CN103236414B - Wafer mounting apparatus - Google Patents
Wafer mounting apparatus Download PDFInfo
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- CN103236414B CN103236414B CN201310184451.0A CN201310184451A CN103236414B CN 103236414 B CN103236414 B CN 103236414B CN 201310184451 A CN201310184451 A CN 201310184451A CN 103236414 B CN103236414 B CN 103236414B
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- plate
- movable plate
- limiting plate
- inner arc
- mounting apparatus
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Abstract
The present invention relates to integrated circuit (IC) chip processing technology field, disclose a kind of wafer mounting apparatus, comprise loading plate, limiting plate and movable plate, have circular hole and optical glass is set in the middle of loading plate, limiting plate is semi-circular shape, limiting plate is fixedly installed on the first side of loading plate, movable plate is arranged on the second side of loading plate, the internal diameter of movable plate is equal with the internal diameter of limiting plate, in the second side of loading plate, gathering sill and fixed part are set, movable plate can be moved by guide in gathering sill, the moving direction of movable plate is the line direction of the mid point of the mid point of the Inner arc of limiting plate and the Inner arc of movable plate, movable plate can be fixed on a certain position by fixed part, the edge of the Inner arc of limiting plate and movable plate is provided with trim ring.The present invention, by side compressing mode, makes crystal column surface injury-free.
Description
Technical field
The present invention relates to integrated circuit (IC) chip processing technology field, particularly a kind of wafer mounting apparatus.
Background technology
CIS chip is a kind of image-signal processor chip, and this chip aims at image sensor chip, and it processes the light (image) accepted, and is widely used in scanner, facsimile machine, Digital Video, camera.The test of the wafer of CIS chip is completed by becoming survey machine, in test process, wafer to be fixed and implement optic test, existing fixed form is pressed on fixed mount by pressing by wafer, because the required precision of wafer is high, the existing mode that is fixed is easy to produce physical injury to wafer, causes the waste of wafer.
Summary of the invention
The object of the invention is, in order to solve the problems of the technologies described above, to provide a kind of wafer mounting apparatus, to wafer can be fixed quickly and safely, to test wafer.
The technical scheme that the present invention takes is:
A kind of wafer mounting apparatus, it is characterized in that, comprise loading plate, limiting plate and movable plate, circular hole is had in the middle of described loading plate, annular standing groove is provided with at the edge of described circular hole, in described annular standing groove, optical glass is set, described limiting plate is semi-circular shape, described limiting plate is fixedly installed on the first side of described loading plate, the radian of the Inner arc of described limiting plate is less than 180 degree, the Inner arc of described limiting plate is positioned at the top of described optical glass, the internal diameter of described limiting plate is less than the radius of described circular hole, described movable plate is arranged on the second side of described loading plate, described movable plate is semi-circular shape, the radian of the Inner arc of described movable plate is less than 180 degree, the Inner arc of described movable plate is positioned at the top of described optical glass, the internal diameter of described movable plate is equal with the internal diameter of described limiting plate, in the second side of described loading plate, gathering sill and fixed part are set, described movable plate can be moved by guide in described gathering sill, the moving direction of described movable plate is the line direction of the mid point of the mid point of the Inner arc of described limiting plate and the Inner arc of described movable plate, described movable plate can be fixed on a certain position by described fixed part, the edge of the Inner arc of described limiting plate and described movable plate is provided with trim ring.
Further, be also provided with groove at the edge of the Inner arc of described limiting plate and described movable plate, described groove is arranged on the below of described trim ring, and the height of described groove is less than the thickness of wafer.
Further, described gathering sill and guide are respectively multiple, are symmetricly set on the both sides of the symmetry axis of described movable plate.
Further, described fixed part is the steady pin being arranged on described loading plate second side side.
Further, in described steady pin, be provided with tension spring, described tension spring make described steady pin to described movable plate produce one to described loading plate first side to pressure.
Further, described steady pin is two, is symmetricly set in the both sides of the symmetry axis of described movable plate.
Further, the line in the center of circle of the circular hole in the middle of the center of circle of the Inner arc of described limiting plate and described loading plate is perpendicular to the surface of described loading plate.
The invention has the beneficial effects as follows:
(1) by side compressing mode, make crystal column surface injury-free;
(2) groove limit method makes wafer accurately locate, and avoids mobile wearing and tearing;
(3) fixed form of spring locking, reduces the stress deformation of wafer.
