CN110743813A - Chip sorting machine - Google Patents
Chip sorting machine Download PDFInfo
- Publication number
- CN110743813A CN110743813A CN201911014940.5A CN201911014940A CN110743813A CN 110743813 A CN110743813 A CN 110743813A CN 201911014940 A CN201911014940 A CN 201911014940A CN 110743813 A CN110743813 A CN 110743813A
- Authority
- CN
- China
- Prior art keywords
- chip
- tray
- chip tray
- workbench
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
Abstract
The invention provides a chip sorting machine, which comprises: a work table; the chip tray bearing plate is arranged at one end of the workbench and used for placing a chip tray filled with chips; the material taking mechanism is arranged at the other end of the workbench and is used for transferring the chip tray and/or the chip; and the detection mechanism is arranged on one side of the chip tray bearing plate, which faces the material taking mechanism, and is used for detecting the chips transferred by the material taking mechanism. The application provides a chip sorting machine has solved the not high technical problem of chip detection efficiency among the prior art.
Description
Technical Field
The invention relates to the field of chip detection, in particular to a chip sorting machine.
Background
As the application range and functional characteristics of chips are enhanced, more and more chips are used in the fields of aerospace, automobiles, ships, industry, and military. Since the chip belongs to a core component of the electronic component, the chip with qualified quality is very important for the electronic component, so that the quality of the chip needs to be detected. However, the chip size is small, so that manual detection is time-consuming, and the detection efficiency of the chip is not high.
Disclosure of Invention
The invention mainly aims to provide a chip sorting machine and aims to solve the technical problem that the chip detection efficiency is low in the prior art.
To achieve the above object, the present application provides a chip handler, including:
a work table;
the chip tray bearing plate is arranged at one end of the workbench and used for placing a chip tray filled with chips;
the material taking mechanism is arranged at the other end of the workbench and is used for transferring the chip tray and/or the chip;
the detection mechanism is arranged on one side, facing the material taking mechanism, of the chip tray bearing plate and is used for detecting the chips transferred by the material taking mechanism.
Optionally, the chip sorter further comprises a chip tray positioning mechanism, the chip tray positioning mechanism is fixed on the workbench and located between the chip tray bearing plate and the detection mechanism, and the chip tray positioning mechanism is used for clamping and positioning the chip tray transferred by the material taking mechanism.
Optionally, the chip tray positioning mechanism comprises:
the substrate is fixed on the workbench and positioned between the chip tray bearing plate and the detection mechanism;
the two fixed limiting parts are arranged at one edge of the substrate, which is far away from the end face of the workbench;
the two movable limiting parts are arranged at the other edge of the base plate, which deviates from the end face of the workbench, and are arranged relative to the base plate in a sliding manner, and the chip tray transferred from the chip tray bearing plate is placed in a space surrounded by the two fixed limiting parts and the two movable limiting parts.
Optionally, the material taking mechanism comprises:
the mounting seat is arranged on the workbench in a sliding mode and slides in the direction close to or far away from the chip tray bearing plate;
the connecting plate is arranged on the mounting seat in a sliding mode along the horizontal direction and is perpendicular to the sliding direction of the mounting seat;
the tray sucker is arranged on the connecting plate in a sliding mode along the vertical direction;
and the chip sucker is arranged in a sliding manner along the vertical direction, and the connecting plate is parallel to the sliding direction of the tray sucker.
Optionally, the material taking mechanism further comprises:
the X-axis screw rod is arranged on the mounting seat and is parallel to the sliding direction of the connecting plate, and the X-axis screw rod is in driving connection with the connecting plate;
the Y-axis screw rod is arranged on the workbench and is parallel to the sliding direction of the mounting seat, and the Y-axis screw rod is connected with the mounting seat in a driving manner;
the first air cylinder is arranged on the connecting plate and is parallel to the movement direction of the material tray sucker, and the first air cylinder is in driving connection with the material tray sucker;
the second cylinder is arranged on the connecting plate and parallel to the sliding direction of the chip sucker, and the second cylinder is in driving connection with the chip sucker.
Optionally, the material taking mechanism further comprises a guide rail, the guide rail is mounted on the workbench, and the mounting seat slides along the guide rail.
Optionally, the detection mechanism includes a strain gauge, and the strain gauge is slidably disposed on the table.
