JP4591168B2 - Three-dimensional electronic circuit unit and manufacturing method thereof - Google Patents

Description

  The present invention relates to a method for manufacturing a three-dimensionally configured electronic circuit unit formed by processing an electronic component into a three-dimensional shape after mounting.

  With respect to a method of manufacturing a three-dimensional module by mounting electronic components on a three-dimensional substrate, various methods have been developed to reduce the size and thickness of a combination of a semiconductor imaging element and a lens.

  FIG. 13 is a diagram illustrating a configuration in which a camera module including an electronic component unit 112 and a lens unit 118 on which the semiconductor image sensor 110 is mounted is mounted on the wiring board 120. Such camera modules are often used in mobile phones and the like. The lens unit 118 is configured by fixing a lens 116 to a lens holding portion 114. The electronic component unit 112 is formed by the manufacturing method shown in FIG. The lens unit 118 is mounted on the electronic component unit 112 after the lens holding portion 114 is inserted into the positioning groove 102 and positioned, and then bonded or mechanically fixed.

  When a camera module including the electronic component unit 112 and the lens unit 118 is mounted on the wiring board 120, the external connection terminal 106a of the electronic component unit 112 and the connection terminal 120a of the wiring board 120 are connected to, for example, solder. Connection is made by the joining member 122. Note that as the bonding member 122, not only solder but also conductive resin or the like is used.

  FIG. 14 is a cross-sectional view of the main steps for producing the electronic component unit 112 used in the camera module. The electronic component unit 112 is configured by flip-chip mounting the semiconductor imaging device 110 at a predetermined position of a three-dimensional circuit board 108 having a three-dimensional shape.

  FIG. 14A is a cross-sectional view of the three-dimensional substrate 100 having the positioning groove 102 and the opening 104 of the lens unit 118. The three-dimensional substrate 100 is molded into a predetermined shape as shown in the drawing using a resin molding die. The material of the three-dimensional substrate 100 is not particularly limited, but is generally a thermoplastic resin, and has relatively chemical resistance so as not to be damaged when the wiring conductor 106 is formed or when an electronic component is mounted. Engineering plastic is often used.

  The opening 104 is necessary for allowing the imaging light to pass when the semiconductor imaging device 110 is flip-chip mounted. However, when mounting with face-up, the opening 104 is not particularly required.

  FIG. 14B is a cross-sectional view showing a state in which the wiring conductor 106 is formed in a predetermined region of the three-dimensional base material 100. By forming the wiring conductor 106, the three-dimensional circuit board 108 is obtained. The end on the outer peripheral side of the wiring conductor 106 constitutes an external connection terminal 106a with an external device.

  FIG. 14C is a cross-sectional view illustrating a state in which the semiconductor image sensor 110 is mounted on the three-dimensional circuit board 108. The semiconductor image sensor 110 is flip-chip mounted in alignment so that the imaging region is exposed from the opening 104. Thereby, the electronic component unit 112 is produced. In mounting the semiconductor imaging device 110 and the three-dimensional circuit board 108, the bumps on the electrode terminals formed on the outer periphery of the imaging region and the wiring conductor 106 are connected by a conductive resin or the like.

  In the camera module manufactured by such a manufacturing method, the imaging light passes through the lens 116 and the opening 104 to focus on the imaging region of the semiconductor imaging device 110, and this imaging light is converted into an electrical signal and processed. The

  In the camera module having such a three-dimensional configuration, for example, a structure in which the configuration of the lens barrel for maintaining the positional relationship between the optical component and the semiconductor imaging device with high accuracy is devised (see, for example, Patent Document 1). . The lens barrel is configured as a three-dimensional circuit board having an optical component mounting portion and a semiconductor imaging device electrode terminal and an external connection terminal. The mounting position of the semiconductor imaging device is determined by the optical component. The configuration is variable in the optical axis direction.

Also shown is a structure that prevents dust generation from the adhesive that fixes the optical filter and reduces image quality degradation of the imaging device. In this example, a semiconductor imaging device that converts incident light into an electrical signal, an optical filter that is disposed opposite to the incident surface of the semiconductor imaging device and transmits light of a predetermined wavelength, and an adhesive containing a filler are used. And a holding member that holds the optical filter by adhesion, and the filler has a diameter equal to or smaller than the pixel size of the semiconductor imaging device (see, for example, Patent Document 2).
JP 2001-333332 A JP 2004-327914 A

  In the first example, the lens barrel is used as a three-dimensional circuit board, and the semiconductor element can be varied in the optical axis direction of the optical component. The second example is a structure for eliminating the image quality deterioration due to the filler in the adhesive when the optical filter is bonded to the three-dimensional circuit board.

