JPH02290032A - レジンモールド型半導体装置の製造方法 - Google Patents

レジンモールド型半導体装置の製造方法

Info

Publication number
JPH02290032A
JPH02290032A JP1325668A JP32566889A JPH02290032A JP H02290032 A JPH02290032 A JP H02290032A JP 1325668 A JP1325668 A JP 1325668A JP 32566889 A JP32566889 A JP 32566889A JP H02290032 A JPH02290032 A JP H02290032A
Authority
JP
Japan
Prior art keywords
resin
header
semiconductor device
orifice plate
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1325668A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0512853B2 (enrdf_load_stackoverflow
Inventor
Minoru Suda
須田　実
Masao Yamaguchi
正男 山口
Nobukatsu Tanaka
信克 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1325668A priority Critical patent/JPH02290032A/ja
Publication of JPH02290032A publication Critical patent/JPH02290032A/ja
Publication of JPH0512853B2 publication Critical patent/JPH0512853B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1325668A 1989-12-14 1989-12-14 レジンモールド型半導体装置の製造方法 Granted JPH02290032A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1325668A JPH02290032A (ja) 1989-12-14 1989-12-14 レジンモールド型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1325668A JPH02290032A (ja) 1989-12-14 1989-12-14 レジンモールド型半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP12516384A Division JPS615529A (ja) 1984-06-20 1984-06-20 絶縁型半導体装置

Publications (2)

Publication Number Publication Date
JPH02290032A true JPH02290032A (ja) 1990-11-29
JPH0512853B2 JPH0512853B2 (enrdf_load_stackoverflow) 1993-02-19

Family

ID=18179382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1325668A Granted JPH02290032A (ja) 1989-12-14 1989-12-14 レジンモールド型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH02290032A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5368805A (en) * 1992-03-24 1994-11-29 Fuji Electric Co., Ltd. Method for producing resin sealed type semiconductor device
JP2016082065A (ja) * 2014-10-16 2016-05-16 新電元工業株式会社 半導体装置の製造方法、半導体装置、金型およびリードフレーム
WO2024219244A1 (ja) * 2023-04-21 2024-10-24 ローム株式会社 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758771U (enrdf_load_stackoverflow) * 1980-09-25 1982-04-07
JPS5983052U (ja) * 1982-11-29 1984-06-05 日本電気ホームエレクトロニクス株式会社 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758771U (enrdf_load_stackoverflow) * 1980-09-25 1982-04-07
JPS5983052U (ja) * 1982-11-29 1984-06-05 日本電気ホームエレクトロニクス株式会社 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5368805A (en) * 1992-03-24 1994-11-29 Fuji Electric Co., Ltd. Method for producing resin sealed type semiconductor device
JP2016082065A (ja) * 2014-10-16 2016-05-16 新電元工業株式会社 半導体装置の製造方法、半導体装置、金型およびリードフレーム
WO2024219244A1 (ja) * 2023-04-21 2024-10-24 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
JPH0512853B2 (enrdf_load_stackoverflow) 1993-02-19

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