Optionally, the detection mechanism further includes a transfer cylinder, and the transfer cylinder is in driving connection with the strain gauge.
Optionally, the chip sorter further comprises an empty tray bearing plate, the empty tray bearing plate is located on one side of the chip tray positioning mechanism facing the chip tray bearing plate, and the empty tray bearing plate is used for accommodating empty chips transferred from the chip tray positioning mechanism.
Optionally, the workstation is equipped with the perforation, empty charging tray loading board and chip charging tray loading board set up the perforation department, the workstation is equipped with two elevating system from one side of detection mechanism, one the elevating system drive is connected empty charging tray loading board, another the elevating system drive is connected chip charging tray loading board.
Compared with the prior art, according to the technical scheme provided by the invention, the chips in the chip trays on the chip tray bearing plate are transferred to the detection mechanism for quality detection through the arranged material taking mechanism, so that unqualified chips are taken out, the detection of the chips by a machine is adopted, the labor force is saved, the detection efficiency and the accuracy of the detection result are improved, the rejection of electronic elements caused by the use of the unqualified chips is avoided, the production cost is reduced, and the economic benefit is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of a chip sorter according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of a chip tray positioning mechanism in an embodiment of the chip handler of the present invention;
FIG. 3 is a schematic view of a take-off mechanism in an embodiment of the chip handler of the present invention;
FIG. 4 is a schematic view of another embodiment of a material picking mechanism for a chip handler according to the present invention;
FIG. 5 is a schematic structural diagram of a chip tray carrier plate and an empty tray carrier plate in an embodiment of the chip sorter of the present invention;
FIG. 6 is a schematic structural diagram of a detecting mechanism in an embodiment of the chip handler of the present invention.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that all the directional indications (such as up, down, left, right, front, and rear … …) in the embodiment of the present application are only used to explain the relative position relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indication is changed accordingly.
In addition, descriptions in this application as to "first", "second", etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In addition, technical solutions between the various embodiments of the present application may be combined with each other, but it must be based on the realization of the technical solutions by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should be considered to be absent and not within the protection scope of the present application.
As shown in fig. 1, an embodiment of the present invention provides a chip handler, including:
a work table 1;
the chip tray bearing plate 2 is arranged at one end of the workbench 1 and used for placing a chip tray filled with chips;
the material taking mechanism 4 is arranged at the other end of the workbench 1 and is used for transferring chip trays and/or chips;
In the technical scheme that this embodiment adopted, workstation 1 can adopt current style, preferably has the square board of certain thickness, mainly be the mesa that provides a work for the detection of chip, chip charging tray loading board 2 is mainly used for placing the chip charging tray, the shape and size of chip charging tray loading board 2 is corresponding with the chip charging tray, detection mechanism 3 is used for detecting whether qualified quality of chip is qualified, that is to say, distinguish qualified chip and unqualified chip through detection mechanism 3, picking mechanism 4 shifts the chip to detection mechanism 3 through the motion at level and vertical direction and detects, and shift out detection mechanism 3 with unqualified chip after detecting the completion. It can be understood that the detection of the chip is completed through the cooperative work of the material taking mechanism 4 and the detection mechanism 3, so that the manual detection of the chip is replaced by a machine, and the detection efficiency and the detection result accuracy are improved. It should be noted that, in the embodiment of the present invention, for convenience of description, a direction parallel to the table 1 is defined as a horizontal direction, and a direction perpendicular to the table 1 is defined as a vertical direction.
Further, referring to fig. 1, the chip sorting machine further comprises a chip tray positioning mechanism 5, the chip tray positioning mechanism 5 is fixed on the workbench 1 and located between the chip tray bearing plate 2 and the detection mechanism 3, and the chip tray positioning mechanism 5 is used for clamping and positioning the chip tray transferred by the material taking mechanism 4.
In the technical scheme adopted by this embodiment, before the detection mechanism 3 detects the chip, firstly, the whole chip tray on the chip tray loading plate 2 is transferred to the chip tray positioning mechanism 5 by the taking mechanism 4, so that the chip tray is positioned and fixed, and the chip tray is prevented from being displaced to influence the accuracy of taking and placing the chip by the taking mechanism 4.
