CA1082378A - Abuttable light-emitting device modules for graphic display assemblies - Google Patents
Abuttable light-emitting device modules for graphic display assembliesInfo
- Publication number
- CA1082378A CA1082378A CA274,707A CA274707A CA1082378A CA 1082378 A CA1082378 A CA 1082378A CA 274707 A CA274707 A CA 274707A CA 1082378 A CA1082378 A CA 1082378A
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- Prior art keywords
- light
- substrate
- emitting diodes
- module
- driving circuitry
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
A self-contained display module of light-emitting diodes (LEDs) is disclosed which has an array of LEDs in a four-edge-abuttable pattern on one surface of a substrate, while refresh memory and row and column driving circuitry for the LEDs are adjacent the opposite surface of the substrate. Visual display assemblies capable of alphanumeric and/or graphic display may conveniently be constructed from a matrix of these modules, when assembled on a common backplane.
A self-contained display module of light-emitting diodes (LEDs) is disclosed which has an array of LEDs in a four-edge-abuttable pattern on one surface of a substrate, while refresh memory and row and column driving circuitry for the LEDs are adjacent the opposite surface of the substrate. Visual display assemblies capable of alphanumeric and/or graphic display may conveniently be constructed from a matrix of these modules, when assembled on a common backplane.
Description
108~37~
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The present invention relates generally to programmable visual display arrangements of the type utilizing semiconductor light-emitting device9, 5uch as light-emitting diode~, commonly and hereinbelow referred to as LEDs, organized in a planar array.
In particular, this invention relates to large-scale optical display arrangements capable of displaying graphics, such ~s a map-like presentation of artillery placement for use by military command personnel and similar displays.
The conventionally used device for programmable graphic displays is the cathode ray tube. The high-voltage requirements and physical bulk of such tubes limits their usefulness. A
large-scale graphic display, such as a four-foot-by-four-foot programmable presentation of a military field map, is presently impractical with cathode ray tubes. Similarly, a small hand-held unit, such as an interactive data terminal, capable of producing alphanumeric and graphic displays, is also impractical with cathode ray tubes. Relatively small displays, such as arrays of LEDs (light-emitting diodes) organized in a matrix of five-by-seven LEDs, have been used successfully for the display of alphanumerics, one example of which is described in United States Patent No. 3,889i147. Such devices would be attractive for use in constructing both large and small display arrangements because of their small size, their low voltage requiremen~s and~
their high light output.
The patent mentioned above shows modules containing several arrays of LEDs in a line. These modules are "two-edge-abuttable" which means that a row of modules may be formed by po~itioning the LEDs in a side-by-side arrangement along a line, and that, then, the center-to-center distance between adjacent arrays in adjacent modules is the same as the center-to-center r .
1~2378 distance between arrays within the same module. Each array is used to display a single alphanumeric character. Thi9 two-edge abuttability allows to assemble relatively small modules, having, ~or example, seven individual character display arrays per S module, to be used in building larger alphanumeric display assemblies without undesirable irregularities in the spacings between characters displayed in mutually adjacent modules. Such modules are convenient for use in configuring larger display assemblies, because they are self-contained. Row driving circuitry and column driving circuitry is included within the hermetlcally sealed module to minimize the number of connection points required by each module.
~he above-described known modules cannot, however, be used to construct graphic display assemblies, because the LEDs are organized into individual arrays for the display of single alphanumeric characters. Even if additional LEDs were provided to fill in the spaces between arrays, the modules could not be used to huild graphic display assemblies, because they are not four-edge-abuttable.
In this context, a four-edge-abuttable module as disclosed herein would be a module configured so that a two-dimensional matrix of such modules could be formed from such modules when they are positioned in a side-by-side arrangement in two distinct, suitably mutually orthogonal directions, each inside module having other modules adjacent all four of its edges, thereby to construct a larger matrix of arrays of LEDs in a manner such that the row spacings and the column spacings between LEDs on adjacent modules would be equal to the row and column spacings between LEDs on an individual module.
30 - Another module which is scanable to provide alphanumeric ~IL01~:378 displays i5 shown in United States Patent No. 3,800,177. It would be impractical to increase the size of the array in such a module to provide the capability of large alphanumeric and graphic display within one module because, for exampLe, of the dimensional tolerance problems, limits of component strength and excessive costs. Similar problems exist with the recently designed monolithic LED display devices, examples of which are shown in United States Patents Nos. 3,940,756, 3,867,666, 3,893,149, 3,703,656, 3,792,465, 3,821,616, 3,942,065 and 3,654,476.
The present invention is intended to solve the problem of creating economically feasible, large LED display assemblies, based upon the concept of a self-contained, four-edge-abuttable LED display module, as defined above. A great number of these modules may be used -to construct assemblies capable of displaying alphanumeric and graphic images of any convenient size, even as large as wall-size units. Each individual module contains an array of LEDs positioned at a uniform center-to-center distance from each ot~er and mounted on one of the two major surfaces o~
a substrate. Such surface may be flat or include irregularities ; 20 for mounting LEDs or for other purposes. The array upon the substrate is configured so that the distance on each side from the outermost row of LEDs to the edge of the module is not greater than the center-to-center distance between individual LEDs.
This configuration makes the module four-edge-abuttable, .
; in that a number of such modules may be positioned side by side along all four edges of each module to configure larger matrices without irregularities in the uniform center-to-center distance between individual LEDs on adjacent modules. The modules form-ing the large display may be mounted on a single, thus common, ~ ' ~V823~8 backplane which is a mounting panel providing the interconnections between the modules and central electronic programming circuitry, such as a computer. Self-contained row and column driver circuitry and recirculating refresh memory i5 provided in the modules on the reverse side, i.e. adjacent the other major surface, of the substrate~ This concept of providing driver circuitry and an LED array on the two opposite major surfaces of a substrate results in a mechanically and electrically optimized package, in that the module may be made relatively thin but still structurally solid, while requiring a minimum number of pin connections between the module and the backplane. Interconnec-tions between the driver circuitry and the LED array are suitably provided by so-called vias, also referred to as feedthroughs, through the substrate. On the reverse side of the module may be mounted interconnect pins, for connection to the backplane, and a ring frame, described further below, may be used for supporting the pins, with a cover being sealed to the ring frame to provide hermetic sealing of the driver circuitry, if desired.