  In such a camera module, it is required to three-dimensionally mount optical components including a semiconductor image sensor and a lens. For this reason, also in the above example, the semiconductor imaging element is mounted using a three-dimensional circuit board. In manufacturing a three-dimensional circuit board, a wiring conductor is usually formed on a three-dimensional surface of a three-dimensional base material. Since the three-dimensional shaped substrate is produced by resin molding, the mass productivity is good. However, the method of forming the wiring conductor on the three-dimensional surface of the three-dimensional substrate is, for example, a method of sticking a conductor foil having a predetermined pattern shape, a vapor deposition method or a plating method of a metal thin film on the surface of the three-dimensional substrate Is formed by a method of forming a predetermined pattern by etching or laser processing. Alternatively, it may be formed by a transfer printing method or a drawing method using a conductive resin.

  However, the method of manufacturing these wiring conductors is complicated and cannot be manufactured at low cost. In the above conventional configuration, the electronic component is mounted after forming the three-dimensional circuit board. For this reason, it is required to mount an electronic component such as an image sensor in a three-dimensionally shaped recess, and the mounting process is complicated, making it difficult to realize an inexpensive camera module.

  The present invention has been made to solve the above-described problems, and can manufacture electronic components easily, and a three-dimensional circuit board can be manufactured by a simple process to realize a low-cost three-dimensional electronic circuit unit. It aims to provide a method.

  In order to solve the above-described problems, a method for manufacturing a three-dimensionally configured electronic circuit unit according to the present invention is such that a component connection terminal as one end is provided in a mounting region portion of a resin substrate, and the other end is an external connection terminal. Forming a flat circuit board by providing a plurality of wiring conductors constituting the center of the mounting region, forming a flat circuit board, connecting the electronic component to the component connection terminal of the mounting region, and mounting the electronic component After mounting, the area where the electronic components are mounted is fixed and held, and the resin substrate and wiring conductor in the preset area of the circuit board are bent in the direction in which the electronic components are mounted, and the wiring conductor component connection terminal and external connection And a step of processing a three-dimensional shape having a step and a parallel arrangement with the terminal.

  In the above method, the wiring conductors may be formed at two symmetrical positions around the mounting region. Alternatively, the resin base material may have a cross shape with the mounting region portion as the center, and the wiring conductor may be formed in the cross region of the resin base material.

  By adopting such a method, after mounting electronic components on a flat circuit board, a resin base material and a wiring conductor in a predetermined region of the circuit board are bent and deformed, so that a three-dimensional structure having external connection terminals is obtained. The configuration electronic circuit unit can be manufactured by a simple manufacturing process.

  Further, in the step of processing into a three-dimensional shape of the above method, in a state where the region where the electronic component of the circuit board is mounted is fixed and heated, the resin base material in the predetermined region of the circuit board is heated and softened, The resin base material and the wiring conductor may be deformed and processed into a three-dimensional shape. Further, a thermoplastic resin or a semi-cured thermosetting resin may be used as the resin base material. Furthermore, the wiring conductor may be formed of a conductive foil or a conductive resin.

  By adopting such a method, since the resin substrate and the wiring conductor at a predetermined location are deformed after fixing the region where the electronic component is mounted, no stress or the like acts on the mounting portion of the electronic component. , Mounting defects do not occur. As a processing method in this case, the step of softening the resin base material and the step of processing the resin base material and the wiring conductor into a three-dimensional shape may be continuously performed using a mold. With this method, the softening step and the three-dimensional processing step can be performed consistently, so that the manufacturing process can be further simplified. Furthermore, the accuracy of the region to be deformed can be improved.

  Further, if a thermoplastic resin or a semi-cured thermosetting resin is used as the resin base material, the resin base material can be easily deformed by softening. Furthermore, when a conductive foil or conductive resin is used as the wiring conductor, when the resin base material is softened and deformed, the wiring conductor is also easily deformed and no disconnection or the like occurs, so that it can be manufactured with high yield. .

  Moreover, in the said method, you may provide a reinforcement board on the surface on the opposite side to the surface in which a wiring conductor is formed in a mounting area | region part. Alternatively, a reinforcing plate may be embedded on the surface where the wiring conductor is formed in the mounting region, and the wiring conductor may be provided on the surface of the reinforcing plate and the resin base material.

  By providing such a reinforcing plate, it is possible to suppress stress from being applied to the mounting portion of the electronic component when the resin base material and the wiring conductor at a predetermined position of the circuit board are bent. For this reason, even if bending is performed, the occurrence of mounting defects can be suppressed.

