JPH0227580Y2 - - Google Patents
Info
- Publication number
- JPH0227580Y2 JPH0227580Y2 JP1984114061U JP11406184U JPH0227580Y2 JP H0227580 Y2 JPH0227580 Y2 JP H0227580Y2 JP 1984114061 U JP1984114061 U JP 1984114061U JP 11406184 U JP11406184 U JP 11406184U JP H0227580 Y2 JPH0227580 Y2 JP H0227580Y2
- Authority
- JP
- Japan
- Prior art keywords
- elevating mechanism
- tape
- bonding
- bonding tape
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11406184U JPS6130275U (ja) | 1984-07-26 | 1984-07-26 | ボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11406184U JPS6130275U (ja) | 1984-07-26 | 1984-07-26 | ボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6130275U JPS6130275U (ja) | 1986-02-24 |
| JPH0227580Y2 true JPH0227580Y2 (enrdf_load_html_response) | 1990-07-25 |
Family
ID=30673089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11406184U Granted JPS6130275U (ja) | 1984-07-26 | 1984-07-26 | ボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6130275U (enrdf_load_html_response) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5923589A (ja) * | 1982-07-30 | 1984-02-07 | 富士通株式会社 | 部品搭載用熱加圧装置 |
-
1984
- 1984-07-26 JP JP11406184U patent/JPS6130275U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6130275U (ja) | 1986-02-24 |
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