In accordance with a broad aspect of the invention, there is provided an optical display arrangement comprising at least one module having a plurality of light-emitting diodes supported by a common insulating base structure and organized to form at least one array of light-emitting diodes, there being provided associated driving circuitry for controlled energization of the light-emitting diodes, wherein, for the, or each, module, the supporting base structure is in the form of a substantially flat plate, thus having two major surfaces facing in opposite direc-tions, and constituting a substrate, one of the two major surfaces supporting an array of light-emitting diodes, the driving circuitry being mounted adjacent the other major surface.
.
Optimum conditions are achieved when each of the major surfaces of the substrate is of substan-tially the same size as the entire module, the substrate thus separating, one from the other, a zone with light-emitting diodes supported by the one surface and another zone containing the driving circuitry adjacent the other surface~
In accordance with the desirable feature of four-edge abuttability, the light-emitting diodes are suitably distributed over the one surface at a uniform center-to-center distance between the diodes of pairs of adjacent diodes, the light-emitting diodes nearest an edge of the substrate being positioned at a distance from the edge of the substrate which is not greater than one-half of the uniform center-to-center distance.
In accordance with specific features of embodiments of the invention, the light-emitting diodes of the array are embedded within a protective coating of light-transmissive material which hermetically seals the array of light-emitting diodes to the surface of the substrate. Conductive paths may be provided through the substrate for interconnecting the light-emitting diodes with the driving circuitry, which is preferablysupported by at least one second flat, plate-shaped substrate supporting assembly of the same size and of the same general ; outline as, and having major surface areas secured to, the other major surface of the substrate. Specifically in connection with one modification described further below, two substrates forming the second flat plate-shaped supporting assembly for the driving circuitry are used and leave an open space between each other to permit access to the other major surface of the substrate support-ing the light-emitting diodes, a plurality of connecting wires which interconnect light-emitting diodes with the driving 10i~23~
circuitry upon the two substrates extending through the open space. Moreover, it was found practicaI to provide a box-like protective enclosure covering the driving circuitry and sealed to the surface of a module facing away from the light-emitting diodes, the box-like enclosure heing formed ~y a plate-shaped frame having a central opening and a cover plate which seals the opening by virtue of being secured to the external surface . of the frame.
: Particularly for large-scale optical display arrangements, use of a matrix of a plurality of modules as described herein can : be made, wherein the modules are removably mounted to a panel forming a common backplane for the modules, the matrix of modules forming a continuous pattern of light-emitting diodes organized to leave uniform center-to-center distances between any pair of mutually adjacent light-emitting diodes.
- The invention will become better understood from the following detailed description of one embodiment thereof, when taken in conjunction with the drawings, wherein:
Figure l is an isometric, schematic view of a large-scale graphic display assembly configured from a plurality of four-edge-abuttable display modules upon a bac~plane according to the .present invention, Figure 2 is an isometric view of one of the four-edge- :
abuttable modules shown in Figure 1, : Figure 3 is an exploded view of the module of Figure 2 shown upside down, i.e. in a reversed position, : relative to Figure 2, Figure 4 is an expanded view of one location, identified as area A in Figure 1, where each of four ~Oi~ 3~ .
adjacent modules meets the three others, and Figure 5 is a schematic representation of electronic circuitry useful for the module of Figures 2 and 3.
Figure 1 illustrates a large~scale graphic display 10 which consists of a number of four-edge abuttable modules 12 mounted on a common panel forming the backplane 14 and connected via cable 16 to central electronic programming circuitry 1~.
Each module 12 has visible on its top surface a rectangular array of light-emitting devices, such as light-emitting diodes, referred -to as LEDs. Under the control of programming circuitry 18, selected LEDs in each module can be energized to provide an alphanumeric and/or other graphic display, such as a high~ay complex 23 and alphanumeric legends shown displayed to illustrate an example. Circuitry 18 serves to identify and select those of the diodes in each module which must be energized to present the display required. Many different conventional devices may be used to provide this programming, and in its simplest form, circuitry 18 would be a matrix of switches, each switch being capable of individually energizing a single LED on display panel 10.
It is an important advantage of the present invention that the image displayed can be portrayed without distortion, even though the image may continue, i.e. extend, from one module to another or many others within the large panel display. The area where the four modules 22, 24, 26 and 28 meet, shown in Figure 1 as area A, is described hereinbelow in greater detail with reference to Figure 4.
Figure 2 illustrates in a partly broken away, isometric view, an individual representative module 12, the top surace of 1082371~
which is a transparent layer 34 which conveniently may be made of transparent epoxy. Visible underneath layer 34 and mounted upon a substantially flat plate constituting the substrate 32 is a rectangular, suitably square array 30 of LEDs, Within the module, positioned immediately below substrate 32, is at least one additional substrate 35, w~ich carries the refresh memory, as well as row and column driving circuitry which is described in greater detail hereinbelow.
Figure 3 is an exploded view of module 12, but reversed, i.e. upside down, with respect to Figure 2. In the illustration of Figure 2, substrates 32 and 35, though shown as two distinct layers, may conveniently be configured from one multilayer ceramic substrate. In Figure 3, a modified structure, constituting a three-substrate-configuration is shown which has been found convenient for use in building small numbers of modules. The multilayer ceramic substrate would be convenient for use in high-, volume production runs of identical modules.- The basic function ; requirements for the substrate configurations are the same and are discussed below with reference to Figure 3.
