JPH02272752A - Lead correcting device of electronic part - Google Patents

Abstract

PURPOSE:To reduce correcting time and to realize compactness of a device by moving a semiconductor device up and down as it is held to press a lead from upper or below and by correcting dispersions of flatness of a point of the lead. CONSTITUTION:A semiconductor device 1 is held by a holder 3 of a drag block 5. When a cope block 4 is descended by operating an opening-and-closing cylinder 8, a keep member 2 holds a holder 3 and leads of the semiconductor device 1 with the elastic force of a spring 9 which is connected through a supporting member 17. An air cylinder 7 is operated to ascend a space in a block formed by the cope and drag blocks 4, 5; then, the leads of the semiconductor device 1 comes into contact with a surface of a lead correcting die section 4a which is formed by the cope block 4, and is corrected downward. When the air cylinder 6 is operated to descend the held semiconductor device 1, the lead of the semiconductor device 1 comes into contact with a surface of a lead correcting die section 5a which is formed by the drag block 5 to correct downward- deformation upward, thereby restricting variation of flatness of leads within specified standard.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to the manufacturing of electronic devices, and in particular, to the manufacturing of electronic devices, in particular, the manufacturing of multiple electronic devices in so-called surface mount type semiconductor devices in which leads are mounted in contact with the surface of a mounting board (printed board). The present invention relates to a technique that is effective when applied to correct the misalignment of leads.

[Conventional technology]

Generally, after a semiconductor device is sealed, the external leads are cut,
Molding is performed. After this, aging, testing, etc. are performed to obtain non-defective products.

Surface-mount type electronic devices to which the present invention is applied, particularly QFPs (Quad-Flat-Pack: Quad-Flat-Pack), which have leads in four directions with a lead type called gulf-wing.
age) and 5OPs in two directions (Small, Outline, Package: Small -0utlin
e-Package), the lower surface side of the tip of the multiple HIJ-cord is connected to the mounting board by soldering, etc., so the tips of the multiple leads are flattened and their variations are reduced to a specified level. It is necessary to keep it within the standards of But in reality, it's a lead! Since the lead is inserted into a socket or the like and subjected to aging and testing, deformation of the lead may occur at this stage, and the flatness of the tip of the lead may exceed a predetermined standard.

Semiconductor devices with leads that exceed the standards like this
When attempting to mount a lead on a mounting board, leads that deviate from the standard will not connect properly to the board, and leads that are deformed in the opposite direction to the mounting surface (hereinafter referred to as upward deformation) often cause mounting failures.

In addition, if multiple parts are deformed in the direction of the mounting surface (hereinafter referred to as downward deformation) and have excessive deformation, defects may occur.

When removing a defective semiconductor device from the board in order to regenerate a mounting structure using a semiconductor device that has been deformed in this way, the normal leads are also often deformed. If this occurs, it is often impossible to reuse the semiconductor device.

For this reason, in order to prevent defects in the mounting structure in which the semiconductor device is mounted on the mounting board, it is necessary to correct the leads if they are deformed.

However, semiconductor devices having lead deformation defects are rarely deformed only in the upward direction or only in the downward direction, and often have lead deformation in both directions.

Therefore, as an apparatus for correcting lead deformation of a semiconductor device, it is essential to correct upward deformation and downward deformation.

Therefore, in the past, a method has been adopted for straightening semiconductor device leads that are upwardly deformed and downwardly deformed using separate devices.

Regarding the mounting technology of surface mount type semiconductor devices, etc., please refer to Nikkei Maguro Hill, published June 11, 1984,
“Micro Devices, Nikkei Electronics Special Issue/l
62J, I) 148-159.

[Problem to be solved by the invention]

In the case where such upward deformation and downward deformation are corrected using separate devices, it is necessary to transport the devices between the respective devices, and when an integrated device is desired, the device becomes large.

Further, there is a problem that the device becomes expensive because it becomes large and requires a conveyance means.

Another problem is that it takes time to straighten the leads because the semiconductor devices are transported between devices that correct deformations.

