JPH0226382B2 - - Google Patents
Info
- Publication number
- JPH0226382B2 JPH0226382B2 JP3667185A JP3667185A JPH0226382B2 JP H0226382 B2 JPH0226382 B2 JP H0226382B2 JP 3667185 A JP3667185 A JP 3667185A JP 3667185 A JP3667185 A JP 3667185A JP H0226382 B2 JPH0226382 B2 JP H0226382B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- chucks
- chuck
- state
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 claims description 71
- 238000000034 method Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 7
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Manipulator (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、ウエハの移し替え方法に係り、特
にキヤリヤカセツトなどに収容したウエハを、他
の容器、例えば石英ボートに移し替えるのに用い
られる。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method for transferring wafers, and is particularly applicable to transferring wafers housed in a carrier cassette or the like to another container, such as a quartz boat. It will be done.
（従来の技術）
容器に収容したウエハは、その処理工程中、何
回か他の容器に移し替えられて処理される。この
処理は、例えば特開昭50−32888号公報に記載さ
れている通りである。(Prior Art) Wafers housed in a container are transferred to other containers several times during the processing process. This process is as described in, for example, Japanese Patent Laid-Open No. 50-32888.
従来、このウエハの移し替えは、第８図に示す
様に、２つのチヤツク１，２のウエハ溝１ａ，２
ａを対向せしめ、このチヤツク１，２を矢印Ａ３
方向に平行移動させて、ウエハ４を掬いながらウ
エハ溝１ａ，２ａに収容し、一点鎖線の状態に
し、この状態でチヤツク１，２を他の容器上に移
動した後、前記チヤツク１，２を矢印Ａ３方向と
逆方向に平行移動せしめ、チヤツク１，２を開い
てウエハ４を開放することにより行つている。こ
れらの具体的構成は、多数提案されているが、例
示すれば、特開昭56−43718号公報に開示されて
いる。 Conventionally, this wafer transfer was carried out using the wafer grooves 1a and 2 of the two chucks 1 and 2, as shown in FIG.
a to face each other, and connect these chucks 1 and 2 to arrow A3.
The wafers 4 are scooped up and placed in the wafer grooves 1a and 2a, as shown by the dashed line, and in this state, the chucks 1 and 2 are moved onto another container, and then the chucks 1 and 2 are This is done by moving the wafer in parallel in the direction opposite to the direction of arrow A3, opening the chucks 1 and 2, and releasing the wafer 4. Although many specific configurations have been proposed, one example is disclosed in Japanese Patent Application Laid-Open No. 56-43718.
（発明が解決しようとする課題）
従来の方法では、ウエハが４インチ、５イン
チ、６インチ、８インチと大型になるにつけ、ウ
エハ４を掬うため、ウエハ４の上端４ａ及び下端
４ｂが押上げ器に形成される溝の幅範囲で前後に
倒れて立設する。(Problem to be Solved by the Invention) In the conventional method, as the wafer becomes larger, such as 4 inches, 5 inches, 6 inches, and 8 inches, the wafer 4 is scooped out, so the upper end 4a and lower end 4b of the wafer 4 are pushed up. It is erected by falling back and forth within the width of the groove formed in the vessel.
この倒れの具合は、ウエハ径が大きくなればな
る程上方で大きな位置差となつて生ずる。 The larger the wafer diameter, the larger the positional difference above the wafer.
これに対して、チヤツク１，２の溝１ａ，２ａ
のピツチは正しい位置として形成されている。従
つて、把持操作した際、上記従来の技術による把
持ではウエハを破損するという改善要望点があつ
た。 On the other hand, grooves 1a and 2a of chucks 1 and 2
The pitch is formed in the correct position. Therefore, when the wafer is gripped by the above-mentioned conventional technique, the wafer is damaged, and there is a need for improvement.
又、ウエハ径が小さい場合には、ウエハ４は、
２つの支持点５，６で支持されるだけなので、ウ
エハ４が、傾斜した状態で支持されることがあ
る。この状態で他の容器、例えば、石英ボートの
ウエハ溝にウエハを移し替えるのは、困難であ
る。 Moreover, when the wafer diameter is small, the wafer 4 is
Since the wafer 4 is supported only by the two support points 5 and 6, the wafer 4 may be supported in an inclined state. In this state, it is difficult to transfer the wafer to another container, for example, a wafer groove in a quartz boat.
本発明は、上記の点に鑑み、ウエハを垂直状態
に保持しながら円滑にウエハの移し替えをするこ
とを目的とする。 SUMMARY OF THE INVENTION In view of the above points, an object of the present invention is to smoothly transfer wafers while maintaining the wafers in a vertical state.
