CN201298548Y

CN201298548Y - Fixing device of stack structure of semiconductor packaging body

Info

Publication number: CN201298548Y
Application number: CNU2008201529949U
Authority: CN
Inventors: 唐先俊
Original assignee: Inventec Appliances Pudong Corp
Current assignee: Inventec Appliances Pudong Corp
Priority date: 2008-09-11
Filing date: 2008-09-11
Publication date: 2009-08-26
Anticipated expiration: 2018-09-11

Abstract

The utility model provides a fixing device of a stack structure of a semiconductor packaging body. The fixing device comprises a machine table, a first fixing part, a second fixing part and a third fixing part, wherein, the machine table comprises a bearing part; the stack structure of the semiconductor packaging body can be placed on the bearing part; the first fixing part is positioned on the machine table and can move in a first direction; the second fixing part is positioned on the machine table and can move in a second direction; and the third fixing part is positioned on the machine table, opposite to the second fixing part, and can move in a third direction. The first fixing part, the second fixing part and the third fixing part respectively press a first surface, a second surface and a third surface of the stack structure of the semiconductor packaging body, so as to fixing the stack structure of the semiconductor packaging body on a maintenance table to solve the conditions that contraposition can not be achieved and deviation occurs.

Description

The fixture of overlapping structure for semiconductor encapsulation body

Technical field

The utility model relates to a kind of fixture, relates in particular to the fixture that is used for fixing overlapping structure for semiconductor encapsulation body.

Background technology

Lifting rapidly along with product functions such as computer and network communications, semiconductor technology need satisfy the requirement of diversification, portable and frivolous microminiaturization, and the wafer packaging industry must be developed towards high precision processing procedures such as high power, high density, light, thin and microminiaturizations.In addition, Electronic Packaging still need possess characteristics such as high-reliability, good heat conductive performance, being used to transmit signal, electric energy, and provides good heat radiation approach and effects such as structural defence and support.

At present, (Package on Package is a kind of typical encapsulating structure PoP) to laminate packaging, and the packaging body that two individual packages are finished is piled up with process technique.PoP is that superimposed in the surface-assembled mode again, it can reduce the processing procedure risk by independently two packaging bodies are after packaging and testing, and then improves the product yield.Fig. 1, Fig. 2 are respectively the schematic perspective view and the generalized section of overlapping structure for semiconductor encapsulation body in the prior art.As shown in Figure 1, 2, electric connection place at two

packaging bodies

10,20 is provided with distance piece 30 and utilizes surface installation technique (surface mount technology, SMT) together with 10,20 weldings of two packaging bodies, thus formation packaging body stacked structure (Package on Package, PoP).Wherein, the conductive connecting pin 32 on the distance piece 30 is corresponding one by one with

12,22 on the

packaging body

10,20.

Separating two

packaging bodies

10,20 must carry out in heating process, therefore, when the maintenance overlapping structure for semiconductor encapsulation body, generally all adopts the fixedly contraposition of mode of artificial adhesive tape of paste.Yet artificial adhesive tape of paste is the mode of contraposition fixedly, and effectively fixing packaging body stacked structure often, and in addition precisely contraposition easily cause contact to damage and whole assembly is damaged in case depart from.

The utility model content

In order to solve the above-mentioned problems in the prior art, a purpose of the present utility model has provided a kind of fixture of overlapping structure for semiconductor encapsulation body, can't contraposition after fixing on the maintenance platform and situation about departing to solve overlapping structure for semiconductor encapsulation body.

In order to achieve the above object, the utility model provides a kind of fixture of overlapping structure for semiconductor encapsulation body, and it comprises board, first fixed part, second fixed part and the 3rd fixed part.Above-mentioned board comprises supporting part.Overlapping structure for semiconductor encapsulation body can be placed in supporting part.First fixed position is on board, and first fixed part can be towards the first direction displacement.Second fixed position is on board, and second fixed part can be towards the second direction displacement.The 3rd fixed position is faced on board and with second fixed part mutually, and the 3rd fixed part can be towards the third direction displacement.Compress first, second and third of overlapping structure for semiconductor encapsulation body separately respectively by first fixed part, second fixed part and the 3rd fixed part, with fixing overlapping structure for semiconductor encapsulation body.