The transparent epoxy layer 34 is visible at the bottom of Figure 3, immediately below substrate 32. On the downwardly facing major surface of substrate 32, as shown, in contact with layer 34, but not uisible in Figure 3, would be the array 30 of LEDs. As is described hereinbelow, interconnections to the LEDs of array 30 are made through so-called vias, also referred to as - feedthroughs, through substrate 32 and are collected by means of conductor pattern 36 to a central area 38 near the center of substrate 320 Positioned upon substrate 32 are two additional smaller - 30 substrates 40 and 42, which together perform the function of ' _g_ ' 7` ' ~8Z37~
substrate 35 of Figure 2. Substrates 40 and 42 are positioned upon substrate 32 so that interconnect area 38 is accessible through channel 39 which is the space formed between substrates 40 and 42. The electrical connections to the LEDs of array 30 are therefore brought to the center of substrate 32 and then ;
carried up to the smaller substrates via any conventional inter-connection technique, such as wire bonds 31. Smalier substrate 40 and 42 support the row and column driving circuitry re~uired for array 30, shown generally as semiconductor chips 44, which are connected, by means of circuitry printed on substrate surface 45, to an area 46 for wire bonding to the LEDs upon the substrate 32.
Interconnections between the module and backplane 14, which is shown in Figure 1, are provided by pins 48 which are connected and secured to substrate 40 and 42 by pin pads 50, even though, in the exploded view of Figure 3, ~these pins appear to protrude from a box-like sealing structure described below.
Backplane 14 may conveniently have sock-ets (not shown) into which pins 48 can be inserted. The box-like sealing structure includes a ring frame 52 having a large central opening and smaller lateral openlngs through which pins 48 may protrude. After substrates 40 and 42 are mounted to substrate 32 by means of, for example, epoxy cement and pins 48 are soldered to pads 50, ring frame 52 may be positioned over the partially completed module to provide additional support for pins 48. This provides a mounting surface for a cover 54 which closes the box-liXe structure as it may be sealed to ring frame 52 to provide a hermetic seal for circuitry 44 and the delicate wire bonds.
The above-described construction for module 12 provides hermetically sealed, self-contained refresh memory, as well as row and column drive circuitry in a convenient, substantially flat, rectangular or s~uare package, inasmuch as each of the major surfaces of the substrate 32 i9 of substantially the same size as the entire module, the substrate thus separating, one from the other, a zone with light~emitting diodes supported by one major surface and another zone containing the driving circuitry 44, adjacent the other major surface of the substrate 32. The four-edge abuttability which is conveniently achieved by this construction can most easily be explained with reference to Figure 4 which shows area A of Figure 1 where modules 22, 24, ~.
26 and 28 meet. In Figure 4, the top surface of substrate 32 of .
module 22 has applied thereto a paralleI series of column con- :
ductor strips at the uniform center-to-center distance X
represented by column conductors 60, 70 and 72. When modules 22 and 28 are properly positioned on backplane 14, see Figure l, :
the column conductor strips in all adjacent modules are aligned as shown by the relationship of columns 60, 70 and 72 of module 22 to columns 61, 71 and 73 of module 28. The columns may conveniently be printed wiring paths or formed under use of any other conventional technology.
Upon each column are positioned LEDs at the uniform center-to-center distance X as represented by LEDs 56 and 58 on column 60 and LEDs 57 and 59 on column~70. The LEDs are mounted with a conductive epoxy or by other means for providing an electrical connection between the base or cathode of each LED and the column strip. Each of the LEDs of each column,is aligned with the nearest LED of each adjacent column to form rows of LEDs running transverse to the columns. By way of illustration, LEDs 58, 59 and 80 on module 22 are aligned with LED 62 oE module 24, as shown by the relationship between row 84 of module 22 and 3~8 :i row 86 of module 24~ The anodes of the LEDs along a row are connected by wire bonds, such as wire bond 64 connecting LED 58 to 1ED 59 in row 84. Interconnection between the drive circuitry on the backside of the module and wire bond 64 is provided by the feedthrough 66 ~hich extends through substrate 3Z, as ; described above. Connections to the column circuits are provided, for example, by a feedthrough 68 in column 60.
It is critical to the four-edge-abuttability of these modules that the center-to-center distance between the outermost ; lO LEDs of adjacent modules, such as between LED 58 of module 22 and LED 62 of module 24, be equal to the uniform center-to-center distance. This is most conveniently accomplished by the symmetrical construction shown herein. Thus, the distances from the outermost LEDs to the edges of the module are equal for all four edges and not greater than half the center-to-center distance X, as shown in Figure 4. A nonsymmetrical configuration could also be used, as long as the sum of the distances from an outermost LED to the edge of the module for two adjacent modules is not greater than the uniform center-to-center distance. Thus, . 20 it can be seen that the light-emitting diodes are distributed over the one major surface of substrate 32 at the uniform center-to-center distance X between the diodes of pairs of adjacent diodes, the light-emitting diodes nearest an edge of the -substrate 32 being positioned at a distance from the edge of the substrate 32 which is not greater than one-half of the uniform center-to-center distance. Moreover, though the driving -~ circuitry could be directly supported by the same flat, plate-shaped substrate 32 which supports the diodes, it was found advantageous to construct a module such that the driving circuitry 44 is supported by at least one second flat, plate-~L0~32378 shaped substrate supporting assembly of the same size and of the same general outline as, and having major surface areas secured to, the other major surface of the substrate 32, Then, the two substrates 40 and 42 forming the second flat plate-shaped supporting assembly for the driving circuitry 44 leave the open space 39 between each other to permit access to the other major surface of the substrate 32 supporting the light-emitting diodes, a plurality of connecting wires which interconnect light-emitting diodes with the driving circuitry 44 upon the two substrates 40 and 42 extending through the open space 39.