  In the above method, the electrode terminal of the electronic component and the component connection terminal of the circuit board may be connected by any of solder connection, conductive resin connection, direct contact connection, or wire lead connection.

  By this method, the connection between the component connection terminal and the electrode terminal can be facilitated. In the case of connection using a conductive resin, the connection can be made at a relatively low temperature, so that deformation of the resin base material can be prevented during the connection operation.

  In the above method, the electronic component and the circuit board may be bonded and fixed with an insulating adhesive. By fixing with an insulating adhesive, it is possible to further suppress the occurrence of mounting defects even when processing such as bending is performed. Furthermore, if the fillet is formed with an insulating adhesive, stronger adhesion can be achieved and further mounting defects can be suppressed.

  In the above method, one or more selected from a semiconductor element and a passive component may be mounted as the electronic component. Moreover, you may mount a semiconductor image pick-up element as an electronic component. In this case, an opening may be provided in the circuit board corresponding to the imaging area of the semiconductor imaging element, the imaging area of the semiconductor imaging element may be on the opening side, and the semiconductor imaging element may be mounted at a position corresponding to the opening. . Further, a lens may be further mounted on the surface of the circuit board opposite to the surface on which the semiconductor image sensor is mounted.

  By adopting such a method, a three-dimensionally configured electronic circuit unit on which a plurality of electronic components are mounted can be manufactured, and a compact and high-density circuit device can be easily realized. In particular, when a semiconductor imaging device is used as an electronic component, an inexpensive camera module can be realized.

  Moreover, the three-dimensionally configured electronic circuit unit of the present invention is provided with a resin base material, and a component connection terminal which is one end in the mounting region portion of the resin base, and the other end constitutes an external connection terminal. And a circuit board including a plurality of wiring conductors provided at symmetrical positions around the mounting area, and an electronic component mounted in connection with the component connection terminal of the mounting area, the resin base material and the wiring conductor Is bent in the direction in which the electronic component is mounted, and the component connection terminal of the wiring conductor and the external connection terminal have a step and parallel arrangement, and the thickness of the resin substrate is from the component connection terminal to the external connection terminal And having the same thickness.

  In the above configuration, the wiring conductors may be formed at two symmetrical positions around the mounting region. Alternatively, the resin base material may have a cross shape with the mounting region portion as the center, and the wiring conductor may be formed in the cross region of the resin base material.

  With this configuration, a three-dimensionally configured electronic circuit unit having external connection terminals on both sides or a three-dimensionally configured electronic circuit unit having external connection terminals on four sides can be easily obtained.

  According to the method for manufacturing a three-dimensionally configured electronic circuit unit of the present invention, an electronic component can be mounted using a flat circuit board, so that the mounting process is simplified. Further, since the three-dimensional circuit board is produced by deforming the resin base material and the wiring conductor into a predetermined shape after mounting the electronic component, there is a great effect that the three-dimensionally configured electronic circuit unit can be manufactured at low cost.

  Hereinafter, the manufacturing method of the three-dimensionally configured electronic circuit unit and the three-dimensionally configured electronic circuit unit of the present invention will be described in detail with reference to the drawings. In addition, the same code | symbol is attached | subjected about the same element and description may be abbreviate | omitted.

(First embodiment)
FIG. 1 is a plan view of main processes for explaining a manufacturing process of a three-dimensionally configured electronic circuit unit according to the first embodiment of the present invention. 2 is a cross-sectional view of a main process corresponding to FIG. 1, and is a cross-sectional view at a position corresponding to a cross-sectional portion along the line XX shown in FIG. Hereinafter, the manufacturing process of the three-dimensionally configured electronic circuit unit of the present embodiment will be described with reference to FIGS. 1 and 2. In the present embodiment, a semiconductor image sensor is described as an example of the electronic component.

  First, a flat circuit board 10 as shown in FIGS. 1A and 2A is prepared. The circuit board 10 is provided with a wiring conductor 16 on the surface of a resin base material 12 and an opening 14 in a substantially central portion. The opening 14 has a slightly larger area than the imaging region 18 a of the semiconductor imaging element 18. One end of the wiring conductor 16 disposed on the opening 14 side constitutes a component connection terminal 16a, and the other end constitutes an external connection terminal 16b. A region where the component connection terminals 16a are provided around the opening 14 and its periphery is a mounting region. The wiring conductors 16 are provided at two symmetrical positions with the mounting region portion as the center. Furthermore, the thickness of the resin base material 12 from the component connection terminal 16a to the external connection terminal 16b is formed substantially the same.

