JPH0787263B2 - Manufacturing method of reinforced flexible wiring board - Google Patents
Manufacturing method of reinforced flexible wiring boardInfo
- Publication number
- JPH0787263B2 JPH0787263B2 JP62157269A JP15726987A JPH0787263B2 JP H0787263 B2 JPH0787263 B2 JP H0787263B2 JP 62157269 A JP62157269 A JP 62157269A JP 15726987 A JP15726987 A JP 15726987A JP H0787263 B2 JPH0787263 B2 JP H0787263B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible wiring
- conductor circuit
- manufacturing
- reinforcing portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明はフレキシブル配線板に補強部を一体に形成した
補強型フレキシブル配線板の製造方法に関するものであ
る。TECHNICAL FIELD The present invention relates to a method for manufacturing a reinforced flexible wiring board in which a reinforcing portion is integrally formed on a flexible wiring board.
（従来技術及び解決しようとする問題点） 近年電子工業の発展に伴い、産業用、民生用機器の実装
方式が簡略化され、小型化、高信頼性、高性能化が要求
される印刷配線板が望まれている。特に軽量で立体的に
実装できるプラスチックスフイルムをベース基板とした
フレキシブル配線板が注目されている。(Prior art and problems to be solved) With the development of the electronic industry in recent years, the mounting method of industrial and consumer equipment has been simplified, and printed wiring boards required to be compact, highly reliable, and have high performance. Is desired. In particular, a flexible wiring board using a plastic film as a base substrate, which is lightweight and can be mounted three-dimensionally, has been receiving attention.
しかし、フレキシブル配線板は50〜200μｍ厚さの配線
板であるため、部品を自動実装するには、フレキシブル
性がありすぎて実装がやりにくいこと、又機器への取り
付けがやりにくい等から0.5〜2.0mmの補強板が部分的に
貼り付けられる。However, since the flexible wiring board is a wiring board with a thickness of 50 to 200 μm, it is too flexible to mount components automatically, and mounting is difficult. A 2.0 mm reinforcing plate is partially attached.
第３図は従来の補強化付フレキシブル配線板の一例の断
面図で、ベース基板（２）の片面に導体回路（３）を形
成し、その上にカバーレイ材料で絶縁層（４）を施した
フレキシブル配線板（１）に、あらかじめ孔開けした補
強板（６′）を接着剤層（７）を介して貼着し、上記接
着剤層（７）を硬化させて形成していた。FIG. 3 is a cross-sectional view of an example of a conventional reinforcing flexible wiring board, in which a conductor circuit (3) is formed on one surface of a base substrate (2) and an insulating layer (4) is formed on the conductor circuit (3) with a coverlay material. The flexible wiring board (1) thus prepared was formed by adhering a reinforcing plate (6 '), which was preliminarily perforated, via an adhesive layer (7), and curing the adhesive layer (7).
フレキシブルなベース基板（２）としては耐熱性のある
ポリイミド系フイルムをベースとしたものが多く用いら
れ、補強板（６′）は紙フェノール板やガラス・エポキ
シ積層板等半田付け時に変形したり、収縮しない材料が
用いられ、接着剤（７）としてはエポキシ系、ウレタン
系、アクリル系、フェノール系、トリアジン系の樹脂等
から成る接着剤が用いられる。As the flexible base substrate (2), a heat-resistant polyimide-based film is often used, and the reinforcing plate (6 ') is deformed during soldering such as a paper phenol plate or a glass / epoxy laminated plate, A material that does not shrink is used, and as the adhesive (7), an adhesive made of epoxy-based, urethane-based, acrylic-based, phenol-based, triazine-based resin, or the like is used.
