JPH0228353A - Resin sealed type semiconductor device - Google Patents
Resin sealed type semiconductor deviceInfo
- Publication number
- JPH0228353A JPH0228353A JP63179372A JP17937288A JPH0228353A JP H0228353 A JPH0228353 A JP H0228353A JP 63179372 A JP63179372 A JP 63179372A JP 17937288 A JP17937288 A JP 17937288A JP H0228353 A JPH0228353 A JP H0228353A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- resin
- semiconductor device
- lead frame
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 19
- 229920005989 resin Polymers 0.000 title claims abstract description 19
- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- 239000008188 pellet Substances 0.000 claims abstract description 27
- 238000007789 sealing Methods 0.000 abstract description 7
- 238000005452 bending Methods 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は樹脂封止型半導体装置に関し、特に樹脂封止の
反りを防止できる樹脂封止型半導体装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin-sealed semiconductor device, and particularly to a resin-sealed semiconductor device that can prevent warping of the resin seal.
従来、この種の樹脂封止型半導体装置は、第６図に示す
様にリードフレーム４にペレット１を搭載し、ワイヤー
３にてペレット１とリードフレーム４を結線した後に、
樹脂封止を行なっていた。Conventionally, in this type of resin-sealed semiconductor device, a pellet 1 is mounted on a lead frame 4 as shown in FIG. 6, and after the pellet 1 and the lead frame 4 are connected with a wire 3,
It was sealed with resin.
上述した従来の樹脂封止型半導体装置は、リードフレー
ムの上下が非対称構造となっているので、樹脂封止後の
熱履歴により第４図の様に封止樹脂が反りこのため樹脂
封止型半導体装置リード部を曲げ加工した際、第５図の
様にリード６の平坦性がそこなわれるという欠点がある
。In the conventional resin-sealed semiconductor device described above, the top and bottom of the lead frame are asymmetrical, so the heat history after resin encapsulation causes the sealing resin to warp as shown in Figure 4. When bending the semiconductor device lead portion, there is a drawback that the flatness of the lead 6 is damaged as shown in FIG. 5.
本発明の樹脂封止型半導体装置は、リードフレーム上に
ペレットを搭載し樹脂封止する樹脂封止型半導体装置に
おいて、前記ペレットを搭載するリードフレームの対面
にダミーペレットを搭載し、前記ペレット及び前記ダミ
ーペレットを一体的に樹脂封止することを特徴とする。The resin-sealed semiconductor device of the present invention is a resin-sealed semiconductor device in which a pellet is mounted on a lead frame and sealed with resin, in which a dummy pellet is mounted on the opposite side of the lead frame on which the pellet is mounted, and the pellet and The method is characterized in that the dummy pellet is integrally sealed with resin.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of an embodiment of the present invention.
リードフレーム４にペレット１を搭載し、ワイヤー３に
てペレット１とリードフレーム４を結線した後にダミー
ペレット２をペレット１の対面に設け、樹脂封止を行な
う。本実施例では、リードフレーム４の上下の構造が対
称であるため、樹脂封止を行なう時の熱影響を受けても
樹脂封止体５に反りを発生しない。After mounting the pellet 1 on a lead frame 4 and connecting the pellet 1 and the lead frame 4 with a wire 3, a dummy pellet 2 is provided on the opposite side of the pellet 1, and resin sealing is performed. In this embodiment, since the upper and lower structures of the lead frame 4 are symmetrical, the resin-sealed body 5 does not warp even if it is affected by heat during resin-sealing.
以上説明したように本発明は、ダミーペレットを有する
ことによりリードフレーム上下の構造を同一にする事に
よって、樹脂封止体の反りを防止することができる。し
たがって、樹脂封止型半導体装置リード部を曲げ加工し
た際第３図の様にリードの平坦性を満足することができ
る効果を有するものである。As explained above, according to the present invention, the structure of the upper and lower parts of the lead frame can be made the same by having the dummy pellet, thereby preventing the resin molded body from warping. Therefore, when the lead portion of the resin-sealed semiconductor device is bent, the flatness of the lead can be satisfied as shown in FIG. 3.
