JPH0227523Y2 - - Google Patents
Info
- Publication number
- JPH0227523Y2 JPH0227523Y2 JP13858084U JP13858084U JPH0227523Y2 JP H0227523 Y2 JPH0227523 Y2 JP H0227523Y2 JP 13858084 U JP13858084 U JP 13858084U JP 13858084 U JP13858084 U JP 13858084U JP H0227523 Y2 JPH0227523 Y2 JP H0227523Y2
- Authority
- JP
- Japan
- Prior art keywords
- coil
- circuit board
- printed circuit
- solder
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13858084U JPH0227523Y2 (de) | 1984-09-14 | 1984-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13858084U JPH0227523Y2 (de) | 1984-09-14 | 1984-09-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6153912U JPS6153912U (de) | 1986-04-11 |
| JPH0227523Y2 true JPH0227523Y2 (de) | 1990-07-25 |
Family
ID=30696968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13858084U Expired JPH0227523Y2 (de) | 1984-09-14 | 1984-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227523Y2 (de) |
-
1984
- 1984-09-14 JP JP13858084U patent/JPH0227523Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6153912U (de) | 1986-04-11 |
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