CN114247662A - Chip screening device and chip detection production line - Google Patents
Chip screening device and chip detection production line Download PDFInfo
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- CN114247662A CN114247662A CN202111426752.0A CN202111426752A CN114247662A CN 114247662 A CN114247662 A CN 114247662A CN 202111426752 A CN202111426752 A CN 202111426752A CN 114247662 A CN114247662 A CN 114247662A
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- 238000001514 detection method Methods 0.000 title claims abstract description 82
- 238000012216 screening Methods 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000012546 transfer Methods 0.000 claims abstract description 58
- 238000001179 sorption measurement Methods 0.000 claims abstract description 42
- 230000000712 assembly Effects 0.000 claims abstract description 12
- 238000000429 assembly Methods 0.000 claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims description 30
- 238000012360 testing method Methods 0.000 claims description 25
- 238000007689 inspection Methods 0.000 claims description 15
- 238000011084 recovery Methods 0.000 claims description 11
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 230000001502 supplementing effect Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 230000033001 locomotion Effects 0.000 description 4
- 230000002950 deficient Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 230000008439 repair process Effects 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
Abstract
The invention relates to a chip screening device and a chip detection production line. The chip screening device includes: a work table; the first conveying module is arranged on the workbench, and is provided with a material taking plate which is provided with a plurality of material taking cavities for placing chips; the second conveying module is arranged on the workbench and provided with a detection disc, and the detection disc is provided with a plurality of detection cavities for placing chips; the adsorption module is arranged on the workbench in a sliding mode and located above the first conveying module and the second conveying module, the adsorption module comprises a plurality of suction nozzle assemblies, and each suction nozzle assembly can independently suck chips of the material taking cavity and is placed in the detection cavity in a one-to-one correspondence mode. The chip screening device can improve the chip transfer efficiency, and can remove the chips in any one or more material taking cavities from the material taking plate according to the requirements, thereby realizing the chip screening function.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to a chip screening device and a chip detection production line.
Background
After the chip is produced, the chip needs to be detected to ensure that indexes of various aspects of the chip can meet actual requirements.
The existing chip detection process mainly comprises two steps, wherein the first step is chip transportation; the second step is the detection of the chip. In the first step, the existing transfer device has defects in the aspects of transfer efficiency, adaptability of the transfer device, damage to chips by the transfer device and the like; in the second step, there are also deficiencies in chip batch inspection and in post-inspection batch sorting.
Disclosure of Invention
In view of the above, it is necessary to provide a chip screening apparatus, and further provide a chip inspection line and a chip screening method, for addressing at least one of the above-mentioned problems.
A chip screening apparatus, comprising:
a work table;
the first conveying module is arranged on the workbench, a material taking plate is arranged on the first conveying module, and the material taking plate is provided with a plurality of material taking cavities for placing chips;
the second conveying module is arranged on the workbench and provided with a detection disc, and the detection disc is provided with a plurality of detection cavities for placing the chips;
the suction module is arranged on the workbench in a sliding mode and located above the first conveying module and the second conveying module, the suction module comprises a plurality of suction nozzle assemblies, and each suction nozzle assembly can independently suck the chips in the material taking cavity and is arranged in the detection cavity in a one-to-one correspondence mode.
Above-mentioned chip sieving mechanism, first transmission module can convey the material taking disc to being close to the adsorption module, and a plurality of suction nozzle subassemblies on the adsorption module can be simultaneously from a plurality of material taking intracavity of material taking disc take out a plurality of chips and place in the detection intracavity one-to-one. Therefore, in the process of transferring chips in batches, the transferring efficiency of the chips can be improved. In addition, because every suction nozzle subassembly can work independently, consequently the absorption module can also be rejected the chip of arbitrary one or more material intracavity from getting the charging tray as required, realizes the screening function of chip.
In one embodiment, the adsorption module comprises a spacing adjustment plate;
the interval regulating plate includes many mutual intervals and follows the adjustment tank that the workstation direction extends, adjacent two interval court between the adjustment tank the workstation direction reduces gradually, a plurality of suction nozzle subassembly one-to-one set up many in the adjustment tank.
In one embodiment, the suction nozzle assembly comprises a suction nozzle arranged on the first mounting seat and a driving element for driving the suction nozzle to reciprocate relative to the workbench.
In one embodiment, the nozzle assembly further includes a second mounting seat for fixing the driving element, the second mounting seat is provided with a guide assembly, and the first mounting seat is slidably arranged on the guide assembly.