  As the resin base material 12, it is preferable to use a thermoplastic or semi-cured thermosetting resin. For example, an ABS resin, a nylon resin, a polyimide resin, or a semi-cured epoxy resin can be used.

  The wiring conductor 16 can be easily formed by attaching a conductive foil such as copper (Cu) to the resin base material 12 and then etching it into a predetermined pattern shape. In addition, it is preferable to form a gold (Au) film, a silver (Ag) film, or the like on the surface of the wiring conductor 16, in particular, the component connection terminal 16a and the external connection terminal 16b. Since the wiring conductor 16 is deformed together with the resin base material 12, a material with good spreadability is desirable. Therefore, it is preferable to use a conductive foil, but a conductive resin may be printed and used.

  The opening 14 can be formed by performing press processing or laser processing on the resin base material 12.

  Next, as shown in FIGS. 1B and 2B, the semiconductor imaging element 18 is mounted on the circuit board 10. The bumps 22 provided on the semiconductor imaging device 18 and the component connection terminals 16a of the wiring conductor 16 of the circuit board 10 are connected using, for example, a conductive adhesive (not shown). Further, an underfill resin 20 that is an insulating adhesive is filled between the circuit board 10 excluding the opening 14 and the semiconductor imaging element 18, thereby further strengthening the mechanical connection between the semiconductor imaging element 18 and the circuit board 10. To. The underfill resin 20 may also be applied to the end surface portion of the semiconductor image sensor 18 to form a fillet. If such a fillet is formed, the adhesive strength can be further increased. If the semiconductor image pickup device 18 can be firmly connected to the circuit board 10 by connecting the bumps 22 of the semiconductor image pickup device 18 and the component connection terminals 16a, it is not necessary to provide the underfill resin 20.

  Further, when a curing shrinkable resin is used as the underfill resin 20, the bump 22 and the component connection terminal 16 a of the wiring conductor 16 may be connected by direct contact.

  Next, as shown in FIGS. 1C and 2C, the resin base material 12 on both sides of the circuit board 10 and the wiring conductor 16 thereon are fixed while fixing the region where the semiconductor imaging element 18 is mounted. Are bent with the bent portion 24 as a reference. At this time, if the resin substrate 12 is heated and softened and then bent, it can be easily bent to a predetermined angle.

  For this bending, a jig as shown in FIG. 3 can be used to bend easily and accurately. FIG. 3 is a cross-sectional view illustrating a jig configuration for bending a predetermined region of the circuit board 10 to a set angle in a state where the semiconductor imaging element 18 is mounted. In this bending, the first upper mold 52 and the first lower mold 54 are used. The first upper mold 52 is provided with a space in the semiconductor imaging element 18 and its mounting region, and has a taper of an angle corresponding to the bending angle on both sides. Further, the first lower mold 54 corresponds to the first upper mold 52 and holds down the unbent region of the circuit board 10. After arranging the first upper mold 52 and the first lower mold 54 as shown in the figure, the region of the bent portion 24 is locally heated to soften the resin base material 12, and then the arrow If it is bent in the direction indicated by A until it comes into contact with the first upper mold 52 by a jig (not shown), it can be bent at a set angle. At this time, since a load or the like is not applied to the region where the semiconductor imaging element 18 is mounted, it is possible to prevent the occurrence of defects or the like in the mounting portion.

  Next, as shown in FIG. 1D and FIG. 2D, the external connection terminal 16 b is connected to the semiconductor imaging element 18 with the bent resin base material 12 and the wiring conductor 16 as a reference to another bent portion 26. And bend so that it is almost parallel to Thus, one end of the wiring conductor 16 constitutes a component connection terminal 16a on which the semiconductor imaging element 18 is mounted, and the other end of the wiring conductor 16 constitutes an external connection terminal 16b connected to an external device. Thus, the three-dimensionally configured electronic circuit unit 28 is obtained in which the component connection terminals 16a and the external connection terminals 16b are three-dimensional and arranged with steps.

  For this bending, if a jig as shown in FIG. 4 is used, it can be easily and accurately bent. FIG. 4 is a cross-sectional view showing a jig configuration for further bending the circuit board 10 bent in the state shown in FIG.

  In the bending in this case, the second upper mold 56 and the second lower mold 58 are used. The second upper mold 56 is configured such that a space is provided in the semiconductor imaging element 18 and its mounting area, and a load is not applied to the semiconductor imaging element 18, and further to a position corresponding to another bending portion 26. As shown in (c), the taper has an angle corresponding to the bending angle on both sides. The second lower mold 58 corresponds to the second upper mold 56 and has a shape that holds down the unbent region of the circuit board 10. After the second upper mold 56 and the second lower mold 58 are arranged as shown in the figure, the region of another bent portion 26 is locally heated to soften the resin base material 12. When bent in the direction indicated by arrow B until the second lower mold 58 comes into contact with a jig (not shown), it can be bent substantially parallel to the semiconductor imaging device 18. At this time, since a load or the like is not applied to the region where the semiconductor imaging element 18 is mounted, it is possible to prevent the occurrence of defects or the like in the mounting portion.