第１図は本発明の一実施例の樹脂封止型半導体装置の縦
断面図、第２図は該−実施例の樹脂封止型半導体装置の
リード部を曲げ加工後の斜視図、第善ま第２図のりづ部
のＡ矢視図である。第４図は従来の樹脂対、止型半導体
装置のリード部を曲げ加工後の斜視図、第５図は第４図
のリード部のＢ矢視図である。第６図は従来の樹脂封止
型半導体装置の縦断面図である。
１・・・・・・ペレット、２・・・・・・ダミーペレッ
ト、３・・・・・・ワイヤー ４・・・・・・リードフ
レーム、５・・・・・・樹脂封止部、６・・・・・・リ
ード部。
代理人 弁理士 内 原 晋FIG. 1 is a longitudinal cross-sectional view of a resin-sealed semiconductor device according to an embodiment of the present invention, and FIG. It is a view of the slope section in FIG. 2 in the direction of arrow A. FIG. 4 is a perspective view of the lead portion of a conventional resin pair and stop type semiconductor device after being bent, and FIG. 5 is a view of the lead portion of FIG. 4 in the direction of arrow B. FIG. 6 is a longitudinal sectional view of a conventional resin-sealed semiconductor device. 1... Pellet, 2... Dummy pellet, 3... Wire 4... Lead frame, 5... Resin sealing part, 6・・・・・・Lead part. Agent Patent Attorney Susumu Uchihara
Claims (1)
封止型半導体装置において、前記ペレットを搭載するリ
ードフレームの対面にダミーペレットを搭載し、前記ペ
レット及び前記ダミーペレットを一体的に樹脂封止する
ことを特徴とする樹脂封止型半導体装置。In a resin-sealed semiconductor device in which a pellet is mounted on a lead frame and sealed with resin, a dummy pellet is mounted on the opposite side of the lead frame on which the pellet is mounted, and the pellet and the dummy pellet are integrally sealed with resin. A resin-sealed semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63179372A JPH0228353A (en) | 1988-07-18 | 1988-07-18 | Resin sealed type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63179372A JPH0228353A (en) | 1988-07-18 | 1988-07-18 | Resin sealed type semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0228353A true JPH0228353A (en) | 1990-01-30 |
Family
ID=16064702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63179372A Pending JPH0228353A (en) | 1988-07-18 | 1988-07-18 | Resin sealed type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0228353A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994020986A1 (en) * | 1993-03-02 | 1994-09-15 | National Semiconductor Corporation | Device and method for reducing thermal cycling in a semiconductor package |
| JPH06295970A (en) * | 1993-04-08 | 1994-10-21 | Seiko Epson Corp | Semiconductor device and manufacture of semiconductor device |
-
1988
- 1988-07-18 JP JP63179372A patent/JPH0228353A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994020986A1 (en) * | 1993-03-02 | 1994-09-15 | National Semiconductor Corporation | Device and method for reducing thermal cycling in a semiconductor package |
| US5901043A (en) * | 1993-03-02 | 1999-05-04 | National Semiconductor Corporation | Device and method for reducing thermal cycling in a semiconductor package |
| JPH06295970A (en) * | 1993-04-08 | 1994-10-21 | Seiko Epson Corp | Semiconductor device and manufacture of semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0498864A (en) | Resin sealed type semiconductor device | |
| JPH05235228A (en) | Method of manufacturing electronic component | |
| JPH0228353A (en) | Resin sealed type semiconductor device | |
| JPS6216553B2 (en) | ||
| JPS6230496B2 (en) | ||
| JPH0519958Y2 (en) | ||
| JP3159555B2 (en) | Method for manufacturing power semiconductor device | |
| JPS63252455A (en) | Semiconductor device | |
| JPH0358452A (en) | Resin-sealed semiconductor device | |
| JPS61276245A (en) | Semiconductor integrate circuit device | |
| JPH01181450A (en) | Resin sealed semiconductor device | |
| KR950034719A (en) | Lead frame and package device manufacturing method including the lead frame | |
| KR0119759Y1 (en) | Bottom Leaded Semiconductor Package | |
| JPH04162753A (en) | Semiconductor device | |
| KR200331874Y1 (en) | Multi-pin Package of Semiconductor | |
| JPH05121626A (en) | Lead frame for semiconductor chip carrier and juniction structure thereof | |
| JPH01276656A (en) | Resin sealed semiconductor | |
| JPS62183547A (en) | Lead frame | |
| JPH03116763A (en) | Lead frame for molded and sealed semiconductor device | |
| JPS59211254A (en) | Bonding wire | |
| JPH0297051A (en) | Lead frame | |
| JPH01255259A (en) | Resin-sealed semiconductor device | |
| JPH04118951A (en) | Structure of semiconductor package | |
| JPS6223142A (en) | Lead frame | |
| JPH0470778B2 (en) |