In one embodiment, a protection jig is arranged at one end of the guide assembly, which is far away from the second mounting seat, the protection jig is provided with a through protection hole, the protection hole corresponds to the suction nozzle, and an elastic piece is further arranged between the protection jig and the second mounting seat.
In one embodiment, a groove is formed in the side wall of the material taking disc, the first conveying module is provided with a first lifting and lifting mechanism, and the first lifting and lifting mechanism can be matched with the groove of the material taking disc and supports the material taking disc to move towards the direction away from the first conveying module.
In one embodiment, the first conveying module is further provided with a reversing device, and the reversing device can drive the material taking disc to rotate.
In one embodiment, a third conveying module is further arranged on the workbench, the third conveying module is provided with a material supplementing disc and a recovery disc, the adsorption module can take out the chip from the detection cavity and place the chip in the recovery disc, and the chip is transferred from the material supplementing disc to the detection cavity.
A chip detection production line comprises the chip screening device, a transfer device and a detection system;
the transfer device includes a transfer mechanism capable of transferring the test tray between the second transport module and the test system;
the detection system judges whether the chip in each detection cavity in the detection disc is qualified or not, and transmits the position information of the detection cavity containing unqualified chips to the adsorption module.
In one embodiment, the transfer device further comprises a movable shelf, and the movable shelf comprises a multi-layer shelf for placing the detection tray.
Drawings
FIG. 1 is a schematic structural diagram of a chip screening apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an adsorption module according to an embodiment of the present invention;
FIG. 3 is a schematic view of a nozzle assembly according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a first transfer module according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a chip screening apparatus according to another embodiment of the present invention;
FIG. 6 is an enlarged view of a portion of FIG. 5A;
FIG. 7 is a schematic structural diagram of a chip inspection line according to an embodiment of the present disclosure;
fig. 8 is a schematic block diagram of a chip inspection line according to an embodiment of the invention.
The reference numbers illustrate:
100. a work table; 110. a material supplementing platform; 121. positioning blocks; 130. a positioning mechanism; 131. a right-angle plate; 132. a pushing block;
200. a first transfer module; 210. taking a material tray; 220. a first lifting mechanism; 230. a reversing device; 231. a reduction motor; 232. a support plate; 233. a second lifting mechanism;
300. a second transfer module; 310. detecting a disc;
400. an adsorption module; 410. a suction nozzle assembly; 411. a first mounting seat; 412. a suction nozzle; 413. a drive element; 414. a second mounting seat; 415. a guide assembly; 416. protecting the jig; 417. an elastic member; 420. a spacing adjustment plate; 421. an adjustment groove;
500. a third transfer module; 510. a material supplementing disc; 520. a recovery tray; 530. a material supplementing platform;
600. a transfer device; 610. a transfer mechanism; 611. a tine; 620. moving the goods shelf; 621. a placing table; 700. and (4) a detection system.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Referring to fig. 1, fig. 1 is a schematic structural diagram illustrating a chip screening apparatus according to an embodiment of the present invention, the chip screening apparatus according to an embodiment of the present invention includes: a table 100, a first transfer module 200, a second transfer module 300, and an adsorption module 400, wherein the table 100 is used to support these mechanisms; the first transfer module 200 is used for transferring the pick tray 210, the second transfer module 300 is used for transporting the test tray 310, wherein the chips of the test tray 310 can be transferred to a downstream device, for example, the chips of the test tray 310 are transferred to a testing system, and the adsorption module 400 is used for transferring the chips in the pick tray 210 to the test tray 310.
Specifically, the first conveying module 200 is arranged on the workbench 100, a material taking tray 210 is arranged on the first conveying module 200, and the material taking tray 210 is provided with a plurality of material taking cavities for placing chips; the second conveying module 300 is arranged on the workbench 100, the second conveying module 300 is provided with a detection disc 310, and the detection disc 310 is provided with a plurality of detection cavities for placing chips; the suction module 400 is slidably disposed on the worktable 100 and located above the first and second transfer modules 200 and 300, the suction module 400 includes a plurality of suction nozzle assemblies 410, and each suction nozzle assembly 410 can independently suck the chip of the material taking cavity and be disposed in the detection cavity in a one-to-one correspondence manner.
