JPH02278792A - Manufacture of three-dimensional printed-circuit molded body - Google Patents
Manufacture of three-dimensional printed-circuit molded bodyInfo
- Publication number
- JPH02278792A JPH02278792A JP9975889A JP9975889A JPH02278792A JP H02278792 A JPH02278792 A JP H02278792A JP 9975889 A JP9975889 A JP 9975889A JP 9975889 A JP9975889 A JP 9975889A JP H02278792 A JPH02278792 A JP H02278792A
- Authority
- JP
- Japan
- Prior art keywords
- molded body
- circuit board
- printed circuit
- phenol resin
- primary molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000005011 phenolic resin Substances 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 238000000748 compression moulding Methods 0.000 abstract description 11
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 7
- 229920001568 phenolic resin Polymers 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000007924 injection Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
Landscapes
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、平面でない立体的な成形体の表面に印刷回路
を備えた立体印刷回路成形体の製造法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a three-dimensional printed circuit molded body having a printed circuit on the surface of the three-dimensional molded body, which is not a flat surface.
従来の技術
立体印刷回路成形体は、回路スペースを節約する上で種
々検討されている。例えば、無電解メツキのための触媒
を配合したエポキシ樹脂で、所定の立体成形体を成形す
る。そして、その成形体表面全面に鋼の無電解メツキを
施した後、このメツキ層を必要に応じてエツチングによ
り除去して回路を形成する。しかし、この方法では、成
形体の立体形状が平面に近いものにしか対応できない。2. Description of the Related Art Three-dimensional printed circuit molded bodies have been studied in various ways in order to save circuit space. For example, a predetermined three-dimensional molded body is molded using an epoxy resin mixed with a catalyst for electroless plating. Then, after applying electroless plating of steel to the entire surface of the molded body, this plating layer is removed by etching as necessary to form a circuit. However, this method can only handle molded bodies whose three-dimensional shape is close to a flat surface.
立体形状の凹凸が深いと、エツチングの際のレジスト層
の形成が困難になるからである。また、回路のファイン
パターンの形成も難しい。無電解メツキでは、メツキの
成形体宍面への接着信頼性が不十分で、回路の線幅を細
くしてい＜（０，３ｍｍ以下）と、断線の慣れがあるか
らである。This is because if the three-dimensional irregularities are deep, it becomes difficult to form a resist layer during etching. Furthermore, it is difficult to form fine circuit patterns. This is because in electroless plating, the adhesion reliability of the plating to the surface of the molded body is insufficient, and if the line width of the circuit is made thin (0.3 mm or less), wire breakage is common.
そこで、次のような方法が提案されている。Therefore, the following method has been proposed.
すなわち、ポリイミド、ポリエステル等ノフィルムを絶
縁基体として、これに鋼箔を貼りつけた材料を印刷、エ
ツチングの工程に供し、フレキシブル印刷回路板を得る
。このフレキシブル印刷回路板を射出成形の金型に配置
し、樹脂を射出してフレキシブル印刷回路板がその表面
に一体となった立体成形体を得る方法である。That is, a material in which a film of polyimide, polyester, etc. is used as an insulating substrate and a steel foil is attached thereto is subjected to printing and etching processes to obtain a flexible printed circuit board. In this method, this flexible printed circuit board is placed in an injection mold, and resin is injected to obtain a three-dimensional molded body in which the flexible printed circuit board is integrated on the surface thereof.
発明が解決しようとする課題
しかし、上記のフレキシブル印刷回路板を用いる方法で
は、成形時に樹脂の流動と射出圧で、剛性のないフレキ
シブル印刷回路板の位置ずれを起こし、回路の位置精度
を保てなかったＣ１回路の断線を起こすことがある。ま
た、射出した樹脂が、回路板の表面に回り込んで回路の
一部を覆ってしまうことも起こる。Problems to be Solved by the Invention However, in the above-mentioned method using a flexible printed circuit board, the flow of resin and injection pressure during molding cause the position of the non-rigid flexible printed circuit board to shift, making it difficult to maintain the positional accuracy of the circuit. This may cause disconnection of the C1 circuit that was not present. Furthermore, the injected resin may wrap around the surface of the circuit board and cover part of the circuit.
本発明の課題は、深い凹凸形状の立体成形体にも対応で
き、回路の位置精度も十分に保つことができる立体印刷
回路成形体の製造法を提供することである。An object of the present invention is to provide a method for producing a three-dimensional printed circuit molded body which can also be applied to a three-dimensional molded body having a deeply uneven shape and which can maintain sufficient positional accuracy of the circuit.
課題を解決するための手段
上記課題を解決するために１本発明に係る製造法では１
次のような工程を経る。Means for Solving the Problems In order to solve the above problems, 1. In the manufacturing method according to the present invention, 1.
The process goes through the following steps.
シート状の基材に可撓性の熱硬化性樹脂を含浸し金属箔
と一体に成形した材料を用意する。A material is prepared by impregnating a sheet-like base material with a flexible thermosetting resin and molding it integrally with metal foil.
