JPH04139784A - Fixing method of substrate - Google Patents

Abstract

PURPOSE:To correct the warp of a substrate itself by a simple method, and prevent the warp at the time of fixing, by arranging a plurality of those movable clampers, at positions corresponding with reference holes formed at four corners of the substrate, which are provided with reference pins engaging with the reference holes, and moving the clampers in the radial directions with respect to the substrate. CONSTITUTION:In a clamper 14, a reference pin 14-2 is planted at a position corresponding with a reference hole 1a formed at each of the four corners of a substrate 1. A plurality of, e.g. four, clampers 14 are arranged so as to be movable in the radial direction of the substrate 1, e.g. the arrow A direction. The clampers 14 are connected with a driving mechanism 15. A regulation claw 14-3 of each clamper 14 is used as a guide. Each reference pin 14-2 planted on a base 14-1 is engaged with each reference hole la of the substrate 1. The regulation claws 14-3 are moved in the arrow B direction and the arrow C direction. Thereby four corners of the substrate 1 are pinched by the reference pins 14-2 and the regulation claws 14-3, and then each clamper 14 is made to slide in the radial direction, e.g. the arrow A direction by operating the driving mechanism 15. Thus the substrate 1 is fixed.

Description

[Detailed Description of the Invention] [Summary] Regarding a method for fixing a printed wiring board, which is widely used in the construction of various electronic devices, to a solder cream printing machine, the present invention involves correcting the warpage of the board itself and preventing warpage during fixation. A reference pin is provided upright at a position corresponding to the reference hole drilled in the printed wiring board to engage with the reference hole. By arranging multiple clampers,
The clamper is driven in a radial direction with respect to the printed wiring board engaged with the reference pin.

[Industrial application field]

The present invention relates to a method for fixing a printed wiring board, which is widely used in the construction of various electronic devices, to a solder cream printing machine.

Recently, electronic components with input/output terminals arranged in tiny pinches have become more highly integrated, especially on printed circuit board units installed in computers, etc., and these electronic components have been surface-mounted at high density. A printed wiring board (hereinafter simply referred to as a board) has fine fund prints formed at a high density. Therefore, when mounting electronic components, the board is fixed to a solder cream printing machine and solder cream is printed on the hood print, but the printing accuracy of the solder cream deteriorates due to the warpage of the board itself or the warp that occurs during fixation. Therefore, there is a need for a new method for fixing a substrate that can correct the warpage of the substrate itself, prevent warpage during fixation, and facilitate fixation to a printing machine.

(Prior art) A conventionally widely used board fixing method is shown in Figure 3 (a).
) on the mounting table 3 of the solder cream printing machine!
! The pressing part 4a of a clamper 4 having a thin plate-shaped pressing part 4a formed on one end is brought into contact with the upper surface of the edge of the placed substrate 1, and the clamper 4 is moved in the direction of the mounting table 3, that is, in the direction indicated by the arrow. A mechanical clamp method is often used in which the substrate 1 is fixed by movement.

Further, as shown in FIG. 3(b), the pressing surfaces 8a of the regulating claws 8 are brought into contact with each side surface of the substrate 1, and one or both of the opposing regulating claws 8 are moved in parallel in a direction toward each other. A method of fixing the substrate 1 by restricting the outer shape is also used.

Furthermore, in the board 1 with the electronic components 2 mounted on one surface, the electronic components of the board 1 are mounted at the tips of a plurality of backup pins 92 erected in the fixing area of the board 1, as shown in FIG. 3(C). A vacuum clamp method is used in which the part of the board 1 where the electronic component 2 is not mounted is supported by a vacuum rod 9-1, which is also erected, and the part of the board 1 where the electronic component 2 is not mounted is fixed by vacuum suction.

[Problem to be solved by the invention]

The problems with the conventional board fixing method explained above are:
In the mechanical clamp method, as shown in FIG. 3 (aJ), each side edge of the board 1 is pressed by the pressing part 4a of the clamper 4, so a mask 5 for printing the solder cream 7 on the upper surface of the fixed board 1 is used. When deposited, a gap is formed between the substrate 1 and the mask 5 near the pressing portion 4a of the clamper 4.

If the squeegee 6 is moved in this state and the solder cream 7 on the mask 5 is printed on the substrate 1, there will be a problem that the amount of solder cream 7 printed will increase in the gap generation area or the accuracy of the printing position will deteriorate. There is.

In addition, in the external shape regulation method shown in FIG. 3(b), since each side of the board I is pressed and fixed by the regulation claws 8, the central part of the board I is likely to warp upward. This warping causes a problem in that printing accuracy of the solder cream cannot be ensured.

Furthermore, in the vacuum clamp method shown in FIG. 3(C), the substrate 1 is supported by a plurality of upright backup pins 9-2 and fixed by vacuum suction from the vacuum rods 9 to 1. , a problem arises in that the standing positions of the backup pin 9-2 and the vacuum rod 9-1 have to be moved every time a board l having a different mounting position of the electronic component 2 is fixed.

In view of the above-mentioned problems, the present invention is capable of correcting the warping of the board itself and preventing warping during fixation.
There is also a need for a new method for fixing a substrate that can be easily fixed to a solder cream printing machine.