Further, referring to fig. 2, the chip tray positioning mechanism 5 includes:
the substrate 501 is fixed on the workbench 1 and positioned between the chip tray bearing plate 2 and the detection mechanism 3;
the two fixed limiting parts 502 are arranged at one edge of the substrate 501, which is far away from the end face of the workbench 1;
two activity spacing portions 503, two activity spacing portions 503 set up and set up in base plate 1 and deviate from the another edge of workstation terminal surface and for the setting of base plate 501 slip, and the chip charging tray that transfers from chip charging tray loading board 2 is placed in the space that two fixed spacing portions 502 and two activity spacing portions 503 enclose.
In the technical solution adopted in this embodiment, the two fixed limiting portions 502 are disposed at the edge of the substrate 501, and it can be understood that the substrate 501 is a rectangular plate including four edges adjacent in sequence, wherein the two fixed limiting portions 502 are disposed along the two adjacent edges, the two fixed limiting portions 502 may be disconnected, and are not necessarily connected together, as long as the two adjacent sides of the chip tray can be limited, the two movable limiting portions 503 are disposed at the other two adjacent edges, and the positions of the two movable limiting portions 503 on the substrate 501 can be adjusted, that is, the size of the space formed between the two fixed limiting portions 502 and the two movable limiting portions 503 can be adjusted by the two movable limiting portions 503. When using, slide two spacing portions 503 of activity, make two fixed spacing portions 502, put into the chip charging tray that the space that forms between two spacing portions 503 of activity can be relaxed, put into above-mentioned space back with the chip charging tray when taking out mechanism 4, slide two spacing portions 503 of activity, make two fixed spacing portions 502, two spacing portions 503 of activity respectively with the side butt of chip charging tray, that is to say, two fixed spacing portions 502, two spacing portions 503 of activity correspond a side of chip charging tray respectively, it is the one-to-one relation, thereby carry out spacing fixed with the chip charging tray, guarantee the accuracy of follow-up material of getting. The movement of the two movable limiting parts 503 can be realized by a screw rod or a cylinder.
Further, referring to fig. 3 and 4, the material taking mechanism 4 includes:
the mounting seat 401 is arranged on the workbench 1 in a sliding manner and slides towards the direction close to or far away from the chip tray bearing plate;
the connecting plate 402 is arranged on the mounting seat 401 in a sliding mode along the horizontal direction and is perpendicular to the sliding direction of the mounting seat;
the tray sucker 403 is arranged on the connecting plate 402 in a sliding mode in the vertical direction;
and the chip sucker 404 is arranged on the connecting plate 402 in a sliding mode along the vertical direction and is parallel to the sliding direction of the tray sucker 403.
In the technical solution adopted in this embodiment, the mounting base 401 horizontally slides along the worktable 1 so as to be close to or far from the chip tray loading plate 2, the horizontal sliding direction of the connecting plate 402 on the mounting base 401 is perpendicular to the sliding direction of the mounting base 401, the tray suction cup 403 is used for transferring a chip tray to the chip tray positioning mechanism 5, and the chip suction cup 404 is used for transferring a chip in the chip tray to the detection mechanism 3, wherein the chip tray is located in the chip tray positioning mechanism 5. It can be understood that, through the movement of the connecting plate 402 and the mounting seat 401, the tray suction cup 403 and the chip suction cup 404 are moved to the position above the chip tray loading plate 2 or the chip tray positioning mechanism 5, then through the movement of the tray suction cup 403 in the vertical direction, the chip tray on the chip tray loading plate 2 is sucked and transferred to the chip tray positioning mechanism 5, and then through the movement of the chip suction cup 404 in the vertical direction, the chip is sucked and transferred to the detection mechanism 3. It should be noted that the mount 401 and the connecting plate 402 move cooperatively to transfer the chip tray from the chip tray carrier plate 2 to the chip tray positioning mechanism 5 and transfer the chip from the chip tray positioning mechanism 5 to the detecting mechanism 3. Preferably, the tray suction cups 403 and the chip suction cups 404 are vacuum suction cups.