しかし、前記接着剤をフレキシブル配線板（１）あるい
は補強板（６′）に塗布したものを貼合せ、高温、高圧
でプレス接着して一体に形成していた。それら補強板
（６′）はあらかじめ打抜き成形したりNC加工成形した
ものを、一つの製品に接着剤で１個１個接着しなければ
ならず、多い場合は４〜５個も貼合せねばならなかっ
た。このため多くの手間と費用がかかるばかりでなく、
接着剤中に気泡が入ったり、位置ずれを起こしたり、性
能上問題があった。又所定の位置に貼合せるためには、
フレキシブル配線板（１）と補強板（６′）に位置合せ
穴をあけ、ピン治具を用いて貼合せたり、又仮接着した
ものをずれないようにセットして接着剤を硬化させる等
多大の手間を要した。However, the flexible wiring board (1) or the reinforcing board (6 ') coated with the adhesive is laminated and press-bonded at a high temperature and a high pressure to integrally form the adhesive. Those reinforcing plates (6 ') must be punched or NC-processed in advance and bonded to each product one by one with an adhesive, and if there are many, 4 to 5 must be laminated. There wasn't. Not only is this a lot of work and expense,
There were problems in performance, such as air bubbles entering the adhesive and misalignment. In addition, in order to attach it to a predetermined position,
Aligning holes are made in the flexible wiring board (1) and the reinforcing plate (6 '), they are attached using a pin jig, or the temporarily adhered ones are set so that they do not shift and the adhesive is hardened. Took time and effort.
（問題点を解決するための手段） 本発明は上述の問題点を解消した補強型フレキシブル配
線板の製造方法を提供するもので、その特徴は、フレキ
シブルベース基板上に所要の導体回路を形成したフレキ
シブル配線板の上記導体回路を形成した以外のベース基
板に複数の微小な貫通穴を設け、これを射出成形用金型
にセットしてエンジニアプラスチックスを射出成形して
補強部を形成すると共に、その一部を前記貫通穴に圧入
し反対側面においてリベット状に形成することにある。(Means for Solving Problems) The present invention provides a method for manufacturing a reinforced flexible wiring board which solves the above-mentioned problems, and is characterized in that a required conductor circuit is formed on a flexible base substrate. A plurality of minute through holes are provided on the base substrate other than the above-mentioned conductor circuit of the flexible wiring board, and this is set in the injection molding die and the engineering plastics are injection molded to form the reinforcing portion, A part thereof is press-fitted into the through hole to form a rivet shape on the opposite side surface.
第１図は本発明の製造方法により得られた補強型フレキ
シブル配線板の一例の断面図である。図面において、
（１）はフレキシブル配線板で、フレキシブルベース基
板（２）の片面に導体回路（３）を形成し、その上に端
子部、ランド部を除いてカバーレイ材料で絶縁層（４）
が形成されている。このようなフレキシブル配線板
（１）の上記導体回路（３）を形成した以外のベース基
板（２）には複数の微小な貫通穴（５）が設けられてい
る。FIG. 1 is a sectional view of an example of a reinforced flexible wiring board obtained by the manufacturing method of the present invention. In the drawing,
(1) is a flexible wiring board on which a conductor circuit (3) is formed on one surface of a flexible base substrate (2), and an insulating layer (4) is formed on the conductor circuit (3) with a coverlay material except for terminals and lands.
Are formed. A plurality of minute through holes (5) are provided in the base substrate (2) other than the conductor circuit (3) of the flexible wiring board (1).
上記のようなフレキシブル配線板（１）は射出成形用金
型にセットされ、ベース基板（２）の補強を必要とする
位置に、高温に溶融したエンジニアプラスチックスを射
出成形して補強部（６）を形成すると共に、その一部を
前記ベース基板（２）に設けた貫通穴（５）に圧入し
て、その反対側の面においてリベット状（6a）に成形す
る。The flexible wiring board (1) as described above is set in an injection molding die, and the engineered plastics melted at a high temperature is injection-molded at a position requiring reinforcement of the base substrate (2) to reinforce the reinforcing portion (6). ) Is formed and a part thereof is press-fitted into the through hole (5) provided in the base substrate (2) to form a rivet shape (6a) on the opposite surface.
第２図は第１図の補強型フレキシブル配線板の裏面図
で、任意の厚さ及び形状のエンジニアプラスチックスに
よる補強部（６）が容易に形成され、しかも、この補強
部（６）はベース基板（２）に設けた貫通穴（５）を通
じて反対側面に形成されたリベット状（6a）により強固
に一体化されている。FIG. 2 is a rear view of the reinforced flexible wiring board of FIG. 1, in which the reinforcing portion (6) of engineered plastics having an arbitrary thickness and shape can be easily formed, and the reinforcing portion (6) is a base. It is firmly integrated by a rivet shape (6a) formed on the opposite side through a through hole (5) provided in the substrate (2).