  The three-dimensionally configured electronic circuit unit 28 is produced by this two-time bending. FIG. 5 is a cross-sectional view showing a state in which the lens unit 40 is further attached to the three-dimensionally configured electronic circuit unit 28 thus manufactured and then connected to the wiring board 30 of the external device. The lens unit 40 is bonded and fixed to the circuit board 10. The lens unit 40 includes a lens holding part 36 and a lens 38. The lens 38 is fixed to the lens holding portion 36 at a position that focuses on the imaging region 18 a of the semiconductor imaging element 18.

  The three-dimensionally configured electronic circuit unit 28 to which the lens unit 40 is attached is mounted on the wiring board 30. In this case, the external connection terminal 16b of the three-dimensionally configured electronic circuit unit 28 and the wiring conductor 32 of the wiring board 30 are connected by, for example, a conductive adhesive 34.

  Since the three-dimensionally configured electronic circuit unit 28 of the present embodiment can be three-dimensionally mounted on the wiring board 30, a DSP 42, which is a semiconductor element for processing an electrical signal from the semiconductor image sensor 18, as shown in FIG. It can be easily mounted in this space portion. FIG. 5 is a cross-sectional view showing a state in which a three-dimensionally configured electronic circuit unit manufactured by the manufacturing method according to the present embodiment is mounted on a wiring board in combination with a lens unit. The DSP 42 is connected to the wiring conductor 32 of the wiring substrate 30 by bumps 44.

  In the present embodiment, the semiconductor imaging element 18 is mounted on the flat circuit board 10. For this reason, unlike the case of the conventional three-dimensional circuit board, the semiconductor imaging element 18 can be mounted in a state where a plurality of circuit boards 10 as shown in FIG. 6 are formed. FIG. 6 is a plan view showing a state in which the semiconductor imaging element 18 is mounted in a state where a plurality of circuit boards 10 are formed. For this reason, the mounting process can be greatly simplified.

  In the present embodiment, since the predetermined three-dimensionally configured electronic circuit unit 28 is formed by bending the circuit board 10, the wiring conductor 16 can be easily formed.

  In addition, the manufacturing method of this invention is not limited to the jig | tool structure shown in FIG. 3 and FIG. The step of bending with respect to the first bent portion 24 and the step of bending with reference to another bent portion 26 may be performed continuously. It is good also as a structure for performing such a jig | tool continuously.

(Second Embodiment)
FIG. 7: is sectional drawing of the main processes for demonstrating the manufacturing method of the solid-structure electronic circuit unit concerning the 2nd Embodiment of this invention. The three-dimensionally configured electronic circuit unit of the present embodiment is characterized in that a reinforcing plate 46 having an opening 48 is provided in a region of the circuit board 10 where the semiconductor imaging element 18 is mounted as shown in the figure.

  As the reinforcing plate 46, for example, a hard resin having heat resistance, or a metal or ceramic plate is used. The reinforcing plate 46 is bonded onto the resin base material 12. Since the reinforcing plate 46 is provided with an opening 48 at a position corresponding to the opening 14 of the resin base material 12, the opening 14 of the resin base material 12 and the opening 48 of the reinforcing plate 46 are aligned with each other. Glued.

  By providing the reinforcing plate 46 in this manner, it is possible to further suppress deformation of the region where the semiconductor imaging element 18 is mounted in the bending step shown in FIGS. 7B and 7C. In the jig configuration shown in FIG. 7B, the configuration of the third lower mold 60 is slightly different because the reinforcing plate 46 is bonded and fixed to the circuit board 10, but the other configuration is the first configuration. The configuration is the same as that described in the embodiment. Also, in the jig configuration shown in FIG. 7C, the configuration of the fourth lower mold 62 is slightly different because the reinforcing plate 46 is bonded and fixed to the circuit board 10, but the other configuration is the first configuration. The configuration is the same as that described in the embodiment.

  In FIG.7 (b), if it bends in the direction shown by the arrow C, it can be set as the set angle. Further, in FIG. 7C, when bent in the direction indicated by the arrow D, the external connection terminal 16b can be made substantially parallel to the component connection terminal 16a.