A complete optical display arrangement then constitutes a matrix of a plurality of modules removably mounted to a panel forming a common backplane for the modules, the matrix of modules forming a continuous pattern of light-emitting diodes organized to leave uniform center-to-center distances between any pair of mutually adjacent light-emitting diodes.
j Figure 5 is a schematic representation of the row~and column driver circuitry of module 12 and a partial showing of array 30. Portions of columns 88, 90 and 92 are shown, together with rows 94, 96 and 98, row 94 being constituted by LEDs 100, 102 and 104, while row 96 includes LEDs 106, 108 and 110.
Individual LEDs within each module, and therefore within a large display assembly, are selected for controlled energiza-tion by strobing through the columns, one at a time. The columns are selected by column driving circuitry 112 which includes register 114 receiving as its input the output of clock 116 which may be centrally located or controlled by circuitry 18, shown in Flgure 1, so that all columns within a display assembly are strobed in sequence. The outputs of register 114 are used to activate column drivers associated with each column to enable ~l.()~Z378 them for a fixed period of time. The column drivers may con-veniently be electronic switches capable of handling the current requirement of a column of LEDs. They are represented by driver circuits 118, 120 and 122 for columns 88, 90 and 92, respectively.
Row driving circuitry 124 is utilized to select the LEDs to be energized in a specific column when enabled by column driving circuitry 112. Associated with each row is a specific row driver circuit, such as drivers 78, 126 and 128 for rows 94, 96 and 98, respectively. The drivers may conveniently be conventional electronic switches and are required to handle the power for only one LED at a time. ~he row drivers shown are controlled by a shift register 130 from information processed by circuitry 18, also shown in Figure 1.
A switch 132 receives the digital in~ormation for con- -trolling the LEDs in the enabled column and presents this information to register 130. This information is then stored - in a memory 134 so that the row driving information may be repeated until a change is required. This technique reduces the complexity of the circuitry involved. The information presented to register 130 is therefore controlled by the operation of switch 132.
Integrated circuit chips 44 comprising row driving circuitry 124 are shown in Figure 3 mounted on substrate 40, and connected to matrix array 30 by ~eedthroughs through substrate 32. Integrated circuit chips 44 are connected on the front side of substrate 32 to the~appropriate row wire bond as discussed hereinabove. In a similar manner, column driver circuitry 112 may be mounted on substrate 42 and connected to the appropriate column on the front side of substrate 32.
___ ~L082371~
It is important to note that any substrate configuration capable of supporting the array 30 of LEDs on one major surface and memory 134, as well as row and column driver circuitry 124 and 112 on its oppositely facing major surface while providing the requisite interconnections therebetween, may be used.
.
The present invention relates generally to programmable visual display arrangements of the type utilizing semiconductor light-emitting device9, 5uch as light-emitting diode~, commonly and hereinbelow referred to as LEDs, organized in a planar array.
In particular, this invention relates to large-scale optical display arrangements capable of displaying graphics, such ~s a map-like presentation of artillery placement for use by military command personnel and similar displays.
The conventionally used device for programmable graphic displays is the cathode ray tube. The high-voltage requirements and physical bulk of such tubes limits their usefulness. A
large-scale graphic display, such as a four-foot-by-four-foot programmable presentation of a military field map, is presently impractical with cathode ray tubes. Similarly, a small hand-held unit, such as an interactive data terminal, capable of producing alphanumeric and graphic displays, is also impractical with cathode ray tubes. Relatively small displays, such as arrays of LEDs (light-emitting diodes) organized in a matrix of five-by-seven LEDs, have been used successfully for the display of alphanumerics, one example of which is described in United States Patent No. 3,889i147. Such devices would be attractive for use in constructing both large and small display arrangements because of their small size, their low voltage requiremen~s and~
their high light output.
The patent mentioned above shows modules containing several arrays of LEDs in a line. These modules are "two-edge-abuttable" which means that a row of modules may be formed by po~itioning the LEDs in a side-by-side arrangement along a line, and that, then, the center-to-center distance between adjacent arrays in adjacent modules is the same as the center-to-center r .
1~2378 distance between arrays within the same module. Each array is used to display a single alphanumeric character. Thi9 two-edge abuttability allows to assemble relatively small modules, having, ~or example, seven individual character display arrays per S module, to be used in building larger alphanumeric display assemblies without undesirable irregularities in the spacings between characters displayed in mutually adjacent modules. Such modules are convenient for use in configuring larger display assemblies, because they are self-contained. Row driving circuitry and column driving circuitry is included within the hermetlcally sealed module to minimize the number of connection points required by each module.
~he above-described known modules cannot, however, be used to construct graphic display assemblies, because the LEDs are organized into individual arrays for the display of single alphanumeric characters. Even if additional LEDs were provided to fill in the spaces between arrays, the modules could not be used to huild graphic display assemblies, because they are not four-edge-abuttable.
In this context, a four-edge-abuttable module as disclosed herein would be a module configured so that a two-dimensional matrix of such modules could be formed from such modules when they are positioned in a side-by-side arrangement in two distinct, suitably mutually orthogonal directions, each inside module having other modules adjacent all four of its edges, thereby to construct a larger matrix of arrays of LEDs in a manner such that the row spacings and the column spacings between LEDs on adjacent modules would be equal to the row and column spacings between LEDs on an individual module.
30 - Another module which is scanable to provide alphanumeric ~IL01~:378 displays i5 shown in United States Patent No. 3,800,177. It would be impractical to increase the size of the array in such a module to provide the capability of large alphanumeric and graphic display within one module because, for exampLe, of the dimensional tolerance problems, limits of component strength and excessive costs. Similar problems exist with the recently designed monolithic LED display devices, examples of which are shown in United States Patents Nos. 3,940,756, 3,867,666, 3,893,149, 3,703,656, 3,792,465, 3,821,616, 3,942,065 and 3,654,476.