According to the fixture of overlapping structure for semiconductor encapsulation body of the present utility model, have and include but not limited to following advantage:

(1) fixture of overlapping structure for semiconductor encapsulation body can be utilized the fixed part of three kinds of different directions, with fixing overlapping structure for semiconductor encapsulation body.

(2) fixture of overlapping structure for semiconductor encapsulation body can utilize the fixed part of three kinds of different directions to fix overlapping structure for semiconductor encapsulation body, therefore can conveniently separate and remove overlapping structure for semiconductor encapsulation body.

(3) therefore the fixture of the overlapping structure for semiconductor encapsulation body fixed part fixing overlapping structure for semiconductor encapsulation body automatically that can utilize three kinds of different directions can make whole maintenance activity procedure.

Description of drawings

By reading the following detailed description of non-limiting example being done with reference to accompanying drawing, other features, objects and advantages of the present utility model will become more apparent.For ease of understanding, the same components among the following embodiment is illustrated with identical symbology.

Fig. 1 is the perspective view of overlapping structure for semiconductor encapsulation body in the prior art;

Fig. 2 is the generalized section of overlapping structure for semiconductor encapsulation body in the prior art;

Fig. 3 is the perspective view according to the fixture of the overlapping structure for semiconductor encapsulation body of a specific embodiment of the present utility model;

Fig. 4 is the schematic top plan view according to the fixture of the overlapping structure for semiconductor encapsulation body of a specific embodiment of the present utility model; And

Fig. 5 is the action schematic diagram according to the fixture of the overlapping structure for semiconductor encapsulation body of a specific embodiment of the present utility model.

Embodiment

Fig. 3, Fig. 4 are according to the perspective view of the fixture of the overlapping structure for semiconductor encapsulation body of a specific embodiment of the present utility model and schematic top plan view.As shown in Figure 3, Figure 4, the fixture 5 of overlapping structure for semiconductor encapsulation body comprises board 50, first fixed part 51, second fixed part 52 and the 3rd fixed part 53.Board 50 comprises and is used to keep in repair overlapping structure for semiconductor encapsulation body 4 (Package on Package, maintenance board 50 PoP).Board 50 has supporting part 501.An overlapping structure for semiconductor encapsulation body 4 can be placed in supporting part 501, overlapping structure for semiconductor encapsulation body 4 comprises first packaging body 41 and second packaging body 42, in this embodiment, the side of overlapping structure for semiconductor encapsulation body 4 comprises first 411 of first packaging body, second 412 and the 3rd 413 of first packaging body of first packaging body, and these three can be compressed by first, second and third fixed part of the fixture 5 of overlapping structure for semiconductor encapsulation body (51,52,53) respectively.

First fixed part 51 is positioned on the board 50, first fixed part 51 comprises first guide rail 511 and first guide block 512, first guide block 512 can slide on first guide rail 511, the thickness of first guide block 512 roughly first 411 thickness with first packaging body is identical, first direction 513 displacements that first guide block 512 of first fixed part 51 is guided along first guide rail 511.Second fixed part 52 is positioned on the board 50, second fixed part 52 comprises second guide rail 521 and second guide block 522, second guide block 522 can slide on second guide rail 521, the thickness of second guide block 522 roughly second 412 thickness with first packaging body is identical, second direction 523 displacements that second guide block 522 of second fixed part 52 is guided along second guide rail 521.The 3rd fixed part 53 is positioned on the board 50 and with second fixed part 52 to be faced mutually, the 3rd fixed part 53 comprises the 3rd guide rail 531 and the 3rd guide block 532, the 3rd guide block 532 can slide on the 3rd guide rail 531, the thickness of the 3rd guide block 532 roughly the 3rd 413 thickness with first packaging body is identical, third direction 533 displacements that the 3rd guide block 532 of the 3rd fixed part 53 is guided along the 3rd guide rail 531.