  FIG. 8A is a cross-sectional view of the three-dimensionally configured electronic circuit unit manufactured by the above manufacturing method. This three-dimensionally configured electronic circuit unit is different only in that a reinforcing plate 46 is provided as shown. FIG. 8B is a cross-sectional view showing a state in which the lens unit 40 is further attached to the three-dimensionally configured electronic circuit unit. The lens unit 40 is fixed on the reinforcing plate 46 by adhesion or a mechanical method.

  In the three-dimensionally configured electronic circuit unit according to the present embodiment, the reinforcing plate 46 is provided on the circuit board 10 in the region where the semiconductor imaging device 18 is mounted. It is possible to achieve a manufacturing method that can be suppressed and that is highly reliable and has high mass productivity.

  In the present embodiment, the reinforcing plate 46 is provided on the surface opposite to the surface on which the semiconductor imaging element 18 is mounted, but the present invention is not limited to this. For example, as shown in FIG. 9, a reinforcing plate 47 may be provided on the side where the semiconductor imaging element 18 is mounted. As a method of providing the reinforcing plate 47, the resin base material 12 is heated and softened, and then the reinforcing plate 47 is embedded, and then the wiring conductor 16 is formed. In the case of this configuration, since the reinforcing plate 47 is provided on the mounting region side, the stress applied to the mounting region of the semiconductor imaging element 18 at the time of bending can be further reduced.

  In this configuration, the bumps 22 of the semiconductor image sensor 18 and the component connection terminals 16a of the wiring conductor 16 may be connected by solder. In the case of the reinforcing plate 47 having this configuration, a material having at least an insulating surface is used.

(Third embodiment)
10A is a plan view of a three-dimensionally configured electronic circuit unit according to a third embodiment of the present invention, FIG. 10B is a sectional view taken along line YY, and FIG. 10C is taken along line ZZ. FIG.

  In the three-dimensionally configured electronic circuit unit according to the present embodiment, the electrode terminals of the semiconductor imaging device 74 are provided on the four sides, and are connected to the component connection terminals 68a and 70a of the wiring conductors 68 and 70 by the bumps 75, respectively. Further, also in the present embodiment, the underfill resin 76 is formed.

  The circuit board 64 before being bent has a flat configuration in which wiring conductors 68 and 70 are formed on the four sides using a cross-shaped resin base material 66, respectively. After mounting the semiconductor imaging device 74 on such a cross-shaped and flat circuit board 64, it is bent at each set position as shown in FIG. 10 (b) and FIG. 10 (c). About this bending method, since the method demonstrated in 1st Embodiment can be used, description is abbreviate | omitted. The bending may be performed individually or all at once. For this purpose, a jig configuration similar to that of the first embodiment or a configuration obtained by partially modifying the same may be used.

  By bending the wiring conductors 68 and 70 in this way, the external connection terminals 68b and 70b and the component connection terminals 68a and 70a are three-dimensionally arranged. Accordingly, also in the present embodiment, one end of the wiring conductors 68 and 70 constitutes the component connection terminals 68a and 70a on which the semiconductor imaging element 74 is mounted, and the other end of the wiring conductors 68 and 70 Constitutes external connection terminals 68b and 70b connected to an external device (not shown), and the component connection terminals 68a and 70a and the external connection terminals 68b and 70b are three-dimensional and formed in parallel with a step. It will be. Furthermore, the thickness of the resin base material 66 from the component connection terminal 68a to the external connection terminal 68b is substantially the same.

  Also in the present embodiment, the opening 72 is provided at a position corresponding to the imaging region 74 a of the semiconductor imaging element 74 in the substantially central portion of the circuit board 64.

  Also in the present embodiment, as in the first embodiment, the semiconductor imaging device 74 can be mounted with a plurality of circuit boards 64 formed. For this reason, the mounting process can be greatly simplified as compared with the case of mounting a semiconductor element on a conventional three-dimensional circuit board.

  In addition, although the case where the semiconductor image sensor was used as an electronic component was demonstrated from 1st Embodiment to 3rd Embodiment, this invention is not limited to this. FIG. 11 is a cross-sectional view of a modified three-dimensionally configured electronic circuit unit in which a semiconductor imaging device 87 and a chip component 88 are mounted as electronic components. The three-dimensionally configured electronic circuit unit of this modification uses a circuit board 80 in which a wiring conductor 84 is formed on the surface of a resin base material 82. The wiring conductor 84 is characterized in that, in addition to the component connection terminal 84a and the external connection terminal 84b, an inter-component connection wiring 84c is also formed. An opening 86 is also formed in the resin base material 82. Since such a three-dimensionally configured electronic circuit unit can be manufactured by the same method as described in the first to third embodiments, the description thereof is omitted.