SUMMARY OF THE INVENTION The present invention solves these problems and provides a lead correction device for electronic devices that is inexpensive, time-saving, and easily miniaturized.

[Means to solve problems]

A summary of typical inventions disclosed in this application is as follows.

In other words, a means for clamping a plurality of leads led out from a sealed body of an electronic component, a means for raising and lowering the clamping means, and a means for abutting the plurality of clamped leads at predetermined surfaces such as ends thereof. The deformation of the lead is corrected by moving the semiconductor device and bringing it into contact with a block or columnar member configured as shown in FIG.

[Effect]

According to the above-mentioned means, it is possible to press the leads from above or below by moving the semiconductor device once held up and down, thereby correcting variations in the flatness of the tips of the leads. .

Since the vertical deformation of the lead can be corrected while holding the semiconductor device, a transport mechanism is not required.

Furthermore, since there is no conveyance mechanism, the correction time can be shortened.

Furthermore, since a transport mechanism is not required, the cost of the apparatus can be reduced.

[Embodiment 1] FIG. 1 is a diagram of a lead straightening device according to a first embodiment of the present invention. In order to convey the semiconductor device 1 to the holder 3, the cylinder 8ya1' is operated and the upper die is opened. FIG. 2 is a cross-sectional side view of a main part shown in FIG. 1, and FIG. 2 shows a state in which a semiconductor device is conveyed to the lead straightening device shown in FIG. FIG. 3 is a partially sectional side view.

In FIG. 1, the lead straightening device of the present invention has an upper die block 4 and a lower die block 5 made of iron-based material. It has an upper mold block straightening die part 4a formed in a notch shape.The lower mold block 5 is similarly formed in a concave shape, and the inside thereof is formed as a lower mold block straightening die part 5a ( - This upper die block 4 is configured to move up and down along a support 16 attached to the lower die block 5 by means of a block opening/closing cylinder 8 attached to the lower die block 5.

A retainer 2 for holding the semiconductor device It1 is attached approximately at the center of the upper mold block 4. This presser 2 passes through a hole formed approximately in the center of the upper mold block 4 and projects upward, and its seventh end is connected to a support member 17. This support member 17 is connected to an elastic member such as a spring 9 attached to the side of the upper die block 4, and serves as a pressing force for the presser 2 when the semiconductor device 1 is clamped.

Similarly to the upper mold block 4, a holder 3 for holding the semiconductor device 1 is attached to the center of the lower mold block 5.
Ru. The holder 3 projects downward through a hole formed approximately in the center of the lower mold block 5, and its tip is connected to the support member 18.

This support member 18 is also connected to a spring 13 attached to the lower die. On the opposite side of the support member 180, there is a member 1 attached to the lower mold 5 so as to oppose and contact the support member 18.
2 is installed.

A spring 10 having an attractive force in the opposite direction to the spring 13 connected to the support member 18 is attached to this member 12, and at this time, the force of the spring 10 exceeds the force Z of the spring 130, and this By adopting such a configuration, the stopper 11 formed on the lower die block 5 stops the member 12 from being pulled up, prevents the holder 3 from rising when the upper die block 4 rises, and allows the semiconductor device to be transported. It is structured in such a way that it is easy to use.

An air cylinder 6 is attached to the upper mold block 4&C as a driving device, and when operated, the cylinder tip 6a protrudes and the presser 2 is pushed down.

An air cylinder 7 is also formed in the lower mold block 5 as a driving device, and the cylinder tip 7a is similarly projected and the holder 3 is pushed up by the operation of the cylinder.

The screws 14 and 15 are attached to the protrusion 1- of each cylinder.
nv This is for adjusting to a predetermined child.

FIG. 2 is a diagram showing the state in which the upper die block 4 is closed to perform the lead straightening process.

By lowering the upper die block 4 in this manner, a block having a correction die portion is constructed around the sandwiched semiconductor device.

Next, the operation of the present invention will be explained.

3 to 5 are schematic sectional views of main parts for explaining the operation of the lead correction device of the present invention.