Further, referring to fig. 3 and 4, the material taking mechanism 4 further includes:
the X-axis screw rod 406 is arranged on the mounting seat 401 and is parallel to the sliding direction of the connecting plate 402, and the X-axis screw rod 406 is in driving connection with the connecting plate 402;
the Y-axis screw rod 407 is arranged on the workbench 1 and is parallel to the sliding direction of the mounting seat 401, and the Y-axis screw rod 407 is in driving connection with the mounting seat 401;
the first air cylinder 408 is arranged on the connecting plate 402 and is parallel to the movement direction of the tray suction cup 403, and the first air cylinder 408 is connected with the tray suction cup 403 in a driving way;
and a second air cylinder 409 which is arranged on the connecting plate 402 and is parallel to the sliding direction of the chip sucker 404, and the second air cylinder 409 is connected with the chip sucker 404 in a driving way.
In the technical scheme adopted in this embodiment, the X-axis lead screw 406 drives the connecting plate 402 to move, the X-axis lead screw 406 is driven by a servo motor, and similarly, the Y-axis lead screw 407 is similar to the X-axis lead screw 406, except that the two are perpendicular to each other on a horizontal plane, and the movement of the mounting base 401 and the connecting plate 402 in different directions is realized. It should be noted that, because the movement range of the mounting seat 401 and the connecting plate 402 is large, the relative stability of the movement process can be ensured by adopting the screw rod driving. First cylinder 408 drives charging tray sucking disc 403 vertical motion, realizes the absorption and the promotion to the chip charging tray, and similarly, second cylinder 409 is similar with first cylinder 408, and both set up side by side on connecting plate 402, and all are vertical setting at connecting plate 402, and its direction of motion is parallel. It should be noted that, because the movement ranges of the tray suction cups 403 and the chip suction cups 404 in the vertical direction are small, the small-range stable movement can be realized through the air cylinders.
Further, referring to fig. 3 and 4, the material taking mechanism 4 further includes a guide rail 405, the guide rail 405 is mounted on the work table 1, and the mounting seat 401 slides along the guide rail 405.
In the technical solution adopted in this embodiment, the provided guide rail 405 defines the moving direction of the mount 401, and ensures that the mount 401 moves on the guide rail 405 in a predetermined direction, and prevents the direction deviation, preferably, two guide rails 405 are provided, and two ends of the mount 401 are respectively engaged with the guide rails 405.
Further, referring to fig. 6, the detection mechanism 3 includes a strain gauge 301, and the strain gauge 301 is slidably provided on the table 1.
In the technical solution adopted in this embodiment, the strain gauge 301 is arranged to detect the quality of the chip.
Further, referring to fig. 6, the detection mechanism 3 further includes a transfer cylinder 302, and the transfer cylinder 302 is connected to the strain gauge 301 by driving.
In the technical solution adopted in this embodiment, the transfer cylinder 302 is fixed to the table 1 and located below the mounting base 401, and a space is left between the mounting base 401 and the table 1 for the transfer cylinder 302 to extend and contract. The qualified chips are left on the strain gauge 301, and when the strain gauge 301 is fully arranged with the chips, the strain gauge is driven by the transfer cylinder 302 to move and be far away from the chip tray positioning mechanism 5, and the chips are manually taken down. In order to further improve the detection efficiency, a plurality of strain gauges 301 can be arranged, and when one strain gauge 301 is fully arranged and chips are taken manually, the other strain gauge 301 can continue to detect the chips, so that the continuity of chip detection is ensured. For convenience, the strain gauge 301 may be mounted on a base, and the transfer cylinder 302 drives the connection base. It should be noted that, in order to ensure that the detection mechanism 3 and the material taking mechanism 4 move independently without interfering with each other, the mounting seat 401 in the material taking mechanism 4 does not contact with the workbench 1, and a certain gap is left, it can be understood that the detection mechanism 3 moves from the gap, and the specific gap can be determined according to the size of the detection mechanism 3.
Further, referring to fig. 1 and 5, the chip sorter further includes an empty tray loading plate 6, the empty tray loading plate 6 is located on one side of the chip tray positioning mechanism 5 facing the chip tray loading plate 2, and the empty tray loading plate 6 is used for accommodating empty chip trays transferred from the chip tray positioning mechanism 5.
In the technical scheme adopted by the embodiment, the empty tray bearing plate 6 is used for accommodating empty chip trays, that is, after all chips in the chip trays on the chip tray positioning mechanism 5 are taken away, the remaining empty chip trays are transferred to the empty tray bearing plate 6. Preferably, the empty tray carrier plate 6 and the chip tray carrier plate 2 are arranged in parallel, and the arrangement direction of the empty tray carrier plate and the chip tray carrier plate is parallel to the chip tray positioning mechanism 5.