このような材料は、例えば、特願昭６３−４３４４５号
、特願昭６３−５５５６０号に開示されている。前記材
料を印刷、エツチングの工程に供し、印刷回路板を得る
。Such materials are disclosed, for example, in Japanese Patent Application Nos. 63-43445 and 63-55560. The material is subjected to printing and etching processes to obtain a printed circuit board.
別途、フェノール樹脂を用い、フェノール樹脂が完全に
硬化していない所定の立体形状の一次成形体を得る。そ
して、前記印刷回路板と一次成形体を重ねて圧縮成形金
型に装填し、加熱加圧により印刷回路板が一次成形体の
形状に沿うように両者を一体に成形するものである。Separately, a phenol resin is used to obtain a primary molded body of a predetermined three-dimensional shape in which the phenol resin is not completely cured. Then, the printed circuit board and the primary molded body are stacked and loaded into a compression molding mold, and the two are integrally molded by heating and pressing so that the printed circuit board follows the shape of the primary molded body.
作用
上記印刷回路板は、可撓性の熱硬化性樹脂を用いている
ので折υ曲げが可能であり、圧縮成形の段階で一次成形
体の形状に沿って一体に成形される。印刷回路板は、折
シ曲げが可能であるものの、シート状基材で補強されて
いるのである程度剛性を有する。そして、圧縮成形の段
階では、−火成形体を構成するフェノール樹脂の流動は
少ないので、印刷回路板の位置ずれを起こしたり、その
表面が流動したフェノール樹脂で覆われることはない。Function: Since the printed circuit board is made of a flexible thermosetting resin, it can be bent, and is integrally molded according to the shape of the primary molded product during compression molding. Although printed circuit boards can be bent, they have some degree of rigidity because they are reinforced with a sheet-like base material. At the stage of compression molding, the flow of the phenolic resin constituting the fire-formed body is small, so the printed circuit board will not be displaced or its surface will be covered with the fluidized phenolic resin.
フェノール樹脂は、圧縮成形の段階で完全に硬化するが
、この硬化反応は、一部印刷回路板？構成する熱硬化性
樹脂との間でも起こり、化学的な結合力を高める。本発
明では、−火成形とその後の圧縮成形の工８を行なうの
に適した材料としてフェノール樹脂を用いている。Phenolic resin is completely cured during the compression molding stage, but is this curing reaction a part of the printed circuit board? It also occurs with the constituent thermosetting resin, increasing the chemical bonding strength. In the present invention, phenolic resin is used as a material suitable for performing the process 8 of fire forming and subsequent compression molding.
実施例
可撓性のエポキシ樹脂をシート状基材に含浸し、鋼箔を
重ねて一体に成形した０、４ｍ＋ｎ厚の材料（商品名グ
リーンフレックス、新神戸電機製）を、印刷、エツチン
グの工程に供し、折り曲げ可能な印刷回路板を得た。Example A sheet-like base material impregnated with flexible epoxy resin and integrally molded with steel foil, 0.4m+n thick material (trade name: Greenflex, manufactured by Shin-Kobe Electric Machinery), was subjected to printing and etching processes. A foldable printed circuit board was obtained.
ガラス繊維充填フェノール樹脂を、金型温度４０〜６０
°Ｃ１樹脂温度６０〜９０℃で射出成形し、断面Ｕ字形
の一次成形体１を得た（第１図（ａ））。Glass fiber filled phenolic resin, mold temperature 40~60
Injection molding was performed at a resin temperature of 60 to 90° C. to obtain a primary molded body 1 having a U-shaped cross section (FIG. 1(a)).
−火成形体１は樹脂が完全に硬化しておらず、位置決め
穴２を成形と同時に設けた。- The resin in the fire-formed body 1 was not completely cured, and the positioning holes 2 were provided at the same time as the molding.
上記の印刷回路板３にも位置決め穴４を設けておく。−
火成形体１と印刷回路板３を重ねて圧縮成形金型に装填
するのであるが、それぞれの位置決め穴２，４に金型の
位置決めピンを挿入して位置合せを行なう（第１図（ｂ
） ） Ｑその後金型を閉じ、１８０°Ｃ，２００ｋｇ
／ｃ！ｌで圧縮成形し、印刷回路板３が一次成形体１の
形状に沿って曲折し、両者が一体となった立体印刷回路
成形体４を得た（第１図（Ｃ））。この圧縮成形時にフ
ェノール樹脂は完全に硬化する。硬化反応で、フェノー
ル樹脂は印刷回路の絶縁基板を構成するエポキシ樹脂と
も反応し、物理的な結合に加えて化学的な結合もして、
印刷回路板と成形体の強固な一体化が図られる。Positioning holes 4 are also provided in the printed circuit board 3 mentioned above. −
The fire-formed body 1 and the printed circuit board 3 are stacked and loaded into a compression molding mold, and the positioning pins of the mold are inserted into the respective positioning holes 2 and 4 to align them (see Fig. 1(b)).