In FIG. 3, the semiconductor device 1 transported by a transport mechanism (not shown) is held by a holder 3 provided approximately in the center of the lower mold block 5. As shown in FIG.

Note that the semiconductor device R1 is a QFP type semiconductor device,
A state in which the lead 1a is deformed upward is shown.

Thereafter, the opening/closing cylinder 8 (see FIG. 1) of the upper die block 4 is operated to lower it. At this time, the presser 2 provided on the upper die block 4 is connected via the support member 17' and the elastic force of the spring 90 holds the holder 3 and the semiconductor device w11 in a lead-like manner.

That is, since the spring 9 is pulled when the block 4 descends, an elastic force (arrow A) acts on the spring 9 to cause it to contract. Therefore, the leads of the semiconductor device are pressed down.

FIG. 4 is a diagram showing the process of correcting downward the upward deformation of a lead of a semiconductor device.

The semiconductor device (1) held by the presser 2 and the holder 3
1 rises through the space inside the block formed by the upper die block 4 and the lower die block 5 by operating the air cylinder 7. By rising in this manner, the leads 1a of the semiconductor device 1 are formed on the upper mold block 4, contact the surface of the lead straightening die portion 4a, and are straightened downward.

FIG. 5 is a diagram illustrating a process of correcting the downward deformation upward after correcting the lead 1a which has been upwardly deformed downward.

As shown in FIG. 4, after the upward deformation is corrected, the air cylinder 67 is operated to lower the semiconductor device 1 held by the presser 2 and the holder 3 downward. By descending, the leads 1a of the semiconductor device ill come into contact with the surface of the lead correction die portion 5a formed in the lower mold block, correcting the downward deformation upward, and bringing the dispersion of the leads within a predetermined standard.

An appropriate value can be selected for the amount of cylinder operation during correction by adjusting the screws 14 and 15 depending on the product.

According to this embodiment, by straightening the leads of a semiconductor device in the vertical direction (), it is possible to bring the variation in the flatness of the tip of the lead within a predetermined standard, and to improve the quality of the semiconductor device with a good mounting structure. You can get the equipment.

[Embodiment 2] FIG. 6 is a schematic sectional view showing the main parts of a second embodiment of the lead correction device of the present invention.

In the case of this embodiment, the upper mold block is divided into a plurality of parts such as block 19 and block 20, which are moved from the side to a predetermined position to form the upper mold block. Other than that, the same configuration as that used in the first embodiment can be adopted.

According to this embodiment, there is no need to move blocks upward, so the layout of the upper part of the device is simplified.

[Embodiment 3] FIG. 7 is a schematic sectional view showing the main parts of a lead correction device according to a third embodiment of the present invention.

In the case of this embodiment, the cylindrical members 21.22 are used instead of the upper mold block, and the cylindrical members 23.24 are used instead of the lower mold block.
It is possible to use a configuration equivalent to that of the embodiment.

According to this embodiment, since the contact portion between the lead and the cylindrical member is substantially a point contact, the lead straightening device ffi'2 of the present invention (the lead of the semiconductor device whose lead has been straightened) This has the effect of significantly reducing the occurrence of scratches caused by contact with blocks.

[Embodiment 4] FIG. 8 is a schematic sectional view showing the main parts of a lead correction device according to a fourth embodiment of the present invention.

In the case of this example, the lead correction die part! Upper mold block 2
6. Except for the fact that the inner periphery of the lower die block 25, which is a concave portion, is formed into a sloped shape such that the upper die lead correction die part 26a and the lower W I + -do correction die part 25a are in contact with the tip of the lead. A configuration equivalent to the first embodiment can be used.

According to this embodiment, since the lead can be straightened by contacting the block only with the tip of the lead, the lead straightening device of the present invention can be used. The effect of not causing scratches etc. can be obtained.

[Embodiment 5] FIG. 9 is a schematic sectional view showing essential parts of a fifth embodiment of the present invention.

This embodiment is particularly effective when applied to an SOP type semiconductor device having leads in two directions.