  FIG. 12 is a cross-sectional view of a three-dimensionally configured electronic circuit unit of still another modified example. In this case, two semiconductor elements 97 and 98 are mounted as electronic components. The circuit board 90 is provided with the wiring conductor 94 on the surface of the resin base material 92, but in the case of this modification, no opening is provided. Further, the wiring conductor 94 is characterized in that an inter-component connection wiring 94c is also formed in addition to the component connection terminals 94a and the external connection terminals 94b. 12 shows a configuration in which the semiconductor elements 97 and 98, which are electronic components, are mounted by a flip chip method, they may be mounted face-up, connected by wire bonding after wire bonding.

  As described above, the present invention can be applied not only to a semiconductor imaging element that is required to have a three-dimensional configuration, but also to form a three-dimensionally configured electronic circuit unit by three-dimensionally mounting semiconductor elements and passive components. You can also.

  The present invention configures an electronic circuit unit having a three-dimensional shape by mounting electronic components on a flat circuit board in advance and then bending a set portion, so that only a field where a three-dimensional configuration is required, such as a camera module. In addition, it is useful in various electronic circuit fields that require miniaturization and high density.

The top view of the main process for demonstrating the manufacturing process of the three-dimensionally configured electronic circuit unit according to the first embodiment of the present invention. Sectional drawing of the main process corresponding to FIG. 1 in the three-dimensionally configured electronic circuit unit according to the embodiment Sectional drawing which shows the jig | tool structure for bend | folding the predetermined area | region of a circuit board to the set angle in the manufacturing method of the solid-structure electronic circuit unit concerning the embodiment in the state mounted with the semiconductor image sensor. In the manufacturing method of the three-dimensionally configured electronic circuit unit according to the same embodiment, a jig configuration for further folding the circuit board folded in the state shown in FIG. Cross section Sectional drawing which shows the state mounted on the wiring board after combining with a lens unit using the three-dimensionally configured electronic circuit unit manufactured by the manufacturing method according to the same embodiment The top view which shows the state which mounted the semiconductor image pick-up element in the state in which the several circuit board was formed in the manufacturing method of the three-dimensionally configured electronic circuit unit according to the embodiment Sectional drawing of the main process for demonstrating the manufacturing method of the solid-structure electronic circuit unit concerning the 2nd Embodiment of this invention. (A) Cross-sectional view of the three-dimensionally configured electronic circuit unit produced by the manufacturing method of the three-dimensionally configured electronic circuit unit according to the embodiment. (B) Further to the three-dimensionally configured electronic circuit unit produced by the manufacturing method according to the embodiment. Sectional drawing which shows the state which attached the lens unit Sectional drawing at the time of providing the reinforcement board in the side which mounts a semiconductor image sensor in the manufacturing method concerning the embodiment (A) Plan view of a three-dimensionally configured electronic circuit unit according to a third embodiment of the present invention, (b) a sectional view along the YY line, (c) a sectional view along the ZZ line Sectional view of a three-dimensionally configured electronic circuit unit of a modified example in which a semiconductor imaging device and a chip component are mounted as electronic components Sectional drawing of the three-dimensionally configured electronic circuit unit of still another modification The figure which shows the structure which mounted the conventional camera module which consists of an electronic component unit with which the semiconductor image sensor was mounted, and a lens unit on the wiring board. Sectional drawing of the main process for producing the electronic component unit used for the conventional camera module

Explanation of symbols

10, 64, 80, 90 Circuit board 12, 66, 82, 92 Resin base material 14, 48, 72, 86, 104 Openings 16, 32, 68, 70, 84, 94, 106 Wiring conductors 16a, 68a, 70a , 84a, 94a Component connection terminal 16b, 68b, 70b, 84b, 94b, 106a External connection terminal 18, 74, 87, 110 Semiconductor imaging device (electronic component)
18a, 74a Imaging area 20, 76 Underfill resin 22, 44, 75 Bump 24, 26 Bending part 28 Three-dimensional electronic circuit unit 30, 120 Wiring board 34 Conductive adhesive 36, 114 Lens holding part 38, 116 Lens 40, 118 Lens unit 42 DSP
46, 47 Reinforcing plate 52 First upper mold 54 First lower mold 56 Second upper mold 58 Second lower mold 60 Third lower mold 62 Fourth lower mold 84c, 94c Inter-component connection wiring 88 chips Components 97, 98 Semiconductor element 100 Three-dimensional base material 102 Positioning groove 108 Three-dimensional circuit board 112 Electronic component unit 120a Connection terminal 122 Joining member

Claims (14)