The working principle of the chip screening apparatus in this embodiment can be explained as follows: the first transfer module 200 can transfer the material taking tray 210 to be close to the adsorption module 400, and the plurality of nozzle assemblies 410 on the adsorption module 400 can take out a plurality of chips from a plurality of material taking cavities of the material taking tray 210 at the same time and place the chips in the detection cavities in a one-to-one correspondence manner. Therefore, in the process of transferring chips in batches, the transferring efficiency of the chips can be improved. It should be explained that, after the positions of the first transfer module 200, the second transfer module 300 and the adsorption module 400 are determined on the workbench 100, the positions of the material taking cavity of the material taking tray 210 and the detection cavity of the detection tray 310 relative to the position of the adsorption module 400 are also determined, so that the position of each material taking cavity of the material taking tray 210 relative to the position of the adsorption module 400 and the position of each detection cavity of the detection tray 310 relative to the adsorption module 400 can also be determined, and it can be understood that the adsorption module 400 can know the address of each material taking cavity and the address of each detection cavity. In addition, since each nozzle assembly 410 can work independently, the adsorption module 400 can also remove chips in any one or more material taking cavities from the material taking tray 210 as required, thereby realizing the chip screening function.
During the chip transferring process, different batches of chips may be encountered, and the size of the material taking cavity of the material taking tray 210 and the size of the detection cavity of the detection tray 310 may be changed, so that the distance between the nozzle assemblies 410 of the adsorption module 400 needs to be adjusted to better adapt the adsorption module 400 to the size change. In one embodiment, referring to fig. 2, the suction module 400 includes a spacing adjustment plate 420, wherein the spacing adjustment plate 420 includes a plurality of adjustment slots 421 spaced apart from each other and extending along the direction of the worktable 100, a spacing between two adjacent adjustment slots 421 gradually decreases toward the direction of the worktable 100, and a plurality of suction nozzle assemblies 410 are correspondingly disposed in the plurality of adjustment slots 421. The idea of this embodiment is that when the space or the distance between the material taking cavity of the material taking tray 210 and/or the detection cavity of the detection tray 310 increases, the plurality of suction nozzle assemblies 410 can be moved in the direction away from the workbench 100, and because the distance between the adjustment grooves 421 in the direction away from the workbench 100 is large, the distance between the plurality of suction nozzle assemblies 410 in the direction away from the workbench 100 also increases. Similarly, when the pitch of the plurality of nozzle assemblies 410 needs to be adjusted to be small, the plurality of nozzle assemblies 410 may be moved toward the working platform 100.
When the nozzle assembly 410 adsorbs a chip in a pickup cavity or a test cavity, in order to individually control the nozzle assembly 410 to adsorb a chip in any pickup cavity or test cavity, a driving element 413 may be disposed on each nozzle assembly 410 to drive the nozzle assembly 410 to operate independently. Specifically, referring to fig. 3, the suction nozzle assembly 410 includes a suction nozzle 412 disposed on a first mount 411, and a driving element 413 for driving the suction nozzle 412 to reciprocate with respect to the direction of the table 100. Each suction nozzle 412 can be independently operated, and the driving element 413 can control the suction nozzle 412 to approach along the direction of the worktable 100 so as to complete the suction work of the chip.
Further, in order to facilitate the nozzle assembly 410 to have a stable moving direction during the moving process, in an embodiment, referring to fig. 3, the nozzle assembly 410 further includes a second mounting seat 414 for fixing the driving element 413, the second mounting seat 414 is provided with a guiding assembly 415, and the first mounting seat 411 is slidably disposed on the guiding assembly 415. When the driving element 413 drives the suction nozzle 412 on the first mounting seat 411 to work, the first mounting seat 411 provided with the suction nozzle 412 can move along the guide component 415, so that the stability of the moving direction of the suction nozzle 412 can be ensured.
Further, since the suction nozzle 412 is a relatively precise component, the transfer efficiency of the chip is directly affected by whether the suction nozzle 412 can work normally, and therefore, the suction nozzle 412 needs to be protected; secondly, when the suction nozzle 412 is close to the pick-up tray 210 and the detection tray 310, the suction nozzle 412 may contact with the pick-up tray 210, the detection tray 310 or the chip due to an excessive moving distance, and therefore, the suction nozzle 412 may be damaged or the suction nozzle 412 may scratch the chip, and therefore, the suction nozzle 412 needs to be protected. Specifically, a protection jig 416 is disposed at an end of the guide assembly 415 away from the second mounting seat 414, the protection jig 416 is provided with a through protection hole, the protection hole corresponds to the suction nozzle 412, and an elastic member 417 is further disposed between the protection jig 416 and the second mounting seat 414.