（問題点を解決するための手段）
この発明は、２つのチヤツクのウエハ溝を対向
させ、該チヤツク間を小さくしてウエハを保持し
ウエハを移し替えるウエハの移し替え方法におい
て、前記チヤツク対向間の上部間隔を下部間隔よ
り大きくして、チヤツクを傾斜させた状態で前記
チヤツク対向間隔を小さくして前記チヤツクの下
部を、ウエハに嵌合せしめた後、前記上部間隔が
狭ばまる方向にチヤツクを円弧運動させながら垂
直状にしてウエハをチヤツクし、移し替えること
を特徴とする。(Means for Solving the Problems) The present invention provides a wafer transfer method in which the wafer grooves of two chucks are opposed to each other, and the gap between the chucks is made small to hold the wafer and transfer the wafer. The top gap is made larger than the bottom gap, the gap between the chucks is made smaller while the chuck is tilted, and the bottom part of the chuck is fitted onto the wafer. The wafer is chucked and transferred vertically while moving in an arc.
（作用）
夫々のチヤツクを近接する方向に移動し、チヤ
ツクの下部をウエハの下部に嵌合させて、この下
部と突き上げ装置の溝とでウエハを立設した後、
前記チヤツクの上部間隔が狭まる方向にチヤツク
を円弧運動させて垂直状にし、正しく立設したウ
エハの上部に各チヤツクを当接させるので、ウエ
ハが相当の角度傾斜しても、ウエハの挟持を可能
としている。(Function) After moving each chuck in a direction close to each other, fitting the lower part of the chuck to the lower part of the wafer, and setting the wafer upright between the lower part and the groove of the pushing up device,
The chucks are moved in a circular arc in the direction where the distance between the tops of the chucks becomes narrower, making them vertical, and each chuck is brought into contact with the top of a correctly placed wafer, so even if the wafer is tilted at a considerable angle, the wafer can be held. It is said that
（実施例）
本発明の実施例を添付図面により説明する。図
において、１０はウエハ、１１，１２は、内面に
ウエハ溝１３，１４を形成したチヤツクで、２つ
のチヤツク１１，１２のウエハ溝１３，１４は、
対向している。上記チヤツク１１，１２間の上部
１１ｂ，１２ｂ間隔ｄは、下部１１ａ，１２ａ間
隔Ｄより大きく形成され各チヤツク１１，１２
は、垂線に対して角度θ傾斜している。上記チヤ
ツク１１，１２の操作アームのみについて説明す
れば、例えば、特開昭56−43718号公報第４図に
示した構造でよい。即ち、各チヤツク１１，１２
は、図示しない駆動装置により、両者１１，１２
の間隔を大きくしたり、又は、小さくしたりする
平行運動および角度θ回転してチヤツクを垂直状
にする円弧運動を行いウエハ１０をチヤツクす
る。カセツト（図示せず）に収容したウエハ１０
を突き上げ装置（図示せず）により突き上げ、チ
ヤツク１１，１２間に供給すると、図示しない駆
動装置により、第２図に示すチヤツク１１，１２
が角度θを維持して、チヤツク間の間隔ｄ，Ｄを
狭める方向、即ち、Ａ１１，Ａ１２方向に平行移
動し、ウエハ溝１３，１４の下部１３ａ，１４ａ
にウエハ周縁の下部１０ａ，１０ｂが嵌合され、
第３図の状態となる。(Example) An example of the present invention will be described with reference to the accompanying drawings. In the figure, 10 is a wafer, 11 and 12 are chucks with wafer grooves 13 and 14 formed on their inner surfaces, and the wafer grooves 13 and 14 of the two chucks 11 and 12 are
They are facing each other. The distance d between the upper portions 11b and 12b between the chucks 11 and 12 is larger than the distance D between the lower portions 11a and 12a.
is inclined at an angle θ with respect to the perpendicular. If only the operating arms of the chucks 11 and 12 are explained, the structure shown in FIG. 4 of Japanese Patent Application Laid-open No. 56-43718, for example, may be used. That is, each chuck 11, 12
Both 11 and 12 are driven by a drive device (not shown).