従来は平面的であった補強部が、配線板の取付け方法や
取付け場所に応じて、又部品の形状や機能に応じて任意
の厚さや形状のものを容易に形成でき、機能アップとコ
ストダウンを図ることが可能となる。Conventionally, the reinforced part, which was flat in the past, can be easily formed to have any thickness and shape according to the wiring board mounting method and mounting location, and the shape and function of the parts. Can be achieved.
このような補強型フレキシブル配線板の形成は、片面配
線板のみならず、両面配線板においても可能であり、又
補強部の形成も配線板の片面のみならず、両面に同時に
形成することも可能である。補強部の数は１ヶ所から10
ヶ所位まで可能であり、実装される部品の形状に合せて
任意に選定することができる。Such a reinforced flexible wiring board can be formed not only on a single-sided wiring board but also on a double-sided wiring board, and the reinforcing portion can be formed not only on one side of the wiring board but also on both sides simultaneously. Is. The number of reinforcing parts is from 1 to 10
It is possible to have up to several positions, and it can be arbitrarily selected according to the shape of the mounted components.
フレキシブル配線板と補強部を一体化する手段としては
種々の方法が考えられるが、本発明の方法では接着剤を
用いず、ベース基板に貫通穴を設け、この貫通穴にエン
ジニアプラスチックスを圧入し、その反対側面において
リベット状に形成した機械的嵌合によって一体化し、部
品実装時の機械的及び熱的特性を充分満足するようにし
た。上記貫通穴は0.3〜5.0mmφ程度の微小穴であり、補
強部分に少なく共４ヶ所以上を設け、多くは50〜60ヶ所
以上設けることにより強固に一体化される。Various methods are conceivable as a means for integrating the flexible wiring board and the reinforcing portion, but in the method of the present invention, a through hole is provided in the base substrate without using an adhesive, and engineering plastics is press-fit into the through hole. , The opposite side surface is integrated by a rivet-shaped mechanical fitting so that the mechanical and thermal characteristics at the time of mounting the components are sufficiently satisfied. The through holes are minute holes of about 0.3 to 5.0 mmφ, and at least 4 or more of them are provided in the reinforced portion, and most of them are 50 to 60 or more.
又射出するエンジニアプラスチックスは半田耐熱性のあ
るものが望ましく、少くともJISK7207によって評価され
る熱変形温度が180℃以上であることが必要である。こ
こでいう半田耐熱性とは、IC、抵抗、コンデンサー等の
電子部品を190〜250℃で、手半田付け、半田ディップ付
け、半田リフロー付け等で半田付け出来る耐熱度をい
い、補強部が大幅に収縮したり、そったりしないものを
いう。It is desirable that the engineered plastics to be injected have solder heat resistance, and that the heat distortion temperature evaluated by JIS K7207 is at least 180 ° C or higher. Soldering heat resistance here means the heat resistance of electronic parts such as ICs, resistors and capacitors at 190 to 250 ° C, and can be soldered by hand soldering, solder dipping, solder reflow, etc. It does not shrink or warp.
このようにフレキシブル配線板と補強部を射出成形によ
り一体化して形成することは、単に個別貼合せていたも
のを自動貼合するメリットのみならず、エレクトロニク
ス機器への組立てを容易にし、場合によっては機器のケ
ースと一体化することも可能となり、大幅な生産性及び
機能性の向上を図るもので、今後益々必要とされる軽量
化、小型化、機能付加へ向けて欠くことの出来ない配線
材料となる。Forming the flexible wiring board and the reinforcing portion integrally by injection molding in this way not only has the advantage of automatically laminating the individual laminating, but also facilitates the assembly into the electronic device, and in some cases Since it can be integrated with the equipment case, it will greatly improve productivity and functionality, and is an indispensable wiring material for weight reduction, miniaturization, and addition of functions, which will be required more and more in the future. Becomes
（作用） フレキシブル配線板のベース基板として、半田耐熱性の
あるポリイミドフイルム、ポリパラバン酸フイルム、ポ
リフェニレンサルファイドフイルム、ポリエーテルフイ
ルム等を用い、これにエポキシ系、フェノール系、アク
リル系、シリコン系、イミド系等の接着剤を塗布し、電
解銅箔、圧延銅箔を貼合せ、銅箔にはエッチングレジス
トを印刷あるいは感光性フイルムをラミネートして塩化
鉄、又は塩化銅等でエッチングとして導体回路を形成し
た。(Function) As the base substrate of the flexible wiring board, a solder heat resistant polyimide film, polyparabanic acid film, polyphenylene sulfide film, polyether film, etc. are used, and epoxy-based, phenol-based, acrylic-based, silicon-based, imide-based Adhesive such as etc. is applied, electrolytic copper foil and rolled copper foil are laminated, etching resist is printed on the copper foil or a photosensitive film is laminated, and conductor circuit is formed by etching with iron chloride or copper chloride. .