Accompanying drawing explanation
Accompanying drawing 1 is front view of the present invention;
Accompanying drawing 2 is rearview of the present invention;
Accompanying drawing 3 is the partial enlarged drawing of the A of accompanying drawing 2.
Mark in accompanying drawing is respectively:
1. loading plate; 2. circular hole;
3. annular standing groove; 4. optical glass;
5. limiting plate; 6. movable plate;
7. gathering sill; 8. guide;
9. steady pin; 10. trim ring;
11. grooves.
Embodiment
Elaborate below in conjunction with the embodiment of accompanying drawing to wafer mounting apparatus of the present invention.
See accompanying drawing 1, 2, loading plate 1 is round-shaped for being similar to, also other shape can be designed to, it is made to be conducive to by becoming survey machine to test, the centre of loading plate 1 has circular hole 2, annular standing groove 3 is provided with at the edge of circular hole 2, in annular standing groove 3, optical glass 4 is set, in the first side of loading plate 1, namely the left side in Fig. 1, be fixedly installed limiting plate 5, limiting plate 5 is in semi-circular shape, the radian of its Inner arc is less than 180 degree, the Inner arc of limiting plate 5 is positioned at the top of optical glass 4, the internal diameter of limiting plate 5 is less than the radius of circular hole 2, preferably, the line in the center of circle of the circular hole 2 in the middle of the center of circle of the Inner arc of limiting plate 5 and loading plate 1 is perpendicular to the surface of loading plate 1.In the second side of loading plate 1, namely the right side in Fig. 1, movable plate 6 is set, movable plate 6 is in semi-circular shape, the radian of its Inner arc is less than 180 degree, the Inner arc of movable plate 6 is positioned at the top of optical glass 4, and the internal diameter of movable plate 6 is less than the radius of circular hole 2, and the internal diameter of movable plate 6 is equal with the internal diameter of limiting plate 5.On the right side of loading plate 1 or both sides, gathering sill 7 is set, gathering sill is laterally, movable plate 6 can be moved by the guide 8 be fixedly installed thereon in gathering sill 7, the moving direction of movable plate 6 is the transverse direction in figure, the i.e. line direction of the mid point of the mid point of the Inner arc of limiting plate 5 and the Inner arc of movable plate 6, at the right side side of loading plate 1, steady pin 9 is set, steady pin 9 is two, be symmetrical in the symmetry axis of movable plate 6, steady pin is used for fixing movable plate 6, wafer to be measured is positioned on the optical glass 4 in circle 2, by the transverse shifting of movable plate 7, wafer is stuck between limiting plate 5 and movable plate 6, at this moment by steady pin 9, movable plate 6 is fixed, wafer is caused to be stably fixed.In steady pin 9, be provided with tension spring (not shown), tension spring makes steady pin 9 pairs of movable plates produce the pressure to loading plate left direction.It is firm that suitable spring force can not only ensure that wafer is fixed, and can not damage wafer again.Trim ring 10 and groove 11(is provided with see accompanying drawing 3 at the edge of the Inner arc of limiting plate 5 and movable plate 6), groove 11 is arranged at the below of trim ring 10, and both all can select the soft materials such as rubber, and the height of groove 11 is less than the thickness of wafer.When being fixed wafer, groove 11 first carries out spacing to wafer, then by the movement of movable plate 6, makes trim ring carry out side compressing to wafer and fixes.Because the internal diameter circular arc of the movable plate 6 of limiting plate 5 is all less than 180 degree, therefore, when both close up, can fix the wafer that radius is less than their internal diameters, the wafer even slightly larger than their internal diameters also can be fixed.