) ) QThen, close the mold, 180°C, 200kg
/c! The printed circuit board 3 was bent along the shape of the primary molded body 1 to obtain a three-dimensional printed circuit molded body 4 in which both were integrated (FIG. 1(C)). During this compression molding, the phenolic resin is completely cured. During the curing reaction, the phenolic resin also reacts with the epoxy resin that makes up the insulating substrate of the printed circuit, creating not only physical bonds but also chemical bonds.
Strong integration of the printed circuit board and the molded body is achieved.
前記成形体は、Ｕ字形の深さが１５ｍｎ＋であり、曲げ
部分の半径が５ｍｍである。圧縮成形時の樹脂の流動は
少なく、印刷回路板自体にもある程度剛性があるので、
回路の位置ずれはなく、流動した樹脂が回路板表面に回
り込むこともなかった０
発明の効果
上述のように、本発明に係る方法によれば、印刷回路の
位置すれかなく、凹凸の深い立体印刷回路成形体を良好
に得ることができる。ｔ７’ｈ、金属箔を貼ジ付けたシ
ート状材料から、印刷、エツチングの工程により得た印
刷回路板は、回路の絶縁基板への接着強度が十分である
。従って、回路の線幅が細くても、導通信頼性があり、
回路のファインパターンに対応することができる０In the molded body, the depth of the U-shape is 15 mm+, and the radius of the bent portion is 5 mm. There is little resin flow during compression molding, and the printed circuit board itself has some degree of rigidity, so
There was no misalignment of the circuit, and the flowing resin did not wrap around the surface of the circuit board.0 Effects of the Invention As mentioned above, according to the method of the present invention, there was no misalignment of the printed circuit, and the three-dimensional structure with deep unevenness was prevented. A printed circuit molded body can be obtained satisfactorily. At t7'h, the printed circuit board obtained by printing and etching processes from the sheet material to which the metal foil is attached has sufficient adhesive strength to the circuit insulating substrate. Therefore, even if the circuit line width is narrow, continuity is reliable.
0 that can correspond to fine patterns of circuits
第１図は本発明に係る製造法の工程を示す斜視図である
。
１は一次成形体、３は印刷回路板、４は立体印刷回路成
形体。FIG. 1 is a perspective view showing the steps of the manufacturing method according to the present invention. 1 is a primary molded body, 3 is a printed circuit board, and 4 is a three-dimensional printed circuit molded body.
Claims (1)
属箔と一体化した材料を印刷、エッチングの工程に供し
、得られた印刷回路板を使用して次の（イ）〜（ロ）の
工程を経る立体印刷回路成形体の製造法。 （イ）フェノール樹脂を用い、フェノール樹脂が完全に
硬化していない所定の立体形状の 一次成形体を得る工程。 （ロ）前記印刷回路板と一次成形体を重ねて圧縮成形金
型に装填し、加熱加圧により印刷 回路板が一次成形体の形状に沿うように両 者を一体化する工程。1. A sheet-like base material impregnated with a flexible thermosetting resin and integrated with metal foil is subjected to printing and etching processes, and the resulting printed circuit board is used to perform the following (a) to ( A method for producing a three-dimensional printed circuit molded body through the process of (b). (a) A process of using a phenol resin to obtain a primary molded body of a predetermined three-dimensional shape in which the phenol resin is not completely cured. (b) A step of stacking the printed circuit board and the primary molded product and loading them into a compression mold, and integrating them by heating and pressing so that the printed circuit board follows the shape of the primary molded product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9975889A JPH02278792A (en) | 1989-04-19 | 1989-04-19 | Manufacture of three-dimensional printed-circuit molded body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9975889A JPH02278792A (en) | 1989-04-19 | 1989-04-19 | Manufacture of three-dimensional printed-circuit molded body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02278792A true JPH02278792A (en) | 1990-11-15 |
Family
ID=14255883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9975889A Pending JPH02278792A (en) | 1989-04-19 | 1989-04-19 | Manufacture of three-dimensional printed-circuit molded body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02278792A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0634273U (en) * | 1992-10-09 | 1994-05-06 | 古河電気工業株式会社 | Circuit board |
| JPH11307884A (en) * | 1998-04-22 | 1999-11-05 | Shin Etsu Polymer Co Ltd | Integrated printed wiring board mold |
| JP2006295038A (en) * | 2005-04-14 | 2006-10-26 | Matsushita Electric Ind Co Ltd | Manufacturing method of solid configurations electronic circuit unit |
-
1989
- 1989-04-19 JP JP9975889A patent/JPH02278792A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0634273U (en) * | 1992-10-09 | 1994-05-06 | 古河電気工業株式会社 | Circuit board |
| JPH11307884A (en) * | 1998-04-22 | 1999-11-05 | Shin Etsu Polymer Co Ltd | Integrated printed wiring board mold |
| JP2006295038A (en) * | 2005-04-14 | 2006-10-26 | Matsushita Electric Ind Co Ltd | Manufacturing method of solid configurations electronic circuit unit |
| JP4591168B2 (en) * | 2005-04-14 | 2010-12-01 | パナソニック株式会社 | Three-dimensional electronic circuit unit and manufacturing method thereof |
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