JPS62125700A - Reformation of electronic parts leads and apparatus for the same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Application of the Invention) The present invention relates to a method and apparatus for correcting leads of electronic components, and particularly to leads of electronic components suitable for correcting leads of flat package electronic components such as LSIs. Concerning correction methods and devices.

(Background of the Invention) Regarding conventional lead correction of electronic components, for example, as described in Japanese Patent Application Laid-Open No. 58-80900, a plurality of leads are held and swung by a mechanical guide. It has been proposed to erase the elastic memory of the body and correct it to its proper state.

However, in a flat package type component such as an LSI, as shown in FIGS. 6 to 8, a plurality of glues are used to connect the main body (sealing part) 1 forming the circuit and the printed circuit board (not shown). 2 and radiating fins 3 for heat radiation
The lead 2 has a cross-sectional dimension of 0.2 m.
m x 0.15mm, pitch P of lead 2 is 0.5
08mm, the number of leads 2 per side is about 40, so in order to connect word 2 to the printed circuit board with secure button soldering, the variation in the height direction of lead 2 (hereinafter referred to as float) Δb must be It is necessary to hold the lead 2 to 0.1 mm or less, but if you hold both ends of the lead 2 with a mechanical guide like the one proposed above and swing the tip, the end of the main body 1 and the base of the lead 2 An unreasonable force may be applied to the glass 1' inserted between the two parts, causing damage to the glass 1', making it difficult to stabilize or straighten the glass 1'.

(Objective of the Invention) An object of the present invention is to solve the above-mentioned conventional problems and to provide a method and apparatus for correcting leads of electronic components with less mechanical loss.

(Summary of the Invention) In order to achieve the above-mentioned object, the present invention, as shown in FIG. After correcting the root part 2a by restraining it so that The tip 2 of the lead 2 is formed by a swinging upper part 6 and a swinging upper part 7 that move vertically along the outer end surface of the lead 2.
b in the vertical direction to generate tensile stress and compressive stress exceeding the plastic region of lead 2, while uniformly giving a large change in history to the extent that the difference in the initial BIM of lead 2 can be ignored. It is a correction.

Therefore, the floating Δh of the tip 2b of the lead 2 can be suppressed and corrected, and the sealing crow 1' of the LSI main body 1 can be prevented from being damaged.

(Embodiment of the Invention) Hereinafter, FIGS. M1 to 5 showing an embodiment of the present invention will be described. FIG. 1 is a sectional front view showing a lead correction device for electronic components according to the present invention, FIG. 2 is a sectional side view of FIG. 1, FIG. 3 is a top view of FIG. 1, and FIG. 4 is a sectional side view of FIG. FIG. 5 is a half view taken along line B-B, and FIG. 5 is a plan view taken along line C-C in FIG.

In the figure, reference numeral 8 is a rectangular base, and a guide bar 2 of <411# is fixed in parallel to the outside of the guide bar 2 with a diameter of <411# so as to protrude slightly upward from the top surface. . An 11-piece lower slide base is made into a rectangular shape, and a swinging upper part 6 is fixed to the upper surface, and the upper part of the orthodontic upper part 4 identified at the center position of the upper surface of the base 8 is placed in the upper part of the upper part of the base 8 in the upper part. In the direction, 3.

A shoulder hole 11a is provided in which the guide bar 11a is movably and loosely fitted, and is supported by the four guide bars in a loosely slidable manner in the vertical direction so as to be constantly pressed upward via a spring 12.

