CN103236414A - Wafer fixing device - Google Patents
Wafer fixing device Download PDFInfo
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- CN103236414A CN103236414A CN2013101844510A CN201310184451A CN103236414A CN 103236414 A CN103236414 A CN 103236414A CN 2013101844510 A CN2013101844510 A CN 2013101844510A CN 201310184451 A CN201310184451 A CN 201310184451A CN 103236414 A CN103236414 A CN 103236414A
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- plate
- movable plate
- limiting plate
- circular arc
- wafer
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Abstract
The invention relates to the technical field of the treatment of an integrated circuit chip, and discloses a wafer fixing device. The wafer fixing device comprises a bearing plate, a limiting plate and a moving plate, wherein a circular hole and an optical glass are arranged in the middle of the bearing plate, the limiting plate has the shape of a semi-ring, the limiting plate is fixedly arranged at a first side of the bearing plate, the moving plate is arranged at a second side of the bearing plate, the inner diameter of the moving plate is equal to the inner diameter of the limiting plate, a guide groove and a fixed part are arranged at the second side of the bearing plate, the moving place can move within the guide groove through a guide part, the moving direction of the moving plate is a connecting wire direction between the midpoint of the inner arc of the limiting plate and the midpoint of the inner arc of the moving plate, the fixed part can fix the moving plate on one position, and the edges of the inner arcs of the limiting plate and the moving plate are respectively provided with a press ring. After the wafer fixing device is used, the surface of the wafer can not be damaged due to the mode of side edge compaction.
Description
Technical field
The present invention relates to the integrated circuit (IC) chip processing technology field, particularly a kind of wafer mounting apparatus.
Background technology
The CIS chip is a kind of image-signal processor chip, and this chip aims at image sensor chip, and it is handled the light of accepting (image), extensively is used in scanner, facsimile machine, Digital Video, the camera.Test to the wafer of CIS chip is finished by becoming the survey machine, in test process, wafer to be fixed and implement optic test, the existing fixed mode is by pressing wafer to be pressed on the fixed mount, because the required precision height of wafer, the existing mode of being fixed is easy to wafer is produced physical injury, causes the waste of wafer.
Summary of the invention
The objective of the invention is provides a kind of wafer mounting apparatus in order to solve the problems of the technologies described above, in the hope of can be quickly and safely fixing wafer, in order to wafer is tested.
The technical scheme that the present invention takes is:
A kind of wafer mounting apparatus, it is characterized in that, comprise loading plate, limiting plate and movable plate, have circular hole in the middle of the described loading plate, be provided with annular standing groove at the edge of described circular hole, in described annular standing groove, optical glass is set, described limiting plate is semi-round ring shape, described limiting plate is fixedly installed on first side of described loading plate, the radian of the interior circular arc of described limiting plate is less than 180 degree, the interior circular arc of described limiting plate is positioned at the top of described optical glass, the internal diameter of described limiting plate is less than the radius of described circular hole, described movable plate is arranged on second side of described loading plate, described movable plate is semi-round ring shape, the radian of the interior circular arc of described movable plate is less than 180 degree, the interior circular arc of described movable plate is positioned at the top of described optical glass, the internal diameter of described movable plate and the internal diameter of described limiting plate equate, second side at described loading plate arranges gathering sill and fixed part, described movable plate can move in described gathering sill by guide, the moving direction of described movable plate is the line direction of mid point of the interior circular arc of the mid point of interior circular arc of described limiting plate and described movable plate, described fixed part can be fixed on described movable plate on a certain position, and the edge of the interior circular arc of described limiting plate and described movable plate is provided with trim ring.
Further, also be provided with groove at the edge of the interior circular arc of described limiting plate and described movable plate, described groove is arranged on the below of described trim ring, and the height of described groove is less than the thickness of wafer.
Further, described gathering sill and guide are respectively a plurality of, are symmetricly set on the both sides of the symmetry axis of described movable plate.
Further, described fixed part is the steady pin that is arranged on the described loading plate second side side.
Further, be provided with tension spring in the described steady pin, described tension spring makes described steady pin produce the pressure to described loading plate first side direction to described movable plate.
Further, described steady pin is two, is symmetricly set in the both sides of the symmetry axis of described movable plate.
Further, the line in the center of circle of the circular hole in the middle of the center of circle of the interior circular arc of described limiting plate and the described loading plate is perpendicular to the surface of described loading plate.
The invention has the beneficial effects as follows:
(1) by the side compressing mode, make crystal column surface injury-free;
(2) the groove limit method is accurately located wafer, avoids mobile wearing and tearing;
(3) fixed form of spring locking reduces the stress deformation of wafer.