In this embodiment, when the suction nozzle 412 moves towards the material taking tray 210 or the detection tray 310, the first mounting seat 411 provided with the suction nozzle 412 can compress the elastic member 417, and the elastic member 417 can apply elastic force to the first mounting seat 411 so that the downward movement speed of the first mounting seat 411 can be further reduced. When the suction nozzle 412 contacts the material taking tray 210, the detection tray 310 or the chip, the objects apply a reaction force to the suction nozzle 412, and the suction nozzle 412 moves away from the objects by the aid of the elastic force of the elastic member 417, so that the risk of damage to the suction nozzle 412 and the risk of chip scratch are reduced. In addition, the suction nozzle 412 is moved out of the protection hole of the protection jig 416 when approaching the material taking tray 210 and the detection tray 310, so that the protection jig 416 can protect the suction nozzle 412 from being damaged in a general situation.
It should be noted that in the present embodiment, the driving element 413 may be a pneumatic or hydraulic cylinder or other mechanism capable of performing linear motion. The suction nozzle 412 can suck the chip by suction force generated by itself. The guide assembly 415 may be a plurality of guide rods. Structures such as sliding rails and sliding blocks may also be disposed between the first mounting seat 411 and the second mounting seat 414, so that the first mounting seat 411 can slide relative to the second mounting seat 414 during the movement. The elastic member 417 may be a spring.
In order to ensure that chips can be continuously supplied to the test tray 310 of the second transport module 300 on the first transport module 200, a plurality of take-up trays 210 are typically stacked on the first transport module 200. In order to facilitate that only one take-up tray 210 is moved from the first transfer module 200 to the adsorption module 400 at a time, it is necessary to support and move away from the first transfer module 200 the other take-up trays 210 except the one closest to the first transfer module 200. Specifically, referring to fig. 4, the sidewall of the material taking tray 210 is provided with a groove, the first conveying module 200 is provided with a first lifting mechanism 220, and the first lifting mechanism 220 can cooperate with the groove of the material taking tray 210 and support the material taking tray 210 to move in a direction away from the first conveying module 200. The first lifting and lifting mechanism 220 includes a supporting portion and a driving module in a design manner, the driving module may be an air cylinder, and the air cylinder drives the supporting portion to move, so that the supporting portion can enter the groove of the material taking tray 210 to realize a lifting function, for example, the groove faces the first conveying module 200.
When the first transfer module 200 is transferring the material taking tray 210, the length of the material taking tray 210 may exceed the width of the first transfer module 200 due to the limited width of the first feeding mechanism, and for this reason, the long edge of the material taking tray 210 needs to be moved along the transfer direction of the first transfer module 200. After the material taking tray 210 is close to the adsorption module 400, the direction of the material taking tray 210 needs to be adjusted in order to facilitate the suction nozzle component 410 to adsorb the chip. Specifically, referring to fig. 4, the first conveying module 200 is further provided with a reversing device 230, and the reversing device 230 can drive the material taking tray 210 to rotate. The reversing device 230 includes a speed reducing motor 231 and a supporting plate 232, and the speed reducing motor 231 drives the supporting plate 232 to rotate. In addition, in order to facilitate the reversing device 230 to rotate the material taking tray 210, that is, reduce friction between the material taking tray 210 and the first conveying module 200, a second lifting mechanism 233 may be disposed on the reversing device 230, so as to lift the reversing device 230, and then complete the rotation of the material taking tray 210 through the reversing device 230, where the second lifting mechanism 233 may be an air cylinder.
When the test chamber of the test tray 310 has an unqualified chip, the unqualified chip needs to be taken out and replaced into the test chamber. Specifically, the third conveying module 500 is further disposed on the workbench 100, the third conveying module 500 is provided with a feeding tray 510 and a recovery tray 520, the adsorption module 400 can take out the chip from the detection cavity and place the chip in the recovery tray 520, and the chip is transferred from the feeding tray 510 to the detection cavity. It should be noted that the repair tray 510 is used for carrying the qualified chips, and the recovery tray 520 is used for recovering the unqualified chips in the inspection tray 310. Unqualified chips of the detection tray 310 are selected, and then the detection tray 310 is supplemented with materials, so that the chips of the detection tray 310 are all qualified chips.