A reinforcing plate is embedded in the mounting region portion of the resin base, and a component connection terminal as one end is provided on the surface of the reinforcing base and the resin base in which the reinforcing plate is embedded, and the other end Forming a flat circuit board by providing a plurality of wiring conductors whose parts constitute external connection terminals at symmetrical positions around the mounting area part; and
A mounting step of connecting an electronic component to the component connection terminal of the mounting region;
After mounting the electronic component, the region where the electronic component is mounted is fixedly held, and the resin base material and the wiring conductor in a predetermined region of the circuit board are bent in the direction in which the electronic component is mounted, A method of manufacturing a three-dimensionally configured electronic circuit unit, comprising: a step of processing a three-dimensional shape in which the component connection terminal and the external connection terminal of the wiring conductor have a step and are arranged in parallel. 2. The method of manufacturing a three-dimensionally configured electronic circuit unit according to claim 1, wherein the wiring conductor is formed at two symmetrical positions around the mounting region portion. 2. The three-dimensionally configured electronic circuit unit according to claim 1, wherein the resin base material has a cross shape with the mounting region portion as a center, and the wiring conductors are respectively formed in the cross region of the resin base material. Manufacturing method. In the step of processing into the three-dimensional shape, in a state where the area where the electronic component of the circuit board is mounted is fixed and heated, the resin base material in a predetermined area of the circuit board is heated and softened, The method for manufacturing a three-dimensionally configured electronic circuit unit according to any one of claims 1 to 3, wherein the resin base material and the wiring conductor are deformed and processed into a three-dimensional shape. The method for producing a three-dimensionally configured electronic circuit unit according to claim 4, wherein a thermoplastic resin or a semi-cured thermosetting resin is used as the resin base material. The method of manufacturing a three-dimensionally configured electronic circuit unit according to any one of claims 1 to 5, wherein the wiring conductor is formed of a conductive foil or a conductive resin. The electrode terminal of the electronic component and the component connection terminal of the circuit board are connected by any one of solder connection, conductive resin connection, direct contact connection, or wire lead connection. The manufacturing method of the three-dimensionally configured electronic circuit unit according to any one of claims 1 to 6 . The method of manufacturing a three-dimensionally configured electronic circuit unit according to any one of claims 1 to 6, wherein the electronic component and the circuit board are bonded and fixed with an insulating adhesive. The three-dimensionally configured electronic circuit unit according to any one of claims 1 to 8, wherein one or more selected from a semiconductor element and a passive component are mounted as the electronic component. Method. A component connection terminal which is one end is provided in the mounting region portion of the resin base material, and the other end portion is provided with a plurality of wiring conductors constituting external connection terminals at symmetrical positions with the mounting region portion as a center, Forming a flat circuit board having an opening;
A mounting step in which a semiconductor imaging element is positioned so as to correspond to the opening so that the imaging region is on the opening, and connected to the component connection terminal of the mounting region;
After mounting the semiconductor imaging device, the region where the semiconductor imaging device is mounted is fixedly held, and the resin base material and the wiring conductor in the predetermined region of the circuit board are mounted in the direction in which the semiconductor imaging device is mounted A three-dimensionally configured electronic circuit unit comprising a step of processing a three-dimensional shape in which the component connection terminal and the external connection terminal of the wiring conductor have a step and are arranged in parallel. Production method. The method of manufacturing a three-dimensionally configured electronic circuit unit according to claim 10 , further comprising mounting a lens on a surface of the circuit board opposite to a surface on which the semiconductor imaging device is mounted. And the resin base material, wherein a reinforcing plate embedded disposed on the mounting area of the resin substrate, the mounting area of the surface of said reinforcing plate and the resin base material in which the reinforcing plate is embedded at one end A circuit board including a component connection terminal, the other end constituting an external connection terminal, and a plurality of wiring conductors provided at symmetrical positions around the mounting region;
An electronic component that is mounted in connection with the component connection terminal of the mounting region portion,
The resin base material and the wiring conductor are bent in a direction in which the electronic component is mounted, the component connection terminal of the wiring conductor and the external connection terminal have a step, and in a parallel arrangement, The three-dimensionally configured electronic circuit unit, wherein the thickness of the resin base material is the same from the component connection terminal to the external connection terminal. 13. The three-dimensionally configured electronic circuit unit according to claim 12 , wherein the wiring conductor is formed at two symmetrical positions with the mounting region portion as a center. The three-dimensionally configured electron according to claim 12 , wherein the resin base material has a cross shape centered on the mounting region portion, and the wiring conductors are respectively formed in the cross region of the resin base material. Circuit unit.

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