回路形成後、部品実装する端子部やランド部は露出する
ようソルダーレジスト又は耐熱性フイルムによりカバー
レイを行なって絶縁層を形成し、フレキシブル配線板を
得た。After the circuit was formed, a cover layer was formed with a solder resist or a heat resistant film so that the terminals and lands on which the components were mounted were exposed to form an insulating layer, and a flexible wiring board was obtained.
得られた配線板には導体回路部を除いて0.3〜5.0mmφの
穴を５〜20mmピッチで穴開けし、樹脂の圧入による嵌合
を容易ならしめた。穴開けされた配線板は射出成形用金
型内にセットされるが、この際、特に穴部と接する金型
の部分には、くぼみを設け、圧入された樹脂がその反対
側面においてビレット状になるよう配慮した。なお、穴
の大きさ、数は補強部の大きさや実装時の応力のかかり
方により選定する必要があり、又配線板と金型のクリア
ランスは非常に重要であり、圧入樹脂が導体回路面を覆
うことのないようにする必要がある。Except for the conductor circuit part, holes of 0.3 to 5.0 mmφ were punched at a pitch of 5 to 20 mm on the obtained wiring board to facilitate fitting by press fitting of resin. The perforated wiring board is set in the injection molding die.At this time, especially in the portion of the die that is in contact with the hole, a depression is provided and the press-fitted resin is billet-shaped on the opposite side. Considered to be. It is necessary to select the size and number of holes depending on the size of the reinforcing part and the way stress is applied during mounting.The clearance between the wiring board and the mold is very important, and the press-fitting resin will prevent the conductor circuit surface from changing. It needs to be covered.
射出するエンジニアプラスチックスとしてはポリフェニ
レンサルファイド、ポリエーテルイミド、ポリエーテル
サルファイド等を用い、これらの樹脂を250〜400℃の高
温下で、あらかじめ前記フレキシブル配線板をセットし
た金型内へ注入する。この際、フレキシブル配線板は射
出圧力によって変形しないよう金型内で強くクランプし
ておくことが必要である。又射出するエンジニアプラス
チックスは少くともベース基板のフイルムの耐熱温度よ
りもやや低目でないと、導体回路の変形をきたすので好
ましくない。さらにエンジニアプラスチックスは任意の
形状に成形することが出来るが、その形状は配線板に応
力が残らないよう充分検討する必要がある。Polyphenylene sulfide, polyether imide, polyether sulfide, etc. are used as the engineered plastics to be injected, and these resins are injected at a high temperature of 250 to 400 ° C. into a mold in which the flexible wiring board is set in advance. At this time, the flexible wiring board needs to be strongly clamped in the mold so as not to be deformed by the injection pressure. Further, the engineered plastics to be injected must be at least slightly lower than the heat resistant temperature of the film of the base substrate, or the conductor circuit will be deformed. Furthermore, engineered plastics can be molded into any shape, but the shape must be carefully examined so that stress does not remain on the wiring board.