The present invention is intended to solve the problem of creating economically feasible, large LED display assemblies, based upon the concept of a self-contained, four-edge-abuttable LED display module, as defined above. A great number of these modules may be used -to construct assemblies capable of displaying alphanumeric and graphic images of any convenient size, even as large as wall-size units. Each individual module contains an array of LEDs positioned at a uniform center-to-center distance from each ot~er and mounted on one of the two major surfaces o~
a substrate. Such surface may be flat or include irregularities ; 20 for mounting LEDs or for other purposes. The array upon the substrate is configured so that the distance on each side from the outermost row of LEDs to the edge of the module is not greater than the center-to-center distance between individual LEDs.
This configuration makes the module four-edge-abuttable, .
; in that a number of such modules may be positioned side by side along all four edges of each module to configure larger matrices without irregularities in the uniform center-to-center distance between individual LEDs on adjacent modules. The modules form-ing the large display may be mounted on a single, thus common, ~ ' ~V823~8 backplane which is a mounting panel providing the interconnections between the modules and central electronic programming circuitry, such as a computer. Self-contained row and column driver circuitry and recirculating refresh memory i5 provided in the modules on the reverse side, i.e. adjacent the other major surface, of the substrate~ This concept of providing driver circuitry and an LED array on the two opposite major surfaces of a substrate results in a mechanically and electrically optimized package, in that the module may be made relatively thin but still structurally solid, while requiring a minimum number of pin connections between the module and the backplane. Interconnec-tions between the driver circuitry and the LED array are suitably provided by so-called vias, also referred to as feedthroughs, through the substrate. On the reverse side of the module may be mounted interconnect pins, for connection to the backplane, and a ring frame, described further below, may be used for supporting the pins, with a cover being sealed to the ring frame to provide hermetic sealing of the driver circuitry, if desired.
In accordance with a broad aspect of the invention, there is provided an optical display arrangement comprising at least one module having a plurality of light-emitting diodes supported by a common insulating base structure and organized to form at least one array of light-emitting diodes, there being provided associated driving circuitry for controlled energization of the light-emitting diodes, wherein, for the, or each, module, the supporting base structure is in the form of a substantially flat plate, thus having two major surfaces facing in opposite direc-tions, and constituting a substrate, one of the two major surfaces supporting an array of light-emitting diodes, the driving circuitry being mounted adjacent the other major surface.
.
Optimum conditions are achieved when each of the major surfaces of the substrate is of substan-tially the same size as the entire module, the substrate thus separating, one from the other, a zone with light-emitting diodes supported by the one surface and another zone containing the driving circuitry adjacent the other surface~
In accordance with the desirable feature of four-edge abuttability, the light-emitting diodes are suitably distributed over the one surface at a uniform center-to-center distance between the diodes of pairs of adjacent diodes, the light-emitting diodes nearest an edge of the substrate being positioned at a distance from the edge of the substrate which is not greater than one-half of the uniform center-to-center distance.
In accordance with specific features of embodiments of the invention, the light-emitting diodes of the array are embedded within a protective coating of light-transmissive material which hermetically seals the array of light-emitting diodes to the surface of the substrate. Conductive paths may be provided through the substrate for interconnecting the light-emitting diodes with the driving circuitry, which is preferablysupported by at least one second flat, plate-shaped substrate supporting assembly of the same size and of the same general ; outline as, and having major surface areas secured to, the other major surface of the substrate. Specifically in connection with one modification described further below, two substrates forming the second flat plate-shaped supporting assembly for the driving circuitry are used and leave an open space between each other to permit access to the other major surface of the substrate support-ing the light-emitting diodes, a plurality of connecting wires which interconnect light-emitting diodes with the driving 10i~23~
circuitry upon the two substrates extending through the open space. Moreover, it was found practicaI to provide a box-like protective enclosure covering the driving circuitry and sealed to the surface of a module facing away from the light-emitting diodes, the box-like enclosure heing formed ~y a plate-shaped frame having a central opening and a cover plate which seals the opening by virtue of being secured to the external surface . of the frame.
: Particularly for large-scale optical display arrangements, use of a matrix of a plurality of modules as described herein can : be made, wherein the modules are removably mounted to a panel forming a common backplane for the modules, the matrix of modules forming a continuous pattern of light-emitting diodes organized to leave uniform center-to-center distances between any pair of mutually adjacent light-emitting diodes.
- The invention will become better understood from the following detailed description of one embodiment thereof, when taken in conjunction with the drawings, wherein:
Figure l is an isometric, schematic view of a large-scale graphic display assembly configured from a plurality of four-edge-abuttable display modules upon a bac~plane according to the .present invention, Figure 2 is an isometric view of one of the four-edge- :
abuttable modules shown in Figure 1, : Figure 3 is an exploded view of the module of Figure 2 shown upside down, i.e. in a reversed position, : relative to Figure 2, Figure 4 is an expanded view of one location, identified as area A in Figure 1, where each of four ~Oi~ 3~ .
adjacent modules meets the three others, and Figure 5 is a schematic representation of electronic circuitry useful for the module of Figures 2 and 3.
Figure 1 illustrates a large~scale graphic display 10 which consists of a number of four-edge abuttable modules 12 mounted on a common panel forming the backplane 14 and connected via cable 16 to central electronic programming circuitry 1~.
Each module 12 has visible on its top surface a rectangular array of light-emitting devices, such as light-emitting diodes, referred -to as LEDs. Under the control of programming circuitry 18, selected LEDs in each module can be energized to provide an alphanumeric and/or other graphic display, such as a high~ay complex 23 and alphanumeric legends shown displayed to illustrate an example. Circuitry 18 serves to identify and select those of the diodes in each module which must be energized to present the display required. Many different conventional devices may be used to provide this programming, and in its simplest form, circuitry 18 would be a matrix of switches, each switch being capable of individually energizing a single LED on display panel 10.