Means for Solving Problem C] The present invention provides a method for engaging the reference hole 1a at a position corresponding to the reference hole 1a formed squarely in the substrate l, as shown in the principle explanatory diagram of FIG. A plurality of movable lumbars 14 each having a reference pin 14-2 erected thereon are arranged, and the clamper 14 is connected to the substrate 1 engaged with the reference pin 14-2.
move in the radial direction.

[For production]

In the present invention, the reference hole 1a of the substrate 1 is engaged with the reference hole 4-2 of each clamper 14 disposed at a position corresponding to the reference hole 1a of the substrate 1, and each clamper 14 is inserted into the substrate 1. When the board 1 is moved in the radial direction, the board 1 pulled in the radial direction is fixed with the central part showing a tendency to curve downward, so a small number of back-up pins (not shown) are provided as necessary. This prevents downward warping and keeps the substrate l flat.
It is possible to correct the warpage of the board itself, prevent warpage during fixation, and easily fix it to a solder cream printing machine.

〔Example〕

The present invention will be described in detail below with reference to FIGS. 1 and 2.

FIG. 1 is a plan view showing the principle of the present invention, and FIG. 2 is a schematic diagram of the method of fixing a substrate according to this embodiment.
The same members as in Fig. 3 are given the same symbols, and 14 is a clamper that forcibly corrects the warpage of the board and fixes it to the mounting table, and 15 is a drive that moves the clamper toward the four corners of the board. It is a mechanism.

As shown in FIG. 2, the clamper 14 has a reference pin 14-2 erected on a base 14-1 with a size that can be held in a reference hole 1a formed in a substrate 1, and is engaged with the reference pin 14-2. It guides the mounting position of the matching board 1 and
The regulating claws 14-3 that press the side surfaces of the control claws 14-3 are arranged so as to be slidable in the force directions of arrows B-B' and c-c' so as to be orthogonal to each other, and air is used to slide each regulating claw 14-3 in the direction of the arrows. cylinder 1
4-4 are each fixed to the base 14-1.

The drive mechanism 15 is, for example, a general-purpose air cylinder that slides the clamper 14 in the radial direction with respect to the substrate 1.

The fixing mechanism and fixing method of the board using the above members are as follows:
As shown in the figure, a plurality of, for example, four, clampers 14 each having a reference pin 14-2 are placed in the radial direction of the substrate 1, that is, the arrow A The clamper 14 and the drive mechanism 15 are connected to each other so as to be slidable in the direction shown in FIG.

Using the regulating claws 14-3 of each clamper 14 arranged as a guide, each reference pin 14-2 erected on the base 14-1 is engaged with each reference hole 1a of the substrate 1,
By moving the regulating claw 14-3 in the directions of arrows B and C using the air cylinder 14-4, the square of the board 1 is held between the reference pin 14-2 and the regulating claw 14-3, and then the drive mechanism 15 is activated. By sliding each clamper 14 with respect to the substrate 1 in the radial direction, that is, in the direction of arrow A, the substrate 1 is fixed.

As a result, the reference pins 14 each engaged with the reference hole 1a.
-2 in the radial direction, the board 1 tends to warp downward, but by providing a backup bin (not shown), the downward warp is restricted and the board itself is warped. It is possible to correct the problem, prevent warpage during fixation, and easily fix it to a solder cream printing machine.

Although the present invention has been described above based on the illustrated embodiments, the present invention is not limited to the embodiments described above. For example, one fixed reference pin 14-2 and at least three clampers 14 may be The clampers 14 may be provided at positions corresponding to the reference holes 1a formed in the squares of the substrate 1, and the clampers 14 may not be provided at positions corresponding to all the reference holes 1a.

〔Effect of the invention〕

As is clear from the above explanation, according to the present invention, it is possible to correct the warpage of the board itself, prevent warpage during fixation, and facilitate fixation to a solder cream printing machine using an extremely simple method. It is possible to provide a method for fixing a substrate, which has the following advantages and can be expected to have significant economical and reliability-improving effects.

[Brief explanation of drawings]

FIG. 1 is a plan view showing the principle of the present invention; FIG. 2 is a schematic diagram showing a method of fixing a substrate according to an embodiment; FIG. 3 is a side view showing a conventional board fixing method. In the figure, 1 is the board, 1a is a reference hole; 3 is [Okidai, 14 is a clamper 14-1 is the base, I4-2 is the reference pin, 14-3 is a regulation claw, 14-4 is an air cylinder, 15 is a drive mechanism; shows.

Claims (3)

[Claims] (1) Reference hole (1) drilled in the printed wiring board (1)
A plurality of clampers (14-2), each having a reference pin (14-2) that engages with the reference hole (1a), is installed at a position corresponding to a).
14), and the clamper (14) is driven in a radial direction with respect to the printed wiring board (1) engaged with the reference pin (14-2). . (2) The one fixed reference pin (14-2) and at least three clampers (14) correspond to the reference hole (1a) drilled in the square of the printed wiring board (1). the printed wiring board (1)
2. The method of fixing a substrate according to claim 1, further comprising driving said clamper (14) in a radial direction relative to said clamper (14). (3) In the clamper (14), the reference pin (
3. The method of fixing a board according to claim 1, further comprising a regulating claw (14-3) for regulating the position of each end face of the printed wiring board (1) engaged with the printed wiring board (14-2).