Reference numeral 15 is a middle slide base, the center part is formed into a square shape, and trapezoidal parts formed at both ends thereof so that the width becomes smaller as they go outward are fixed to one body. The light leakage small diameter portion 5a of the correcting upper mold 5 facing above the correcting upper mold is loosely fitted into the center position of the upper correcting mold so as to be movable in the vertical direction. c15 a and the above 2 on both ends.
The ring guide 10 is loosely fitted and supported by a spring 14 so as to be slidable in the vertical direction so as to be constantly pressed upward. Reference numeral 15 designates an upper slide base, which has a rectangular shape and is loosely fitted into the four guide bars so as to be slidable in the vertical direction, and fixedly supports the upper part 5 for correction at the center of the lower surface. A 16-piece plate is formed in the same shape as the central slide base 13, and both ends are connected to the connecting plate 1.
The upper slide base 1 is fixed to one body via the upper slide base 1 and is loosely fitted into the four guide bars so as to be slidable in the vertical direction.
A spring 18 that is constantly pressed upward is inserted between the main body 5 and the main body 5. The piston rod 19a is a pressurizing device such as a hydraulic press, supported by a support mechanism (not shown), and the tip of its piston rod 19a is tightly fitted into the grate 16. Two stopper bolts 20 are fastened to the lower surface of the lower slide base 11 and secured by a lock nut 21. A 22 cylinder cylinder is fixedly supported via a button support plate 23 at one end of the base 8, and the tip of the piston rod 22a is connected to a slide grate 24 supported on the base 8 so as to be slidable in the horizontal direction. Then, the slide plate 24 is inserted between the base 8 and the lower end surface 20a of the head of the stopper bolt 20, and is positioned in the vertical direction of the upper shape 4 for correction via the stopper bolt 20 and the lower slide base 11. are doing. The upper shape 4 for correction has an opening groove 4a formed in its upper surface into which the LSI main body 1 is inserted, and the lower surface of the upper shape 5 for correction has an opening into which the LSI main body 1 and the heat dissipation fin 3 are inserted. A groove 5a is formed. Further, the mounting portion 5b of the upper five-piece correction upper slide base 15 is formed into a large diameter button, and a stepped surface 5C is formed between it and the small diameter portion 15a at the tip.

Since the lead correction device for electronic components according to the present invention is constructed as described above, first, the operation of the pressurizing device 19 is stopped;
The elastic force of the three springs 12, 14, and 18 pushes the piston rod 19a up in the direction of the arrow D', and the plate 1
6. When the connecting plate 17 and the middle slide base 13 are respectively raised to the positions shown in FIG.
is raised and separated from the upper shape for correction 6, and at the same time, the middle slide base 16 raises the upper shape for correction 5 via the stepped surface 5 and separated from the upper shape for correction 4.

In this state, the LSI main body 1 to be corrected is inserted into the opening groove 4a of the lower plate 4 for correction and positioned. In this case, although the lead 2 of the LSI main body 1 is pushed up slightly by the elastic force of the six-piece swinging upper spring 12, most of the leads 2 of the LSI main body 1 are installed in the opening groove 4a of the upper correcting mold 4.

Next, the pressurizing device 19 is driven to push down the piston rod 19a in the direction of arrow D to connect the plate 16 and the connecting plate L/-)1.
7 and the middle slide base 13 are lowered, respectively.
The upper slide base 15 and the correcting upper mold 5 are lowered by the elastic force of the spring 18, and the root portion 2a of the lead 2 is inserted and restrained between it and the correcting upper mold 4. In this case, the swinging upper part 6 is pushed upward from the upper surface of the correcting upper part 4 by the elastic force of the spring 12, so that the leading end 2b of the lead 2 is pushed up.
is lifted slightly upward.

Thereafter, when the piston rod 19a is further pushed down in the direction of arrow D by driving the pressurizing device 19, the spring 1
8 is bent and the middle slide base 15 is lowered, and at the same time the swinging upper part 7 is also lowered and the lead 2 is placed between it and the swinging upper part 6.
, and push it downward against the elastic force of the spring 12.

Next, when the middle slide base 13 has descended to a predetermined position, the drive of the pressurizing device 19 is temporarily stopped and the rod 19 is
When a is pushed up in the direction of the arrow D', the root portion 2a of the 7-do 2 is restrained between the straightening upper shape 5 and the straightening upper shape 4 by the elastic force of the spring 18, and at the same time the spring Due to the elastic forces of the lead 12 and the spring 14, the tip 2b of the lead 2 is slightly lifted upward while the tip 2b is inserted between the swinging upper part 6 and the swinging upper part 7.

Thereafter, when the pressure device 19 is driven and the rod 19a is pushed down in the direction of arrow D, the tip 2b of the series lead 2 is pushed down by the swinging upper shape 6 and the swinging upper shape 7.