（実施例） 25μｍポリイミドベース基板にエポキシ系接着剤を20μ
ｍ塗布し、35μｍの厚さに電解銅箔をラミネートした基
板を作成した。その後銅箔を塩化第２銅を用いてエッチ
ングし、端子部、ランド部を除いて25μｍのポリイミド
フイルムのカバーレイを行なって絶縁層を形成し、フレ
キシブル配線板を得た。(Example) 20 μm of epoxy adhesive on 25 μm polyimide base substrate
m, and a substrate was prepared by laminating an electrolytic copper foil to a thickness of 35 μm. After that, the copper foil was etched with cupric chloride, and a 25 μm polyimide film was laid except the terminals and lands to form an insulating layer, and a flexible wiring board was obtained.
得られたフレキシブル配線板には部品実装する部分に導
体回路を切断しないように0.5mmφの貫通穴を10mmピッ
チで穴開けした。On the obtained flexible wiring board, 0.5 mmφ through holes were punched at a pitch of 10 mm so as not to cut the conductor circuit in the parts mounting portion.
穴開けした配線板は射出成形用金型内にセットし、100
℃まで予熱した。この際金型面には上記0.5mmφの貫通
穴と接する面に0.7mmφ径のくぼみを設け、リベットの
頭になるように形成した。Set the perforated wiring board in the injection mold and
Preheated to ℃. At this time, a recess having a diameter of 0.7 mm was provided on the surface of the mold which was in contact with the through hole having the diameter of 0.5 mm, and was formed so as to be the head of the rivet.
射出成形は350℃に溶融したポリエーテルイミド樹脂を1
20kg/cm2の圧力で射出し、厚さ0.5mmから7.0mmまでの凹
凸のある異形の補強部を形成した。その後、80℃まで冷
却してフレキシブル配線板上に補強部を一体に形成した
補強型フレキシブル配線板を取り出した。For injection molding, melt the polyether imide resin at 350 ℃ 1
Injection was performed at a pressure of 20 kg / cm 2 to form irregularly shaped reinforcing portions with irregularities having a thickness of 0.5 mm to 7.0 mm. Then, it was cooled to 80 ° C. and a reinforced flexible wiring board having a reinforcing portion integrally formed on the flexible wiring board was taken out.
このように成形された補強型フレキシブル配線板は、裏
面から0.75mmφのリベットが打込まれたようになってお
り、補強部と配線板はしわ、たわみ、そり等の障害がな
く一体化されていた。The reinforced flexible wiring board molded in this way is designed to be driven with a 0.75 mmφ rivet from the back side, and the reinforcement section and the wiring board are integrated without any obstacles such as wrinkles, flexure, and warpage. It was
この一体化された補強型フレキシブル配線板をピーク温
度220℃のリフロー炉を通し、部品実装時の熱的影響を
調べた結果、配線板と一体化された補強部には0.1〜0.3
mmの若干のそりが見られたが、部品実装には障害もな
く、実用可能であることが確認された。This integrated reinforced flexible wiring board was passed through a reflow furnace with a peak temperature of 220 ° C and the thermal effects during component mounting were examined.
Although a slight warpage of mm was observed, it was confirmed that there was no obstacle in mounting the component and that it was practical.
これらのことは、複雑な形状の補強部も１ショットで成
形でき、かつ高速で低コストのフレキシブル配線板が得
られることを証明したものである。These facts prove that a reinforcing portion having a complicated shape can be molded in one shot, and a high-speed, low-cost flexible wiring board can be obtained.
（発明の効果） 上述したように、本発明の補強型フレキシブル配線板の
製造方法によれば、フレキシブル配線板に補強部を射出
成形により形成すると共に、その一部を貫通孔に圧入し
反対側面においてリベット状に形成し一体化しているの
で、従来の個々の貼合せによる多くの手間と費用を著し
く軽減すると共に、得られたフレキシブル配線板の性能
も著しく向上する。(Effects of the Invention) As described above, according to the method for manufacturing a reinforced flexible wiring board of the present invention, the reinforcing portion is formed on the flexible wiring board by injection molding, and a part of the reinforcing portion is press-fitted into the through hole to form the opposite side surface. Since it is formed into a rivet shape and integrated with each other, a lot of labor and cost due to the conventional individual bonding are remarkably reduced, and the performance of the obtained flexible wiring board is remarkably improved.
従って、今後益々必要とされる軽量化、小型化及び機能
付加が要求される電子機器において、極めて有効なもの
となる。Therefore, it will be extremely effective in electronic devices that are required to be lighter, smaller, and have additional functions, which will be increasingly required in the future.