The wafer 10 is chucked by a parallel motion to increase or decrease the interval between the chucks and an arcuate motion to rotate the chuck by an angle θ to make the chuck vertical. Wafer 10 housed in a cassette (not shown)
is pushed up by a pushing up device (not shown) and supplied between the chucks 11 and 12, and then a driving device (not shown) pushes up the chucks 11 and 12 shown in FIG.
maintains the angle θ and moves in parallel in the direction of narrowing the distance d and D between the chucks, that is, in the A11 and A12 directions, and the lower portions 13a and 14a of the wafer grooves 13 and 14
The lower portions 10a and 10b of the wafer periphery are fitted into the wafer, and
The state shown in Figure 3 will be reached.
上記下部１０ａ，１０ｂは、上記突き上げ装置
の溝に近いためウエハが傾斜しても、ずれ量は最
小となり、大口径ウエハでも良好な把持を可能と
する。 Since the lower portions 10a and 10b are close to the grooves of the pushing-up device, even if the wafer is tilted, the amount of deviation is minimized, and even large-diameter wafers can be gripped well.
次に、図示しない駆動装置によりチヤツク１
１，１２を、その上部間隔ｄが挟まる方向、即ち
矢印Ａ２１，Ａ２２方向に角度θ回転させ、第１
図第４図に示すようにチヤツク１１，１２を垂直
状にする。この時、ウエハ１０は、ウエハ溝１
３，１４に案内され、その位置を調整しながら、
ウエハ溝１３，１４の所定位置に納まり、４つの
支持点２３〜２６により支持されて、垂直状に保
持される。特開昭56−43718のアーム動作の逆操
作を実行する。 Next, the chuck 1 is turned on by a drive device (not shown).
1 and 12 are rotated by an angle θ in the direction in which the upper distance d is sandwiched between them, that is, in the direction of arrows A21 and A22, and the first
As shown in FIG. 4, the chucks 11 and 12 are made vertical. At this time, the wafer 10 is placed in the wafer groove 1.
While being guided by 3 and 14 and adjusting the position,
It fits into a predetermined position in the wafer grooves 13 and 14, is supported by four support points 23 to 26, and is held vertically. Execute the reverse operation of the arm operation of JP-A-56-43718.
この状態で、チヤツク１１，１２を他の容器、
例えば、石英ボート（図示せず）の上部に移動
し、両者１１，１２の間隔を広げる方向、即ち、
矢印Ａ２７，Ａ２８方向に平行移動し第５図の状
態にし、ウエハ１０をチヤツク１１，１２から開
放し、石英ボートに収容する。 In this state, move chucks 11 and 12 to another container,
For example, move to the top of a quartz boat (not shown) and widen the distance between both 11 and 12, that is,
The wafer 10 is moved in parallel in the directions of arrows A27 and A28 to the state shown in FIG. 5, and the wafer 10 is released from the chucks 11 and 12 and placed in a quartz boat.
その後、第６図に示す様にチヤツク１１，１２
を更に矢印Ａ２７，Ａ２８方向に平行移動すると
共に、角度θ円弧運動せしめ、チヤツク間の上部
間隔ｄを下部間隔Ｄより大きく形成し、チヤツク
１１，１２を傾斜させ、元の状態即ち第２図の状
態に戻す。 After that, as shown in FIG.
is further translated in parallel in the directions of arrows A27 and A28, and is also moved in an arc by an angle θ, so that the upper gap d between the chucks is made larger than the lower gap D, and the chucks 11 and 12 are tilted to return to their original state, that is, as shown in FIG. Return to state.
上記駆動装置は当業者においては説明するまで
もないが、例示すれば第７図の通りである。 Although it is unnecessary for those skilled in the art to explain the above-mentioned driving device, an example thereof is shown in FIG. 7.
即ち、各チヤツク１１，１２の上方に夫々回動
自在にシリンダ７１，７２を接続して、θ角度調
整し、チヤツク１１，１２の平行移動は操作軸７
３，７４に螺合する係合軸７５，７６、回転軸７
７，７８、モータ７９，８０に接続される。 That is, cylinders 71 and 72 are rotatably connected above each chuck 11 and 12 to adjust the θ angle, and the parallel movement of chucks 11 and 12 is controlled by the operation shaft 7.
Engagement shafts 75, 76 and rotation shaft 7 screwed into 3, 74
7, 78, and motors 79, 80.
即ちモータ７９，８０の回転により回転軸７
７，７８を回転させ、螺合結合の係合軸７５，７
６を介して操作軸７３，７４を直線移動させるこ
とによりチヤツク１１，１２を開閉駆動する。 That is, the rotation shaft 7 is rotated by the rotation of the motors 79 and 80.
7 and 78, and the engagement shafts 75 and 7 of the threaded connection are rotated.
The chucks 11 and 12 are driven to open and close by linearly moving the operating shafts 73 and 74 through the shafts 6.