Further, workstation 1 is equipped with the perforation, and the setting of empty charging tray loading board 6 and chip charging tray loading board 2 liftable is in this perforation department, and one side that workstation 1 deviates from detection mechanism 3 is equipped with two elevating system, and empty charging tray loading board 6 is connected in an elevating system drive, and chip charging tray loading board 2 is connected in another elevating system drive.
In the technical scheme adopted by the embodiment, a plurality of layers of chip trays with chips are placed on the chip tray bearing plate 2, at the moment, the chip tray at the top layer is positioned above the table surface of the workbench 1, and after one layer of chip tray is taken away, the chip tray bearing plate 2 rises to the height of one layer of chip tray, so that the continuity of chip detection work can be ensured, and the detection efficiency is further improved. Meanwhile, the empty tray bearing plate 6 can be used for placing a plurality of layers of empty chip trays, and after one layer of empty chip trays is placed, the empty tray bearing plate 6 is lowered by the height of one layer of chip trays, so that uninterrupted placement of the empty chip trays can be ensured. Specifically, workstation 1's terminal surface is equipped with two perforation, and empty charging tray loading board 6 is along one of them perforation vertical lift, and chip charging tray loading board 2 is along another perforation vertical lift, in order to guarantee the lift in-process, and the chip charging tray can not take place the slope and askew even fall, is equipped with the round along the edge of through hole and prevents down the piece, and is preferred, prevents down the piece and is the baffle. It should be noted that, the lifting mechanism may be implemented by a motor lifter, an electric push rod, a lead screw, or an air cylinder, and the specific structure and the specific implementation manner of the lifting mechanism are not the invention points of the present application, and the problem of how to lift can be solved by using the existing technology.
The use method or the action process of the device of the invention is as follows:
1. and (3) transferring production: before production, a chip tray with chips is manually placed on the chip tray bearing plate 2, and the strain gauge 301 is fixed.
2. Automatically taking chips or chip trays: the mounting seat 401 and the connecting plate 402 move to the position of the chip tray loading plate 2 under the driving of the X-axis lead screw 406 and the Y-axis lead screw 407, the first cylinder 408 extends out, the tray suction cup 403 descends to suck a chip tray, the first cylinder 408 retracts, and the mounting seat 401 and the connecting plate 402 place the sucked chip tray on the substrate 501 of the chip tray positioning mechanism 5 under the driving of the X-axis lead screw 406 and the Y-axis lead screw 407.
3. Positioning a chip tray: the two movable limiting parts 503 move and are matched with the fixed limiting parts 502 to clamp the chip tray on the substrate 501, so that the limiting and fixing of the chip tray are realized.
4. Detection and sorting: the mounting seat 401 and the connecting plate 402 move to the position of the chip tray positioning mechanism 5 under the driving of the X-axis lead screw 406 and the Y-axis lead screw 407, the second air cylinder 409 extends out, after the chip suction disc 404 sucks the chip, the second air cylinder 409 contracts to lift the chip, the chip is conveyed to the position of the strain gauge 301 to be inspected under the driving of the X-axis lead screw 406 and the Y-axis lead screw 407, and unqualified products are sucked away and placed in an empty tray.
5. Full discharge and alternation: the operation above is circulated until the strain gauges 301 are fully arranged, the transfer cylinder 302 retracts, the manual material taking is carried out, meanwhile, the other strain gauge 301 extends out, the sorting detection is continued, the empty chip tray is sucked away and placed at the position of the empty tray bearing plate 6, the chip tray bearing plate 2 is lifted by the height of one chip tray, and the empty tray bearing plate 6 is lowered by the height of one chip tray until the materials are fully collected.
The above description is only a preferred embodiment of the present application, and not intended to limit the scope of the present application, and all modifications and equivalents of the technical solutions that can be directly or indirectly applied to other related fields without departing from the spirit of the present application are intended to be included in the scope of the present application.
Claims (10)
1. A chip handler, comprising:
a work table;
the chip tray bearing plate is arranged at one end of the workbench and used for placing a chip tray filled with chips;
the material taking mechanism is arranged at the other end of the workbench and is used for transferring the chip tray and/or the chip;
the detection mechanism is arranged on one side, facing the material taking mechanism, of the chip tray bearing plate and is used for detecting the chips transferred by the material taking mechanism.
