JP7893780 A JP 7893780A JP H0230021 B2 JPH0230021 B2 JP H0230021B2
Authority
JP
Japan
Prior art keywords
wiring
display device
wirings
input
output terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP55078937A
Other languages
English (en)
Japanese (ja)
Other versions
JPS575081A (en
Inventor
Tetsuo Sadamasa
Osamu Ichikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP7893780A priority Critical patent/JPS575081A/ja
Publication of JPS575081A publication Critical patent/JPS575081A/ja
Publication of JPH0230021B2 publication Critical patent/JPH0230021B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Liquid Crystal (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP7893780A 1980-06-13 1980-06-13 Display unit Granted JPS575081A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7893780A JPS575081A (en) 1980-06-13 1980-06-13 Display unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7893780A JPS575081A (en) 1980-06-13 1980-06-13 Display unit

Publications (2)

Publication Number Publication Date
JPS575081A JPS575081A (en) 1982-01-11
JPH0230021B2 true JPH0230021B2 (enrdf_load_stackoverflow) 1990-07-04

Family

ID=13675786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7893780A Granted JPS575081A (en) 1980-06-13 1980-06-13 Display unit

Country Status (1)

Country Link
JP (1) JPS575081A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108511431A (zh) * 2018-05-21 2018-09-07 佛山市国星光电股份有限公司 一种led显示单元组及显示面板

Also Published As

Publication number Publication date
JPS575081A (en) 1982-01-11

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