Fig. 5 is the action schematic diagram according to the fixture of the overlapping structure for semiconductor encapsulation body of a specific embodiment of the present utility model.As shown in Figure 5, the fixture 5 of overlapping structure for semiconductor encapsulation body is compressed first 411 of first packaging body of overlapping structure for semiconductor encapsulation body 4, second 412 and the 3rd 413 of first packaging body of first packaging body respectively by the 3rd guide block 532 of second guide block 522 of first guide block 512 of first fixed part 51, second fixed part 52 and the 3rd fixed part 53, in order to overlapping structure for semiconductor encapsulation body 4 is fixed on the board 50.Therefore, when overlapping structure for semiconductor encapsulation body 4 is fixed on the board 50, each pin (PIN) 43 on the overlapping structure for semiconductor encapsulation body 4 can accurately be placed on the predeterminated position, when heating overlapping structure for semiconductor encapsulation body 4, can make things convenient for manually to reach machine and disassemble and separate first packaging body 41 and second packaging body 42, and can make the accurate contraposition overlapping structure for semiconductor encapsulation body 4 of machine to pull out and to keep in repair.If the situation that can't depart from overlapping structure for semiconductor encapsulation body 4 accurate contrapositions will cause heating location to change and disassembles mistake and make contact (PAD) 44 damage because of departing from, and then make expensive assembly damage to scrap.Can make the accurate contraposition overlapping structure for semiconductor encapsulation body 4 of machine pulling out and to keep in repair according to the fixture 5 of the overlapping structure for semiconductor encapsulation body of present embodiment, thereby avoid taking place above-mentioned unfavorable situation.

The above is exemplary and non-limiting embodiment of the present utility model.Anyly do not break away from spirit of the present utility model and category, and, all should be contained within the scope of claims its equivalent modifications of carrying out or change.

The primary clustering symbol description is as follows:

10,20: packaging body;

12,22,32,43: pin (PIN);

30: distance piece;

4: overlapping structure for semiconductor encapsulation body;

41: the first packaging bodies;

The first surface of 411: the first packaging bodies;

Second of 412: the first packaging bodies;

The 3rd of 413: the first packaging bodies;

42: the second packaging bodies;

44: contact (PAD);

5: the fixture of overlapping structure for semiconductor encapsulation body;

50: board;

501: supporting part;

51: the first fixed parts;

511: the first guide rails;

512: the first guide blocks;

513: first direction;

52: the second fixed parts;

521: the second guide rails;

522: the second guide blocks;

523: second direction;

53: the three fixed parts;

531: the three guide rails;

532: the three guide blocks; And

533: third direction.

Claims

1. the fixture of an overlapping structure for semiconductor encapsulation body is characterized in that, the fixture of described overlapping structure for semiconductor encapsulation body comprises:

One board, this board has a supporting part;

One first fixed part, this first fixed position are on this board, and it can be towards a first direction displacement;

One second fixed part, this second fixed position are on this board, and it can be towards a second direction displacement;

One the 3rd fixed part, the 3rd fixed position are faced on this board and with this second fixed part mutually, and it can be towards a third direction displacement;

Wherein, when an overlapping structure for semiconductor encapsulation body is placed in this supporting part, compress first, second and third of this overlapping structure for semiconductor encapsulation body separately respectively by this first fixed part, second fixed part and the 3rd fixed part, to fix this overlapping structure for semiconductor encapsulation body.

2. the fixture of overlapping structure for semiconductor encapsulation body as claimed in claim 1 is characterized in that, wherein this first fixed part comprises one first guide rail, makes this first fixed part along this first direction displacement.

3. the fixture of overlapping structure for semiconductor encapsulation body as claimed in claim 1 is characterized in that, wherein this second fixed part comprises one second guide rail, makes this second fixed part along this second direction displacement.

4. the fixture of overlapping structure for semiconductor encapsulation body as claimed in claim 1 is characterized in that, wherein the 3rd fixed part comprises one the 3rd guide rail, makes the 3rd fixed part along this third direction displacement.

5. the fixture of overlapping structure for semiconductor encapsulation body as claimed in claim 1 is characterized in that, wherein this board is the maintenance board that is used to keep in repair overlapping structure for semiconductor encapsulation body.

6. the fixture of overlapping structure for semiconductor encapsulation body as claimed in claim 1 is characterized in that, wherein this overlapping structure for semiconductor encapsulation body comprises one first packaging body.

7. the fixture of overlapping structure for semiconductor encapsulation body as claimed in claim 6, it is characterized in that, wherein this first packaging body comprises the 3rd of first of one first packaging body, second of one first packaging body and one first packaging body, these three can be respectively by described first fixed part, second and fixed part the 3rd fixed part compress.