For products with leads in two directions, there is no need to configure a block with a lead correction section that surrounds all 14 directions. Since it can be mounted, there is no need to open and close the block and transport semiconductor devices.
Therefore, the upper mold and lower mold blocks can be constructed as one unit.

As shown in FIG. 9, in this embodiment, the upper and lower body block 27 has an upper die and a lower die fixed as one body, and like the other blocks, lead correction die parts 27a, 27
b is formed. In other respects, substantially the same configuration as in the other embodiments can be used.

The transport mechanism may be configured to transport the semiconductor device to the holder 3 using rail transport or the like.

(Not shown) According to this embodiment, an effect can be obtained in that an opening/closing cylinder is not required.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

(1) Since it is possible to correct upper and lower lead deformations with a single lead straightening device without transporting the semiconductor device, the device can be made more compact.

(2) Since there is no need to transport the semiconductor device to correct the upper and lower deformations of the leads, there is no need for a transport mechanism.

(3) Since there is no transportation, troubles during transportation are eliminated.

(4) Since the upper and lower leads are corrected, variations in the leads of the semiconductor device are eliminated and a constant standard can be used.

Although the invention made by the inventor of the present application has been specifically explained based on Examples above, the present invention is not limited to the above-mentioned Examples, and it is understood that various changes can be made without departing from the gist of the invention. For example, either upward or downward deformation of the reed may be corrected first.Furthermore, although an air cylinder is used as the drive device, other devices such as a cam or a ball screw may also be used.

Further, the lead straightening device of the present invention can be used not only for deformed leads, but also for leads mixed with non-defective leads. If used in this manner, visual calibration of the lead can be made unnecessary.

Further, since the lead correction device of the present invention can be miniaturized, it can be configured as an integrated device for mark inspection and lead correction in combination with a device for mark inspection and the like.

Furthermore, the present invention can be incorporated into a component mounting machine that mounts semiconductor devices onto a mounting board such as a printed circuit board, thereby significantly improving the defective rate during board mounting.

[Brief explanation of drawings]

1 and 2 are cross-sectional side views of main parts of a lead correction device according to a first embodiment of the present invention, and FIGS. 3 to 5 are side views of main parts of the lead correction device shown in FIGS. 1 and 2. 6 is a schematic sectional view showing the main parts of the second embodiment of the present invention; FIG. 7 is the main part of the third embodiment of the present invention. Schematic sectional view FIG. 8 is a schematic sectional view showing the main part Z of the fourth embodiment of the present invention. FIG. 9 is a schematic sectional view showing essential parts of a fifth embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Semiconductor device, 1a... Lead, 2... Holder, 3... Holder, 4... Upper die block, 4a...
・Lead correction die part, 5...lower mold block, 5a...
・Lead correction die part, 6, 7...Air cylinder, 6a
, 7a... Cylinder tip, 8... Opening/closing cylinder 9, 10° 13... Bar, 11... Stopper 1
2... Member, 14° 5... Cylinder adjustment table 8... Support member, 19 2... Cylindrical member, 2 5... Lower die block. 6... Upper mold block. 7...Upper and lower type integrated prod correction guide part. 16... Support column, 17°, 20... Flock, 21° 3.24... Cylindrical member, 25a... Lead correction die part, 26a... Lead correction die part, Tsuku, 27a , 27b--Fig.

Claims (3)

[Claims] 1. means for clamping a plurality of leads led out from a sealed body of an electronic component; and means for moving the clamping means up and down;
A lead correction device comprising a block or a cylindrical member configured to abut the ends of a plurality of clamped leads in a predetermined plane. 2. 2. A lead correction device for electronic components according to claim 1, wherein said means for raising and lowering is a cylinder provided to be operated in each of the vertical directions. 3. means for clamping a gull-wing type semiconductor device having a plurality of leads; means for vertically moving the clamped semiconductor device; and contact with the leads of the clamped semiconductor device by vertically moving the clamped semiconductor device. 1. A lead correction device for a semiconductor device, comprising a cylindrical member provided so as to correct a lead of a semiconductor device.