Description of drawings
Accompanying drawing 1 is front view of the present invention;
Accompanying drawing 2 is rearview of the present invention;
Accompanying drawing 3 is the partial enlarged drawing of the A of accompanying drawing 2.
Mark in the accompanying drawing is respectively:
1. loading plate; 2. circular hole;
3. annular standing groove; 4. optical glass;
5. limiting plate; 6. movable plate;
7. gathering sill; 8. guide;
9. steady pin; 10. trim ring;
11. groove.
Embodiment
Elaborate below in conjunction with the embodiment of accompanying drawing to wafer mounting apparatus of the present invention.
Referring to accompanying drawing 1,2, loading plate 1 is round-shaped for being similar to, also can be designed to other shape, it is conducive to by becoming the survey machine to test, the centre of loading plate 1 has circular hole 2, be provided with annular standing groove 3 at the edge of circular hole 2, in annular standing groove 3, optical glass 4 is set, first side at loading plate 1, it is the left side among Fig. 1, fixedly install limiting plate 5, limiting plate 5 is semi-round ring shape, and radian of circular arc is less than 180 degree in it, the interior circular arc of limiting plate 5 is positioned at the top of optical glass 4, the internal diameter of limiting plate 5 is less than the radius of circular hole 2, and preferably, the line in the center of circle of the circular hole 2 in the middle of the center of circle of the interior circular arc of limiting plate 5 and the loading plate 1 is perpendicular to the surface of loading plate 1.Second side at loading plate 1, it is the right side among Fig. 1, movable plate 6 is set, movable plate 6 is semi-round ring shape, radian of circular arc is less than 180 degree in it, the interior circular arc of movable plate 6 is positioned at the top of optical glass 4, and the internal diameter of movable plate 6 is less than the radius of circular hole 2, and the internal diameter of the internal diameter of movable plate 6 and limiting plate 5 equates.Right side or both sides at loading plate 1 arrange gathering sill 7, gathering sill is horizontal, movable plate 6 can move in gathering sill 7 by the guide 8 that fixedly installs thereon, the moving direction of movable plate 6 be among the figure laterally, it is the line direction of mid point of the interior circular arc of the mid point of interior circular arc of limiting plate 5 and movable plate 6, side arranges steady pin 9 on the right side of loading plate 1, steady pin 9 is two, be symmetrical in the symmetry axis of movable plate 6, steady pin is used for fixedly movable plate 6, wafer to be measured is positioned on the optical glass of justifying in 24, horizontal movement by movable plate 7 is stuck in wafer between limiting plate 5 and the movable plate 6, at this moment by steady pin 9 that movable plate 6 is fixing, cause wafer stably to be fixed.Be provided with the tension spring (not shown) in steady pin 9, tension spring makes 9 pairs of movable plates of steady pin produce the pressure to the loading plate left direction.It is firm that suitable spring force not only can guarantee that wafer is fixed, and can not damage wafer again.Be provided with trim ring 10 and groove 11(at the edge of the interior circular arc of limiting plate 5 and movable plate 6 referring to accompanying drawing 3), groove 11 is arranged at the below of trim ring 10, and both all can select soft materials such as rubber for use, and the height of groove 11 is less than the thickness of wafer.To wafer fixedly the time, groove 11 carries out earlier spacing to wafer, by the movement of movable plate 6, make trim ring carry out side compressing to wafer and fix then.Because the internal diameter circular arc of the movable plate 6 of limiting plate 5 all less than 180 degree, therefore, when both close up, can be fixed radius less than the wafer of their internal diameters, even the wafer that is slightly larger than their internal diameters also can be fixed.
Continuation referring to accompanying drawing use of the present invention is, pull out steady pin 9, after movable plate 6 is mobile to the right, place wafer at optical glass 4, movable plate 6 is mobile to the left, profile of tooth 10 pushes steady pin 9 after wafer is positioned at certain position of optical glass 4, and trim ring 10 is pressed on wafer between limiting plate 5 and the movable plate 6.The device that fixes wafer is delivered to wafer become the survey machine to detect, after detection is finished, steady pin 9 is pulled out, movable plate 6 is removed to the right, take off and survey wafer, replace with the not wafer of test.