Considering that the feeding tray 510 has a limited number of chips, it is necessary to continuously feed the chips into the feeding tray 510. Specifically, referring to fig. 1 and 5, in an embodiment, a material supplementing table 110 is disposed on the work table 100, a material taking tray 210 is also disposed on the material supplementing table 110, and an adsorption module 400 is also disposed on the material supplementing table 110, and the adsorption module 400 can transfer chips in the material taking tray 210 into the material supplementing tray 510.
Further, in order to prevent the material taking tray 210 on the material supplementing table 110 from being positioned and prevent the material taking tray 210 from moving relatively on the material supplementing table 110, in an embodiment, a positioning assembly is disposed on the material supplementing table 110, the positioning assembly includes four positioning blocks 121, each positioning block 121 is provided with a positioning groove facing the material taking tray 210, and four vertex angles of the material taking tray 210 are located in the positioning grooves. The material taking tray 210 on the feeding table 110 can be roughly positioned by the positioning component in the embodiment.
Furthermore, referring to fig. 6, when the material taking disc 210 needs to be precisely positioned, the positioning mechanism 130 is arranged on the material supplementing table 110, the positioning mechanism 130 includes a right-angle plate 131 and a driving module, two ends of the right-angle plate 131 are respectively abutted to two adjacent surfaces of the material taking disc 210 on the material supplementing table 110, the driving module, such as an air cylinder, is arranged on the right-angle plate 131, and the air cylinder pushes the right-angle plate 131 to move, so that the right angle tightly fits two adjacent positioning side surfaces of the material taking disc 210 in the positioning groove. Alternatively, the positioning mechanism 130 comprises square edges, two adjacent edges of the square plates 131 are provided with pushing blocks 132, the pushing blocks 132 face the material taking tray 210, and the driving element drives the square plates 131 to move. When the drive plate drive right-angle plate 131 removed, drive and promote the piece 132 and remove, thereby promote the piece 132 butt and get the charging tray 210 and make the two adjacent location sides of taking the charging tray 210 laminate closely in the constant head tank.
In the present invention, a preferred arrangement of each mechanism in the chip screening apparatus is described, and specifically, the first conveying module 200, the second conveying module 300, and the third conveying module 500 are respectively arranged along a first direction, which is referred to a direction pointed by an arrow a shown in fig. 1, and the first conveying module 200, the second conveying module 300, and the third conveying module 500 may be a conveyor belt, a conveyor chain, or a linear motion mechanism composed of a slide block and a slide rail. The adsorption module 400 is horizontally disposed in a direction perpendicular to the first direction, and the adsorption module 400 on the supply table 110 is also horizontally disposed in a direction perpendicular to the first direction.
When the chip screening mechanism is operated, the first transfer module 200 moves in the first direction to move the take-up tray 210 close to the adsorption module 400. The adsorption module 400 transfers the chips in the pick tray 210 to the test tray 310 of the second transfer module 300. The third transfer module 500 moves the feeding tray 510 and the recovery tray 520 to be close to the adsorption module 400, and the adsorption module 400 can transfer the unqualified chips in the detection tray 310 into the recovery tray 520, and take out the chips from the feeding tray 510 to place the chips in the detection tray 310. It should be noted that the material taking tray 210, the detection tray 310, the material feeding tray 510 and the recovery tray 520 are all below the adsorption module 400, and the adsorption module 400 can complete the corresponding material taking action by translating along a second direction, which is referred to the direction pointed by the arrow b in fig. 1.
The invention also provides a chip detection production line for completing the detection and screening process of the chip. Specifically, referring to fig. 7 and 8, the chip detection line includes a chip screening device, a transferring device 600 and a detection system 700; the relay apparatus 600 includes a transfer mechanism 610, the transfer mechanism 610 being capable of transferring the test tray 310 between the second transfer module 300 and the test system 700; the inspection system 700 determines whether the chips in each inspection chamber in the inspection tray 310 are qualified, and transmits the position information of the inspection chamber containing the unqualified chips to the adsorption module 400.