It is an important advantage of the present invention that the image displayed can be portrayed without distortion, even though the image may continue, i.e. extend, from one module to another or many others within the large panel display. The area where the four modules 22, 24, 26 and 28 meet, shown in Figure 1 as area A, is described hereinbelow in greater detail with reference to Figure 4.
Figure 2 illustrates in a partly broken away, isometric view, an individual representative module 12, the top surace of 1082371~
which is a transparent layer 34 which conveniently may be made of transparent epoxy. Visible underneath layer 34 and mounted upon a substantially flat plate constituting the substrate 32 is a rectangular, suitably square array 30 of LEDs, Within the module, positioned immediately below substrate 32, is at least one additional substrate 35, w~ich carries the refresh memory, as well as row and column driving circuitry which is described in greater detail hereinbelow.
Figure 3 is an exploded view of module 12, but reversed, i.e. upside down, with respect to Figure 2. In the illustration of Figure 2, substrates 32 and 35, though shown as two distinct layers, may conveniently be configured from one multilayer ceramic substrate. In Figure 3, a modified structure, constituting a three-substrate-configuration is shown which has been found convenient for use in building small numbers of modules. The multilayer ceramic substrate would be convenient for use in high-, volume production runs of identical modules.- The basic function ; requirements for the substrate configurations are the same and are discussed below with reference to Figure 3.
The transparent epoxy layer 34 is visible at the bottom of Figure 3, immediately below substrate 32. On the downwardly facing major surface of substrate 32, as shown, in contact with layer 34, but not uisible in Figure 3, would be the array 30 of LEDs. As is described hereinbelow, interconnections to the LEDs of array 30 are made through so-called vias, also referred to as - feedthroughs, through substrate 32 and are collected by means of conductor pattern 36 to a central area 38 near the center of substrate 320 Positioned upon substrate 32 are two additional smaller - 30 substrates 40 and 42, which together perform the function of ' _g_ ' 7` ' ~8Z37~
substrate 35 of Figure 2. Substrates 40 and 42 are positioned upon substrate 32 so that interconnect area 38 is accessible through channel 39 which is the space formed between substrates 40 and 42. The electrical connections to the LEDs of array 30 are therefore brought to the center of substrate 32 and then ;
carried up to the smaller substrates via any conventional inter-connection technique, such as wire bonds 31. Smalier substrate 40 and 42 support the row and column driving circuitry re~uired for array 30, shown generally as semiconductor chips 44, which are connected, by means of circuitry printed on substrate surface 45, to an area 46 for wire bonding to the LEDs upon the substrate 32.
Interconnections between the module and backplane 14, which is shown in Figure 1, are provided by pins 48 which are connected and secured to substrate 40 and 42 by pin pads 50, even though, in the exploded view of Figure 3, ~these pins appear to protrude from a box-like sealing structure described below.
Backplane 14 may conveniently have sock-ets (not shown) into which pins 48 can be inserted. The box-like sealing structure includes a ring frame 52 having a large central opening and smaller lateral openlngs through which pins 48 may protrude. After substrates 40 and 42 are mounted to substrate 32 by means of, for example, epoxy cement and pins 48 are soldered to pads 50, ring frame 52 may be positioned over the partially completed module to provide additional support for pins 48. This provides a mounting surface for a cover 54 which closes the box-liXe structure as it may be sealed to ring frame 52 to provide a hermetic seal for circuitry 44 and the delicate wire bonds.
The above-described construction for module 12 provides hermetically sealed, self-contained refresh memory, as well as row and column drive circuitry in a convenient, substantially flat, rectangular or s~uare package, inasmuch as each of the major surfaces of the substrate 32 i9 of substantially the same size as the entire module, the substrate thus separating, one from the other, a zone with light~emitting diodes supported by one major surface and another zone containing the driving circuitry 44, adjacent the other major surface of the substrate 32. The four-edge abuttability which is conveniently achieved by this construction can most easily be explained with reference to Figure 4 which shows area A of Figure 1 where modules 22, 24, ~.
26 and 28 meet. In Figure 4, the top surface of substrate 32 of .
module 22 has applied thereto a paralleI series of column con- :
ductor strips at the uniform center-to-center distance X
represented by column conductors 60, 70 and 72. When modules 22 and 28 are properly positioned on backplane 14, see Figure l, :
the column conductor strips in all adjacent modules are aligned as shown by the relationship of columns 60, 70 and 72 of module 22 to columns 61, 71 and 73 of module 28. The columns may conveniently be printed wiring paths or formed under use of any other conventional technology.
Upon each column are positioned LEDs at the uniform center-to-center distance X as represented by LEDs 56 and 58 on column 60 and LEDs 57 and 59 on column~70. The LEDs are mounted with a conductive epoxy or by other means for providing an electrical connection between the base or cathode of each LED and the column strip. Each of the LEDs of each column,is aligned with the nearest LED of each adjacent column to form rows of LEDs running transverse to the columns. By way of illustration, LEDs 58, 59 and 80 on module 22 are aligned with LED 62 oE module 24, as shown by the relationship between row 84 of module 22 and 3~8 :i row 86 of module 24~ The anodes of the LEDs along a row are connected by wire bonds, such as wire bond 64 connecting LED 58 to 1ED 59 in row 84. Interconnection between the drive circuitry on the backside of the module and wire bond 64 is provided by the feedthrough 66 ~hich extends through substrate 3Z, as ; described above. Connections to the column circuits are provided, for example, by a feedthrough 68 in column 60.
