JPH0226382B2 - - Google Patents

Info

Publication number
JPH0226382B2
JPH0226382B2 JP3667185A JP3667185A JPH0226382B2 JP H0226382 B2 JPH0226382 B2 JP H0226382B2 JP 3667185 A JP3667185 A JP 3667185A JP 3667185 A JP3667185 A JP 3667185A JP H0226382 B2 JPH0226382 B2 JP H0226382B2
Authority
JP
Japan
Prior art keywords
wafer
chucks
chuck
state
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3667185A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61198644A (ja
Inventor
Kenichi Kinoshita
Wataru Ookase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Sagami Ltd
Original Assignee
Tokyo Electron Sagami Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Sagami Ltd filed Critical Tokyo Electron Sagami Ltd
Priority to JP3667185A priority Critical patent/JPS61198644A/ja
Publication of JPS61198644A publication Critical patent/JPS61198644A/ja
Publication of JPH0226382B2 publication Critical patent/JPH0226382B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
JP3667185A 1985-02-27 1985-02-27 ウエハの移し替え方法 Granted JPS61198644A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3667185A JPS61198644A (ja) 1985-02-27 1985-02-27 ウエハの移し替え方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3667185A JPS61198644A (ja) 1985-02-27 1985-02-27 ウエハの移し替え方法

Publications (2)

Publication Number Publication Date
JPS61198644A JPS61198644A (ja) 1986-09-03
JPH0226382B2 true JPH0226382B2 (h) 1990-06-08

Family

ID=12476315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3667185A Granted JPS61198644A (ja) 1985-02-27 1985-02-27 ウエハの移し替え方法

Country Status (1)

Country Link
JP (1) JPS61198644A (h)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0185326U (h) * 1987-11-26 1989-06-06
JP5434769B2 (ja) * 2010-04-21 2014-03-05 株式会社Ｉｈｉ 把持装置と方法
CN103236414B (zh) * 2013-05-17 2015-09-30 嘉兴景焱智能装备技术有限公司 晶圆固定装置

Also Published As

Publication number Publication date
JPS61198644A (ja) 1986-09-03

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