JPH0228257B2 - - Google Patents

Info

Publication number
JPH0228257B2
JPH0228257B2 JP59122574A JP12257484A JPH0228257B2 JP H0228257 B2 JPH0228257 B2 JP H0228257B2 JP 59122574 A JP59122574 A JP 59122574A JP 12257484 A JP12257484 A JP 12257484A JP H0228257 B2 JPH0228257 B2 JP H0228257B2
Authority
JP
Japan
Prior art keywords
polyimide resin
semiconductor device
resin
film
exposed surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59122574A
Other languages
English (en)
Japanese (ja)
Other versions
JPS612349A (ja
Inventor
Mitsumasa Iwahara
Yoshitomo Ogimura
Juji Nakazawa
Katsumi Ooguri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP59122574A priority Critical patent/JPS612349A/ja
Publication of JPS612349A publication Critical patent/JPS612349A/ja
Publication of JPH0228257B2 publication Critical patent/JPH0228257B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • H01L23/3171Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59122574A 1984-06-14 1984-06-14 半導体装置の製造方法 Granted JPS612349A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59122574A JPS612349A (ja) 1984-06-14 1984-06-14 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59122574A JPS612349A (ja) 1984-06-14 1984-06-14 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS612349A JPS612349A (ja) 1986-01-08
JPH0228257B2 true JPH0228257B2 (enExample) 1990-06-22

Family

ID=14839269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59122574A Granted JPS612349A (ja) 1984-06-14 1984-06-14 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS612349A (enExample)

Also Published As

Publication number Publication date
JPS612349A (ja) 1986-01-08

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term