It is critical to the four-edge-abuttability of these modules that the center-to-center distance between the outermost ; lO LEDs of adjacent modules, such as between LED 58 of module 22 and LED 62 of module 24, be equal to the uniform center-to-center distance. This is most conveniently accomplished by the symmetrical construction shown herein. Thus, the distances from the outermost LEDs to the edges of the module are equal for all four edges and not greater than half the center-to-center distance X, as shown in Figure 4. A nonsymmetrical configuration could also be used, as long as the sum of the distances from an outermost LED to the edge of the module for two adjacent modules is not greater than the uniform center-to-center distance. Thus, . 20 it can be seen that the light-emitting diodes are distributed over the one major surface of substrate 32 at the uniform center-to-center distance X between the diodes of pairs of adjacent diodes, the light-emitting diodes nearest an edge of the -substrate 32 being positioned at a distance from the edge of the substrate 32 which is not greater than one-half of the uniform center-to-center distance. Moreover, though the driving -~ circuitry could be directly supported by the same flat, plate-shaped substrate 32 which supports the diodes, it was found advantageous to construct a module such that the driving circuitry 44 is supported by at least one second flat, plate-~L0~32378 shaped substrate supporting assembly of the same size and of the same general outline as, and having major surface areas secured to, the other major surface of the substrate 32, Then, the two substrates 40 and 42 forming the second flat plate-shaped supporting assembly for the driving circuitry 44 leave the open space 39 between each other to permit access to the other major surface of the substrate 32 supporting the light-emitting diodes, a plurality of connecting wires which interconnect light-emitting diodes with the driving circuitry 44 upon the two substrates 40 and 42 extending through the open space 39.
A complete optical display arrangement then constitutes a matrix of a plurality of modules removably mounted to a panel forming a common backplane for the modules, the matrix of modules forming a continuous pattern of light-emitting diodes organized to leave uniform center-to-center distances between any pair of mutually adjacent light-emitting diodes.
j Figure 5 is a schematic representation of the row~and column driver circuitry of module 12 and a partial showing of array 30. Portions of columns 88, 90 and 92 are shown, together with rows 94, 96 and 98, row 94 being constituted by LEDs 100, 102 and 104, while row 96 includes LEDs 106, 108 and 110.
Individual LEDs within each module, and therefore within a large display assembly, are selected for controlled energiza-tion by strobing through the columns, one at a time. The columns are selected by column driving circuitry 112 which includes register 114 receiving as its input the output of clock 116 which may be centrally located or controlled by circuitry 18, shown in Flgure 1, so that all columns within a display assembly are strobed in sequence. The outputs of register 114 are used to activate column drivers associated with each column to enable ~l.()~Z378 them for a fixed period of time. The column drivers may con-veniently be electronic switches capable of handling the current requirement of a column of LEDs. They are represented by driver circuits 118, 120 and 122 for columns 88, 90 and 92, respectively.
Row driving circuitry 124 is utilized to select the LEDs to be energized in a specific column when enabled by column driving circuitry 112. Associated with each row is a specific row driver circuit, such as drivers 78, 126 and 128 for rows 94, 96 and 98, respectively. The drivers may conveniently be conventional electronic switches and are required to handle the power for only one LED at a time. ~he row drivers shown are controlled by a shift register 130 from information processed by circuitry 18, also shown in Figure 1.
A switch 132 receives the digital in~ormation for con- -trolling the LEDs in the enabled column and presents this information to register 130. This information is then stored - in a memory 134 so that the row driving information may be repeated until a change is required. This technique reduces the complexity of the circuitry involved. The information presented to register 130 is therefore controlled by the operation of switch 132.
Integrated circuit chips 44 comprising row driving circuitry 124 are shown in Figure 3 mounted on substrate 40, and connected to matrix array 30 by ~eedthroughs through substrate 32. Integrated circuit chips 44 are connected on the front side of substrate 32 to the~appropriate row wire bond as discussed hereinabove. In a similar manner, column driver circuitry 112 may be mounted on substrate 42 and connected to the appropriate column on the front side of substrate 32.
___ ~L082371~
It is important to note that any substrate configuration capable of supporting the array 30 of LEDs on one major surface and memory 134, as well as row and column driver circuitry 124 and 112 on its oppositely facing major surface while providing the requisite interconnections therebetween, may be used.
Claims (8)
1. An optical display arrangement comprising a plurality of modules, each module having a two-dimensional matrix of light-emitting diodes mounted upon a common insulating structure, driving circuitry for each matrix of light-emitting diodes and a panel forming a common backplane for removably supporting the modules, the supporting base structure for each module including a substantially flat plate-shaped substrate having two major surfaces facing in opposite directions, one of the two major surfaces supporting said two-dimensional matrix of light-emitting diodes, said driving circuitry being mounted adjacent the other major surface which faces the backplane.
2. Optical display arrangement according to Claim 1, wherein each of the major surfaces of the substrate of each module is substantially the same size as the entire module, the substrate thus separating, one from the other, a zone with light-emitting diodes supported by the one surface and another zone containing the driving circuitry adjacent the other surface.
3. Optical display arrangement according to Claim 1, wherein the light-emitting diodes are distributed over the one surface at a uniform center-to-center distance between the diodes of pairs of adjacent diodes, the light-emitting diodes nearest an edge of the substrate being positioned at a distance from the edge of the substrate which is not greater than one half of the uniform center-to-center distance.
4. Optical display arrangement according to Claim 1, wherein the light-emitting diodes of each module are embedded within a protective coating of light-transmissive material which hermetically seals the light-emitting diodes to the surface of the substrate.
5. Optical display arrangement according to Claim 1, comprising conductive paths through the substrate for interconnecting the light-emitting diodes with the driving circuitry.
6. Optical display arrangement according to Claim 1, wherein the driving circuitry is supported by at least one second flat, plate-shaped substrate supporting assembly of the same size and of the same general outline as, and having major surface areas secured to, the other major surface of the substrate.