In this way, the vertical swinging of the tip 2b of the door 2 is repeated a predetermined number of times, and the pressing device 19a stops once, and the swinging upper part 6 and the swinging upper part 7 are positioned upward. When the cylinder 22 is driven and the slide plate 24 is moved via the piston rod 22a using the four-way swinging upper button and inserted between the lower end surface 20 of the head of the stopper bolt 20 and the base 8, the lower part Since the vertical positions of the swinging upper shape 6 and the swinging upper shape 7 are determined via the slide space 11, the floating tip 2b of the lead 2 is inserted into these shapes 6.7. It can be regulated to a certain degree.

Then, the driving of the pressurizing device 19 is stopped and the rod 19 is moved to D.
'When pushed up in the direction of the arrow, the middle slide base 13 and the upper slide base 15 are pushed upward by the elastic force of the spring 14, so that the upper part for correction 5 is separated from the upper part for correction 4, and at the same time, the upper part for correction is moved away from the upper part for swinging. The upper shape 7 is separated from the swinging upper shape 6. Also, due to the elastic force of the spring 12: 1.
1- Since the tip 2b of the lead 2 is lifted and the root portion 2a of the lead 2 is lifted upward from the opening groove 4a of the upper mold 4 for correction, the LSI 1 can be easily removed from the upper mold 4 for correction. .

Therefore, it is only necessary to drive the pressurizing device 19 or at least stop it and move the rod 19a in the vertical direction.
The tip end 2b of the lead 2 can be swung by the vertical movement of the swinging upper mold 6 and the swinging upper mold 7 while the lead a is restrained between the straightening upper mold 4 and the straightening upper mold 5. Then move the slide plate 24 and insert it between the lower end surface 20a of the head of the stopper bolt 20 and the base 8.
correction can be regulated.

(Effects of the Invention) Since the present invention is as described above, it is possible to prevent breakage of the glass inserted between the end of the LnLSI main body and the root of the lead during lead correction, and Since the leads can be corrected to a predetermined size, it is possible to reduce the floating of the leads when electronic components are attached to the board, thereby improving the reliability of soldering.

[Brief explanation of drawings]

FIG. 1 is a sectional front view showing a lead correction device for electronic components according to the present invention, FIG. 2 is a sectional side view of FIG. 1, FIG. 3 is a top view of FIG. 1, and FIG. 4 is a sectional side view of FIG. 5 is a plan view taken along the line C-C in FIG. 1, FIG. 6 is a perspective view of a flat package type electronic component (LSI) to which the present invention is applied, and FIG. 6 is an enlarged perspective view of part A in FIG. 6, FIG. 8 is a sectional view of FIG. 7, and FIG. 9 is a sectional view showing the principle of the electronic component lead correction device according to the present invention.・ １１ ・ 1... LSI main body, 2... Lead, 5... Heat radiation fin. 4... Upper shape for correction, 5... Upper shape for correction, 6... Upper shape for swinging, 7... Upper shape for swinging, 8... Base, 9.
10... Guide bar, 11... Lower slide base, 12, 14.18... Spring, 13... Middle slide base, 15... Upper slide base, 1
6...Gray), 17...Connection plate, 19...
・Pressure device, 20...Stotsuno Kuichi bolt, 21...
・Lock nut, 22... cylinder. 23...Support grating, 24...Sliding grate. . ′) W ′

Claims (1)

[Scope of Claims] 1. The root parts of a plurality of leads protruding from both ends of a flat package type electronic component are restrained so as to be inserted in a correction mold, and the tips are held in a swing mold while being swung. A method for correcting a lead of an electronic component, characterized in that the elastic memory of the tip of the lead is erased and the position of the swinging shape is determined. 2. A restraining means that inserts and restrains the roots of a plurality of leads protruding from both ends of a flat package type electronic component, a swinging means that swings the tips of the leads to erase their elastic memory, and a swinging means that moves the leads to a predetermined size. A lead correction device for an electronic component, characterized in that it is provided with a positioning means for positioning the lead.