The above only is preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (7)
1. wafer mounting apparatus, it is characterized in that: comprise loading plate, limiting plate and movable plate, have circular hole in the middle of the described loading plate, be provided with annular standing groove at the edge of described circular hole, in described annular standing groove, optical glass is set, described limiting plate is semi-round ring shape, described limiting plate is fixedly installed on first side of described loading plate, the radian of the interior circular arc of described limiting plate is less than 180 degree, the interior circular arc of described limiting plate is positioned at the top of described optical glass, the internal diameter of described limiting plate is less than the radius of described circular hole, described movable plate is arranged on second side of described loading plate, described movable plate is semi-round ring shape, the radian of the interior circular arc of described movable plate is less than 180 degree, the interior circular arc of described movable plate is positioned at the top of described optical glass, the internal diameter of described movable plate and the internal diameter of described limiting plate equate, second side at described loading plate arranges gathering sill and fixed part, described movable plate can move in described gathering sill by guide, the moving direction of described movable plate is the line direction of mid point of the interior circular arc of the mid point of interior circular arc of described limiting plate and described movable plate, described fixed part can be fixed on described movable plate on a certain position, and the edge of the interior circular arc of described limiting plate and described movable plate is provided with trim ring.
2. wafer mounting apparatus according to claim 1 is characterized in that: the edge at the interior circular arc of described limiting plate and described movable plate also is provided with groove, and described groove is arranged on the below of described trim ring, and the height of described groove is less than the thickness of wafer.
3. wafer mounting apparatus according to claim 1 and 2, it is characterized in that: described gathering sill and guide are respectively a plurality of, are symmetricly set on the both sides of the symmetry axis of described movable plate.
4. wafer mounting apparatus according to claim 1 and 2, it is characterized in that: described fixed part is the steady pin that is arranged on the described loading plate second side side.
5. wafer mounting apparatus according to claim 4 is characterized in that: be provided with tension spring in the described steady pin, described tension spring makes described steady pin produce the pressure to described loading plate first side direction to described movable plate.
6. wafer mounting apparatus according to claim 4, it is characterized in that: described steady pin is two, is symmetricly set in the both sides of the symmetry axis of described movable plate.
7. wafer mounting apparatus according to claim 1 and 2 is characterized in that: the line in the center of circle of the circular hole in the middle of the center of circle of the interior circular arc of described limiting plate and the described loading plate is perpendicular to the surface of described loading plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310184451.0A CN103236414B (en) | 2013-05-17 | 2013-05-17 | Wafer mounting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310184451.0A CN103236414B (en) | 2013-05-17 | 2013-05-17 | Wafer mounting apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103236414A true CN103236414A (en) | 2013-08-07 |
| CN103236414B CN103236414B (en) | 2015-09-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310184451.0A Active CN103236414B (en) | 2013-05-17 | 2013-05-17 | Wafer mounting apparatus |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104701231A (en) * | 2013-12-09 | 2015-06-10 | 旺宏电子股份有限公司 | Wafer clamp |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61198644A (en) * | 1985-02-27 | 1986-09-03 | Teru Saamuko Kk | Method of wafer replacement |
| US20030006010A1 (en) * | 2001-06-29 | 2003-01-09 | Jens Holzbecher | Support apparatus for a wafer |
| CN201298548Y (en) * | 2008-09-11 | 2009-08-26 | 英华达（上海）科技有限公司 | Fixing device of stack structure of semiconductor packaging body |
| CN203288574U (en) * | 2013-05-17 | 2013-11-13 | 嘉兴景焱智能装备技术有限公司 | Wafer fixing device |
-
2013
- 2013-05-17 CN CN201310184451.0A patent/CN103236414B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61198644A (en) * | 1985-02-27 | 1986-09-03 | Teru Saamuko Kk | Method of wafer replacement |
| US20030006010A1 (en) * | 2001-06-29 | 2003-01-09 | Jens Holzbecher | Support apparatus for a wafer |
| CN201298548Y (en) * | 2008-09-11 | 2009-08-26 | 英华达（上海）科技有限公司 | Fixing device of stack structure of semiconductor packaging body |
| CN203288574U (en) * | 2013-05-17 | 2013-11-13 | 嘉兴景焱智能装备技术有限公司 | Wafer fixing device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104701231A (en) * | 2013-12-09 | 2015-06-10 | 旺宏电子股份有限公司 | Wafer clamp |
| CN104701231B (en) * | 2013-12-09 | 2018-06-22 | 旺宏电子股份有限公司 | Wafer jig |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103236414B (en) | 2015-09-30 |
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Effective date of registration: 20220209 Address after: 226400 No. 1, Jinshan Road, juegang street, Rudong County, Nantong City, Jiangsu Province (floors 3-4, building 6, Semiconductor Industrial Park) Patentee after: Jingyan (Jiangsu) Intelligent Equipment Co.,Ltd. Address before: 314100 rooms 1D and 1E, building 3, No. 2188, Jiashan Avenue, Dayun Town, Jiashan County, Jiaxing City, Zhejiang Province Patentee before: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. |