2. The chip handler of claim 1, further comprising a chip tray positioning mechanism fixed to the table between the chip tray carrier plate and the detecting mechanism, the chip tray positioning mechanism configured to clamp and position the chip tray transferred by the take-off mechanism.
3. The chip handler of claim 2, wherein the chip tray positioning mechanism comprises:
the substrate is fixed on the workbench and positioned between the chip tray bearing plate and the detection mechanism;
the two fixed limiting parts are arranged at one edge of the substrate, which is far away from the end face of the workbench;
the two movable limiting parts are arranged at the other edge of the base plate, which deviates from the end face of the workbench, and are arranged relative to the base plate in a sliding manner, and the chip tray transferred from the chip tray bearing plate is placed in a space surrounded by the two fixed limiting parts and the two movable limiting parts.
4. The chip handler of any one of claims 1 to 3, wherein the take off mechanism comprises:
the mounting seat is arranged on the workbench in a sliding mode and slides in the direction close to or far away from the chip tray bearing plate;
the connecting plate is arranged on the mounting seat in a sliding mode along the horizontal direction and is perpendicular to the sliding direction of the mounting seat;
the tray sucker is arranged on the connecting plate in a sliding mode along the vertical direction;
and the chip sucker is arranged in a sliding manner along the vertical direction, and the connecting plate is parallel to the sliding direction of the tray sucker.
5. The chip handler of claim 4, wherein the take off mechanism further comprises:
the X-axis screw rod is arranged on the mounting seat and is parallel to the sliding direction of the connecting plate, and the X-axis screw rod is in driving connection with the connecting plate;
the Y-axis screw rod is arranged on the workbench and is parallel to the sliding direction of the mounting seat, and the Y-axis screw rod is connected with the mounting seat in a driving manner;
the first air cylinder is arranged on the connecting plate and is parallel to the movement direction of the material tray sucker, and the first air cylinder is in driving connection with the material tray sucker;
the second cylinder is arranged on the connecting plate and parallel to the sliding direction of the chip sucker, and the second cylinder is in driving connection with the chip sucker.
6. The chip handler of claim 5, wherein the take-off mechanism further comprises a rail mounted to the table, the mount sliding along the rail.
7. The chip handler of claim 1, wherein the detection mechanism comprises a strain gauge slidably disposed on the table.
8. The chip handler of claim 7, wherein the inspection mechanism further comprises a transfer cylinder, the transfer cylinder being in driving connection with the strain gauge.
9. The chip handler of claim 2, further comprising an empty tray carrier plate located on a side of the chip tray positioning mechanism facing the chip tray carrier plate, the empty tray carrier plate for receiving the empty chip tray transferred from the chip tray positioning mechanism.
10. The chip handler of claim 9, wherein the table is provided with perforations, the empty tray carrier plate and the chip tray carrier plate are disposed at the perforations, and a side of the table facing away from the detection mechanism is provided with two lifting mechanisms, one of the lifting mechanisms being drivingly connected to the empty tray carrier plate and the other of the lifting mechanisms being drivingly connected to the chip tray carrier plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911014940.5A CN110743813A (en) | 2019-10-23 | 2019-10-23 | Chip sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911014940.5A CN110743813A (en) | 2019-10-23 | 2019-10-23 | Chip sorting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110743813A true CN110743813A (en) | 2020-02-04 |
Family
ID=69279588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911014940.5A Pending CN110743813A (en) | 2019-10-23 | 2019-10-23 | Chip sorting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110743813A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111729862A (en) * | 2020-07-07 | 2020-10-02 | 苏州工业园区职业技术学院 | A detect sorting mechanism for thin material |