第１図は本発明の製造方法により得られた補強板一体型
フレキシブル配線板の一例の断面図、第２図は第１図の
フレキシブル配線板の裏面図である。 第３図は従来の補強板一体型フレキシブル配線板の一例
の断面図である。 １…フレキシブル配線板、２…ベース基板、３…導体回
路、４…絶縁層、５…貫通穴、6a…リベット状部、６…
補強部。FIG. 1 is a sectional view of an example of a reinforcing plate-integrated flexible wiring board obtained by the manufacturing method of the present invention, and FIG. 2 is a rear view of the flexible wiring board of FIG. FIG. 3 is a sectional view of an example of a conventional flexible wiring board integrated with a reinforcing plate. DESCRIPTION OF SYMBOLS 1 ... Flexible wiring board, 2 ... Base substrate, 3 ... Conductor circuit, 4 ... Insulating layer, 5 ... Through hole, 6a ... Rivet-shaped part, 6 ...
Reinforcement part.
Claims (2)
路を形成したフレキシブル配線板の上記導体回路を形成
した以外のベース基板に複数の微小な貫通穴を設け、こ
れを射出成形用金型にセットしてエンジニアプラスチッ
クスを射出成形して補強部を形成すると共に、その一部
を前記貫通孔に圧入し反対側面においてリベット状に形
成することを特徴とする補強型フレキシブル配線板の製
造方法。1. A flexible wiring board in which a required conductor circuit is formed on a flexible base board is provided with a plurality of minute through holes in a base board other than the area where the conductor circuit is formed, and this is set in an injection molding die. Then, an engineered plastic is injection-molded to form a reinforcing portion, and a part of the reinforcing portion is press-fitted into the through hole to form a rivet shape on the opposite side surface.
180℃以上であることを特徴とする特許請求の範囲第１
項記載の補強型フレキシブル配線板の製造方法。2. The heat distortion temperature of engineering plastics is
Claim 1 characterized in that the temperature is 180 ° C or higher.
A method for manufacturing a reinforced flexible wiring board according to item.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62157269A JPH0787263B2 (en) | 1987-06-23 | 1987-06-23 | Manufacturing method of reinforced flexible wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62157269A JPH0787263B2 (en) | 1987-06-23 | 1987-06-23 | Manufacturing method of reinforced flexible wiring board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH011292A JPH011292A (en) | 1989-01-05 |
| JPS641292A JPS641292A (en) | 1989-01-05 |
| JPH0787263B2 true JPH0787263B2 (en) | 1995-09-20 |
Family
ID=15645962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62157269A Expired - Fee Related JPH0787263B2 (en) | 1987-06-23 | 1987-06-23 | Manufacturing method of reinforced flexible wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0787263B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4631640B2 (en) * | 2005-09-27 | 2011-02-16 | 住友電気工業株式会社 | Optical connecting component manufacturing method and optical connecting component |
| JP5370734B2 (en) * | 2009-01-27 | 2013-12-18 | 株式会社オートネットワーク技術研究所 | Circuit structure and electrical junction box |
| DE102014106585A1 (en) * | 2014-05-09 | 2015-11-12 | Leonhard Kurz Stiftung & Co. Kg | Multilayer body and method for its production |
| WO2015198865A1 (en) | 2014-06-23 | 2015-12-30 | 株式会社村田製作所 | Resin substrate combination structure |
| CN106061235B (en) * | 2016-07-08 | 2021-09-21 | 深圳市信维通信股份有限公司 | FPC assembling jig and assembling method thereof |
| WO2019093446A1 (en) | 2017-11-08 | 2019-05-16 | 富士フイルム株式会社 | Optical laminate film, and organic electroluminescent display device |
| WO2019093444A1 (en) | 2017-11-08 | 2019-05-16 | 富士フイルム株式会社 | Optical laminate film, and organic electroluminescent display device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55134386A (en) * | 1979-04-06 | 1980-10-20 | Citizen Watch Co Ltd | Circuit substrate for electronic watch |
-
1987
- 1987-06-23 JP JP62157269A patent/JPH0787263B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS641292A (en) | 1989-01-05 |
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