The working principle of the chip detection production line in this embodiment is as follows: the first conveying module 200 conveys the material taking tray 210 to be close to the adsorption module 400, and the plurality of nozzle assemblies 410 of the adsorption module 400 take out chips from the plurality of material taking cavities of the material taking tray 210 and place the chips in the plurality of detection cavities of the detection tray 310; the second transfer module 300 transfers the test tray 310 to the proximity transfer device, and the transfer mechanism 610 of the relay device 600 takes out the test tray 310 from the second transfer module 300 and transfers the test tray 310 to the test system 700; the detection system 700 detects whether the chips in each detection cavity of the detection tray 310 are qualified, and transmits the position information of the detection cavity containing the unqualified chips to the adsorption module 400, and the transfer mechanism 610 of the transfer device 600 takes out the detection tray 310 from the detection system 700 and transfers the detection tray to the second transfer module 300; the adsorption module 400 takes out the defective chip according to the position information of the inspection chamber in the inspection tray 310, which is transmitted from the inspection system 700 and in which the defective chip is accommodated.
It should be noted that the transfer mechanism 610 includes a fork 611, an air cylinder for driving the fork 611 to reciprocate in the up-down direction, an air cylinder for driving the fork 611 to reciprocate in the conveying direction of the second conveying module 300, and a conveying structure for driving the detection plate 310 to convey along the second conveying module 300.
To transfer a plurality of test trays 310 in a batch to the test system 700, the transfer device 600 further includes a moving rack 620, and the moving rack 620 includes a multi-deck shelf 621 for placing the test trays 310. When the multi-shelf 621 of the movable shelf 620 is placed to be filled with the detection tray 310, the movable shelf 620 is transferred to the detection system 700.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A chip screening apparatus, comprising:
a work table;
the first conveying module is arranged on the workbench, a material taking plate is arranged on the first conveying module, and the material taking plate is provided with a plurality of material taking cavities for placing chips;
the second conveying module is arranged on the workbench and provided with a detection disc, and the detection disc is provided with a plurality of detection cavities for placing the chips;
the suction module is arranged on the workbench in a sliding mode and located above the first conveying module and the second conveying module, the suction module comprises a plurality of suction nozzle assemblies, and each suction nozzle assembly can independently suck the chips in the material taking cavity and is arranged in the detection cavity in a one-to-one correspondence mode.
2. The chip screening apparatus according to claim 1, wherein the adsorption module comprises a pitch adjustment plate;
the interval regulating plate includes many mutual intervals and court the adjustment tank that the workstation direction extends, adjacent two interval between the adjustment tank is followed the workstation direction reduces gradually, a plurality of suction nozzle subassembly one-to-one set up many in the adjustment tank.
3. The chip screening apparatus according to claim 2, wherein the suction nozzle assembly includes a suction nozzle provided on the first mount and a driving element that drives the suction nozzle to reciprocate with respect to the table.
4. The chip screening apparatus according to claim 3, wherein the nozzle assembly further comprises a second mounting seat for fixing the driving element, the second mounting seat is provided with a guide assembly, and the first mounting seat is slidably disposed on the guide assembly.
5. The chip screening device according to claim 4, wherein a protection jig is disposed at an end of the guide assembly away from the second mounting seat, the protection jig is provided with a through protection hole corresponding to the suction nozzle, and an elastic member is disposed between the protection jig and the second mounting seat.
6. The chip screening apparatus according to claim 1, wherein the side wall of the material taking tray is provided with a groove, and the first conveying module is provided with a first lifting mechanism, and the first lifting mechanism can be engaged with the groove of the material taking tray and support the material taking tray to move away from the first conveying module.
7. The chip screening apparatus according to claim 6, wherein the first conveying module is further provided with a reversing device, and the reversing device can drive the material taking tray to rotate.
8. The chip screening device according to claim 1, wherein a third conveying module is further arranged on the workbench, the third conveying module is provided with a feeding disc and a recovery disc, the adsorption module can take out the chip from the detection cavity and place the chip in the recovery disc, and the chip is transferred from the feeding disc to the detection cavity.
9. A chip detection production line is characterized by comprising the chip screening device, the transfer device and the detection system according to any one of claims 1 to 8;
the transfer device includes a transfer mechanism capable of transferring the test tray between the second transport module and the test system;
the detection system judges whether the chip in each detection cavity in the detection disc is qualified or not, and transmits the position information of the detection cavity containing unqualified chips to the adsorption module.
10. The production line for chip inspection according to claim 9, wherein the transfer device further comprises a movable shelf, and the movable shelf comprises a plurality of shelves for placing the inspection trays.
Priority Applications (1)
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