Continuation see accompanying drawing use procedure of the present invention is, pull-out steady pin 9, after movable plate 6 is moved to the right, wafer placed by optical glass 4, movable plate 6 is moved to the left, profile of tooth 10 pushes steady pin 9 after wafer being positioned at certain position of optical glass 4, and wafer is pressed between limiting plate 5 and movable plate 6 by trim ring 10.The device fixing wafer being delivered to wafer becomes survey machine to detect, and after having detected, is pulled out by steady pin 9, is removed to the right by movable plate 6, take off and survey wafer, replace with the wafer do not tested.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (7)
1. a wafer mounting apparatus, it is characterized in that: comprise loading plate, limiting plate and movable plate, circular hole is had in the middle of described loading plate, annular standing groove is provided with at the edge of described circular hole, in described annular standing groove, optical glass is set, described limiting plate is semi-circular shape, described limiting plate is fixedly installed on the first side of described loading plate, the radian of the Inner arc of described limiting plate is less than 180 degree, the Inner arc of described limiting plate is positioned at the top of described optical glass, the internal diameter of described limiting plate is less than the radius of described circular hole, described movable plate is arranged on the second side of described loading plate, described movable plate is semi-circular shape, the radian of the Inner arc of described movable plate is less than 180 degree, the Inner arc of described movable plate is positioned at the top of described optical glass, the internal diameter of described movable plate is equal with the internal diameter of described limiting plate, in the second side of described loading plate, gathering sill and fixed part are set, described movable plate can be moved by guide in described gathering sill, the moving direction of described movable plate is the line direction of the mid point of the mid point of the Inner arc of described limiting plate and the Inner arc of described movable plate, described movable plate can be fixed on a certain position by described fixed part, the edge of the Inner arc of described limiting plate and described movable plate is provided with trim ring.
2. wafer mounting apparatus according to claim 1, is characterized in that: be also provided with groove at the edge of the Inner arc of described limiting plate and described movable plate, described groove is arranged on the below of described trim ring, and the height of described groove is less than the thickness of wafer.
3. wafer mounting apparatus according to claim 1 and 2, is characterized in that: described gathering sill and guide are respectively multiple, is symmetricly set on the both sides of the symmetry axis of described movable plate.
4. wafer mounting apparatus according to claim 1 and 2, is characterized in that: described fixed part is the steady pin being arranged on described loading plate second side side.
5. wafer mounting apparatus according to claim 4, is characterized in that: be provided with tension spring in described steady pin, described tension spring make described steady pin to described movable plate produce one to described loading plate first side to pressure.
6. wafer mounting apparatus according to claim 4, is characterized in that: described steady pin is two, is symmetricly set in the both sides of the symmetry axis of described movable plate.
7. wafer mounting apparatus according to claim 1 and 2, is characterized in that: the line in the center of circle of the circular hole in the middle of the center of circle of the Inner arc of described limiting plate and described loading plate is perpendicular to the surface of described loading plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310184451.0A CN103236414B (en) | 2013-05-17 | 2013-05-17 | Wafer mounting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310184451.0A CN103236414B (en) | 2013-05-17 | 2013-05-17 | Wafer mounting apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN103236414A CN103236414A (en) | 2013-08-07 |
| CN103236414B true CN103236414B (en) | 2015-09-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310184451.0A Active CN103236414B (en) | 2013-05-17 | 2013-05-17 | Wafer mounting apparatus |
Country Status (1)
| Country | Link |
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| CN (1) | CN103236414B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104701231B (en) * | 2013-12-09 | 2018-06-22 | 旺宏电子股份有限公司 | Wafer jig |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61198644A (en) * | 1985-02-27 | 1986-09-03 | Teru Saamuko Kk | Method of wafer replacement |
| CN201298548Y (en) * | 2008-09-11 | 2009-08-26 | 英华达（上海）科技有限公司 | Fixing device of stack structure of semiconductor packaging body |
| CN203288574U (en) * | 2013-05-17 | 2013-11-13 | 嘉兴景焱智能装备技术有限公司 | Wafer fixing device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10131673A1 (en) * | 2001-06-29 | 2003-01-30 | Infineon Technologies Ag | Carrier for a wafer |
-
2013
- 2013-05-17 CN CN201310184451.0A patent/CN103236414B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61198644A (en) * | 1985-02-27 | 1986-09-03 | Teru Saamuko Kk | Method of wafer replacement |
| CN201298548Y (en) * | 2008-09-11 | 2009-08-26 | 英华达（上海）科技有限公司 | Fixing device of stack structure of semiconductor packaging body |
| CN203288574U (en) * | 2013-05-17 | 2013-11-13 | 嘉兴景焱智能装备技术有限公司 | Wafer fixing device |
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| Publication number | Publication date |
|---|---|
| CN103236414A (en) | 2013-08-07 |
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Effective date of registration: 20220209 Address after: 226400 No. 1, Jinshan Road, juegang street, Rudong County, Nantong City, Jiangsu Province (floors 3-4, building 6, Semiconductor Industrial Park) Patentee after: Jingyan (Jiangsu) Intelligent Equipment Co.,Ltd. Address before: 314100 rooms 1D and 1E, building 3, No. 2188, Jiashan Avenue, Dayun Town, Jiashan County, Jiaxing City, Zhejiang Province Patentee before: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. |