7. Optical display arrangement according to Claim 6, wherein the two substrates forming the second flat, plate-shaped supporting assembly for the driving circuitry leave an open space between each other to permit access to the other major surface of the substrate supporting the light-emitting diodes, a plurality of connecting wires which interconnect light-emitting diodes with the driving circuitry upon the two substrates extending through the open space.
8. Optical display arrangement according to Claim 1, comprising a box-like protective enclosure covering the driving circuitry and sealed to the surface of a module facing away from the light-emitting diodes, the box-like enclosure being formed by a plate-shaped frame having a central opening and a cover plate which seals the opening by virtue of being secured to the external surface of the frame.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71173576A | 1976-08-05 | 1976-08-05 | |
US711,735 | 1976-08-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1082378A true CA1082378A (en) | 1980-07-22 |
Family
ID=24859299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA274,707A Expired CA1082378A (en) | 1976-08-05 | 1977-03-24 | Abuttable light-emitting device modules for graphic display assemblies |
Country Status (9)
Country | Link |
---|---|
JP (1) | JPS5318999A (en) |
BE (1) | BE854349A (en) |
CA (1) | CA1082378A (en) |
CH (1) | CH621013A5 (en) |
DE (1) | DE2731717C3 (en) |
FR (1) | FR2360950A1 (en) |
GB (1) | GB1585394A (en) |
IT (1) | IT1078477B (en) |
NL (1) | NL176813C (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0035382B1 (en) * | 1980-02-29 | 1986-06-04 | Fujitsu Limited | Modular display device and display module therefor |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS604991B2 (en) * | 1979-05-11 | 1985-02-07 | 株式会社東芝 | display device |
JPS575083A (en) * | 1980-06-13 | 1982-01-11 | Tokyo Shibaura Electric Co | Display unit |
JPS5850572A (en) * | 1981-09-22 | 1983-03-25 | 株式会社東芝 | Manufacture of display |
CA1205931A (en) * | 1982-11-04 | 1986-06-10 | Integrated Systems Engineering, Inc. | Solid state display system and light emitting diode pixels therefor |
US5184114A (en) * | 1982-11-04 | 1993-02-02 | Integrated Systems Engineering, Inc. | Solid state color display system and light emitting diode pixels therefor |
GB2147444A (en) * | 1983-09-30 | 1985-05-09 | Racal Res Ltd | Display systems |
JPS60163483U (en) * | 1985-03-13 | 1985-10-30 | 株式会社東芝 | display device |
JPH0741028Y2 (en) * | 1991-07-22 | 1995-09-20 | 株式会社サンミューロン | display |
JP2786569B2 (en) * | 1992-10-06 | 1998-08-13 | 株式会社 パトライト | LED display |
DE102012105630B4 (en) * | 2012-06-27 | 2023-04-20 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Lighting arrangement with lighting device and method for operating a lighting device |
US8974077B2 (en) | 2012-07-30 | 2015-03-10 | Ultravision Technologies, Llc | Heat sink for LED light source |
US9582237B2 (en) | 2013-12-31 | 2017-02-28 | Ultravision Technologies, Llc | Modular display panels with different pitches |
US9195281B2 (en) | 2013-12-31 | 2015-11-24 | Ultravision Technologies, Llc | System and method for a modular multi-panel display |
US9311847B2 (en) | 2014-07-16 | 2016-04-12 | Ultravision Technologies, Llc | Display system having monitoring circuit and methods thereof |
KR20200115533A (en) | 2018-01-30 | 2020-10-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Display panel, display device, input/output device, information processing device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1589279A1 (en) * | 1966-09-26 | 1970-05-14 | Olivetti & Co Spa | Device for displaying images on a screen |
US3701123A (en) * | 1969-10-29 | 1972-10-24 | Hewlett Packard Co | Hybrid integrated circuit module |
US3800177A (en) * | 1971-12-20 | 1974-03-26 | Motorola Inc | Integrated light emitting diode display device with housing |
US3889147A (en) * | 1974-09-30 | 1975-06-10 | Litton Systems Inc | Light emitting diode module |
-
1977
- 1977-03-24 CA CA274,707A patent/CA1082378A/en not_active Expired
- 1977-04-14 NL NLAANVRAGE7704082,A patent/NL176813C/en not_active IP Right Cessation
- 1977-05-04 FR FR7713560A patent/FR2360950A1/en active Granted
- 1977-05-06 BE BE177345A patent/BE854349A/en not_active IP Right Cessation
- 1977-06-09 IT IT49769/77A patent/IT1078477B/en active
- 1977-06-16 JP JP7058877A patent/JPS5318999A/en active Pending
- 1977-06-27 GB GB26886/77A patent/GB1585394A/en not_active Expired
- 1977-07-13 DE DE2731717A patent/DE2731717C3/en not_active Expired
- 1977-07-19 CH CH891777A patent/CH621013A5/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0035382B1 (en) * | 1980-02-29 | 1986-06-04 | Fujitsu Limited | Modular display device and display module therefor |
Also Published As
Publication number | Publication date |
---|---|
DE2731717A1 (en) | 1978-02-23 |
NL176813B (en) | 1985-01-02 |
DE2731717C3 (en) | 1982-07-08 |
NL176813C (en) | 1985-06-03 |
FR2360950B1 (en) | 1980-09-19 |
BE854349A (en) | 1977-09-01 |
JPS5318999A (en) | 1978-02-21 |
FR2360950A1 (en) | 1978-03-03 |
NL7704082A (en) | 1978-02-07 |
IT1078477B (en) | 1985-05-08 |
GB1585394A (en) | 1981-03-04 |
DE2731717B2 (en) | 1979-06-13 |
CH621013A5 (en) | 1980-12-31 |
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