| CN113083861A (en) * | 2021-04-15 | 2021-07-09 | 路志国 | Waste semiconductor storage device detection and recovery system and use method thereof |
| CN114247662A (en) * | 2021-11-27 | 2022-03-29 | 苏州华兴源创科技股份有限公司 | Chip screening device and chip detection production line |
| CN114377986A (en) * | 2022-01-20 | 2022-04-22 | 无锡昌鼎电子有限公司 | Chip sorting machine |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0601422A2 (en) * | 1992-12-08 | 1994-06-15 | RWE Entsorgung Aktiengesellschaft | Method and apparatus for identifying objects |
| CN103071627A (en) * | 2013-01-09 | 2013-05-01 | 广东志成华科光电设备有限公司 | Full automatic crystalline grain detection and sorting all-in-one machine |
| CN205300845U (en) * | 2015-12-31 | 2016-06-08 | 陕西理工学院 | Macroarray resistance strain gauges automated inspection , correction of flank shape, sorting unit |
| CN208627868U (en) * | 2018-05-28 | 2019-03-22 | 广州舜领教育咨询有限公司 | A kind of die selector |
| CN109712924A (en) * | 2018-12-29 | 2019-05-03 | 哈工大机器人（山东）智能装备研究院 | A kind of infrared focal plane array chip automated test device |
| CN109772726A (en) * | 2019-01-03 | 2019-05-21 | 大族激光科技产业集团股份有限公司 | LED processing equipment and LED processing technology applying same |
-
2019
- 2019-10-23 CN CN201911014940.5A patent/CN110743813A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0601422A2 (en) * | 1992-12-08 | 1994-06-15 | RWE Entsorgung Aktiengesellschaft | Method and apparatus for identifying objects |
| CN103071627A (en) * | 2013-01-09 | 2013-05-01 | 广东志成华科光电设备有限公司 | Full automatic crystalline grain detection and sorting all-in-one machine |
| CN205300845U (en) * | 2015-12-31 | 2016-06-08 | 陕西理工学院 | Macroarray resistance strain gauges automated inspection , correction of flank shape, sorting unit |
| CN208627868U (en) * | 2018-05-28 | 2019-03-22 | 广州舜领教育咨询有限公司 | A kind of die selector |
| CN109712924A (en) * | 2018-12-29 | 2019-05-03 | 哈工大机器人（山东）智能装备研究院 | A kind of infrared focal plane array chip automated test device |
| CN109772726A (en) * | 2019-01-03 | 2019-05-21 | 大族激光科技产业集团股份有限公司 | LED processing equipment and LED processing technology applying same |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111729862A (en) * | 2020-07-07 | 2020-10-02 | 苏州工业园区职业技术学院 | A detect sorting mechanism for thin material |
| CN113083861A (en) * | 2021-04-15 | 2021-07-09 | 路志国 | Waste semiconductor storage device detection and recovery system and use method thereof |
| CN114247662A (en) * | 2021-11-27 | 2022-03-29 | 苏州华兴源创科技股份有限公司 | Chip screening device and chip detection production line |
| CN114377986A (en) * | 2022-01-20 | 2022-04-22 | 无锡昌鼎电子有限公司 | Chip sorting machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110743813A (en) | Chip sorting machine | |
| CN113697513A (en) | Layered tray layered feeding device | |
| CN110902304A (en) | Camera support assembling machine | |
| CN209956356U (en) | Shielding case packaging machine with flatness detection mechanism | |
| CN113277306A (en) | PCB separates paper and puts trigger | |
| CN111615271A (en) | Automatic laminating equipment for multilayer circuit board | |
| CN111618547A (en) | Positioning and assembling method of lens assembling equipment | |
| CN210788219U (en) | Conveying and sorting device for automatic detection of circuit boards | |
| CN114634029A (en) | PCB board charging equipment | |
| CN114799546A (en) | Full-automatic laser drilling method and equipment | |
| CN219620288U (en) | Feeding and discharging mechanism and double-sided product detection device | |
| CN111482781A (en) | Lens assembling equipment | |
| CN112548511A (en) | Automatic equipment for lamination assembly | |
| CN215885471U (en) | FPC material loading machine | |
| CN210443541U (en) | Substrate clamping device | |
| CN110549087B (en) | Automatic installation equipment for processor frame | |
| CN213827811U (en) | Automatic change camera lens location equipment mechanism | |
| CN113084913A (en) | Plate collecting machine for support plate | |
| CN113838789A (en) | Automatic chip supply device and method | |
| CN217126276U (en) | PCB board charging equipment | |
| CN218041936U (en) | Automatic paste keyboard soft film circuit board equipment | |
| CN218453749U (en) | Multifunctional feeding device and equipment | |
| CN219324481U (en) | Bar thickness test equipment | |
| CN111571286A (en) | Camera module charging equipment and automatic material buckling machine | |
| CN220371635U (en) | Automatic go up height finding machine of unloading |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200204 |