さらにチヤツク１１，１２の上下動は支持台８
１を支持軸８２と螺合結合するモータ８３により
操作すればよい。 Furthermore, the vertical movement of the chucks 11 and 12 is controlled by the support stand 8.
1 may be operated by a motor 83 which is threadedly connected to a support shaft 82.
本発明は、チヤツク間の上部間隔を下部間隔よ
り大きくしてチヤツクを傾斜せしめ、このチヤツ
クを平行移動させて、ウエハ溝の下部にウエハを
嵌合せしめた後、前記上部間隔が狭まる方向にチ
ヤツクを円弧運動させながら垂直状にするので、
ウエハは、ウエハ溝に案内され、その位置を調整
しながらウエハ溝の所定位置に納まる。従つて、
大口径ウエハの移し替えを可能とする。
In the present invention, the chucks are tilted by making the upper interval between the chucks larger than the lower interval, and the chucks are moved in parallel to fit the wafer in the lower part of the wafer groove, and then the chucks are moved in the direction in which the upper interval becomes narrower. Since it is made vertical while moving in an arc,
The wafer is guided into the wafer groove, and its position is adjusted until it fits into a predetermined position in the wafer groove. Therefore,
Enables transfer of large diameter wafers.
第１図〜第６図は、本発明の実施例を示す側面
図で、第１図は、チヤツクが円弧運動にて垂直状
となる状態を示す図、第２図は、チヤツクが始動
する前の状態を示す図、第３図は、チヤツクのウ
エハ溝下部にウエハが嵌合した状態を示す図、第
４図は、ウエハが完全に保持された状態を示す
図、第５図は、チヤツクがウエハを開放した状態
を示す図、第６図、ウエハ移し替え完了時の状態
を示す図、第７図は駆動装置の一例を説明する
図、第８図は、従来例を示す側面図である。
１０……ウエハ、１１，１２……チヤツク、１
３，１４……ウエハ溝。
1 to 6 are side views showing an embodiment of the present invention. FIG. 1 is a diagram showing a state in which the chuck moves in a circular arc and becomes vertical, and FIG. 2 is a diagram showing the chuck before it starts. 3 is a diagram showing a state where the wafer is fitted into the lower part of the wafer groove of the chuck, FIG. 4 is a diagram showing the state where the wafer is completely held, and FIG. 5 is a diagram showing the state where the wafer is completely held. 6 is a diagram showing the state when wafer transfer is completed, FIG. 7 is a diagram illustrating an example of a drive device, and FIG. 8 is a side view showing a conventional example. be. 10...Wafer, 11,12...Chick, 1
3, 14...Wafer groove.
Claims (1)
ヤツク間を小さくしてウエハを保持し、ウエハを
移し替えるウエハの移し替え方法において、前記
チヤツク対向間の上部間隔を下部間隔より大きく
して、チヤツクを傾斜させた状態で前記チヤツク
対向間隔を小さくして、前記チヤツクの下部をウ
エハに嵌合せしめた後、前記上部間隔が狭まる方
向にチヤツクを円弧運動させながら垂直状にし
て、ウエハをチヤツクしウエハを移し替えること
を特徴とするウエハの移し替え方法。1. A wafer transfer method in which the wafer grooves of two chucks are opposed to each other, the gap between the chucks is made small to hold the wafer, and the wafer is transferred. After reducing the opposing gap between the chucks while tilting the chuck and fitting the lower part of the chuck to the wafer, the chuck is moved in an arc in the direction in which the upper gap is narrowed, and the chuck is vertically moved to chuck the wafer. A wafer transfer method characterized by transferring wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3667185A JPS61198644A (en) | 1985-02-27 | 1985-02-27 | Method of wafer replacement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3667185A JPS61198644A (en) | 1985-02-27 | 1985-02-27 | Method of wafer replacement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61198644A JPS61198644A (en) | 1986-09-03 |
| JPH0226382B2 true JPH0226382B2 (en) | 1990-06-08 |
Family
ID=12476315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3667185A Granted JPS61198644A (en) | 1985-02-27 | 1985-02-27 | Method of wafer replacement |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61198644A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5434769B2 (en) * | 2010-04-21 | 2014-03-05 | 株式会社Ｉｈｉ | Gripping device and method |
| CN103236414B (en) * | 2013-05-17 | 2015-09-30 | 嘉兴景焱智能装备技术有限公司 | Wafer mounting apparatus |
-
1985
- 1985-02-27 JP JP3667185A patent/JPS61198644A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61198644A (en) | 1986-09-03 |
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