CN104701231B - Wafer jig - Google Patents
Wafer jig Download PDFInfo
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- CN104701231B CN104701231B CN201310661956.1A CN201310661956A CN104701231B CN 104701231 B CN104701231 B CN 104701231B CN 201310661956 A CN201310661956 A CN 201310661956A CN 104701231 B CN104701231 B CN 104701231B
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- plate body
- wafer
- clamping piece
- clamping
- area
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Abstract
The invention discloses a kind of wafer jig, including one first clamping piece and one second clamping piece.First clamping piece includes one first plate body and is connected to one first clamping jaw of the first plate body.Second clamping piece is located at the side of the first clamping piece, and including one second plate body and is connected to one second clamping jaw of the second plate body.First clamping piece and the second clamping piece are suitable for relative movement, to clamp or discharge a wafer.When the first clamping piece and the second clamping piece are mutually drawn close, the first clamping jaw and the second clamping jaw bear against the side of wafer jointly, and the upright projection of the first plate body and the second plate body on wafer at least covers the region being substantially round positioned at the one of wafer center.
Description
Technical field
The application relates to a kind of fixture, and in particular to a kind of wafer jig.
Background technology
In semiconductor processing, ion implanting is one of technique therein.Ion implanting is mainly intended to dopant elements and turns
Become ion kenel (Ion Beam) and it is made to have enough energy and speed, to inject the surface of wafer or wherein specific position
It puts so that the performance on the surface of material is improved.
When carrying out ion implanting, the wafer that script is located under atmospheric condition can be moved to the cavity of high vacuum state
In, then through wafer jig wafer and return will be just decontroled, thereafter ion on the carrier in wafer clamp to ion implanted regions
Implanter starts to inject ion to wafer.
However, wafer jig is attached to wafer clamp in the ion for during ion implanted regions, having part back and forth
The edge of tool.When wafer jig is in grasping silicon wafer, these are attached to the marginate ion of wafer clamp originally will be transferred to crystalline substance
It is polluted on circle.It is very big that ion is attached to the influence that crystal column surface can be for product subsequent technique.For example, these
Pollutant be likely to result in element p-n junction electric leakage, reduce minority carrier lifetime, reduce grid oxic horizon collapse electricity
The problems such as pressure, plain conductor corrosion, and the quality of semiconductor element and reliability is caused to reduce or even semiconductor element is caused to lose
Effect.
Invention content
The application provides a kind of wafer jig, can reduce to the ionic soil caused by wafer.
The application provides a kind of wafer jig, including one first clamping piece and one second clamping piece.First clamping piece includes
One first plate body.Second clamping piece is located at the side of the first clamping piece, and including one second plate body.First clamping piece and the second folder
Component is suitable for relative movement, to clamp or discharge a wafer.When the first clamping piece and the second clamping piece are mutually drawn close, the first folder
Pawl and the second clamping jaw bear against the side of wafer jointly, and the first plate body is at least covered with upright projection of second plate body on wafer
The region being substantially round positioned at the one of wafer center.
In the embodiment of the application, the region that the first above-mentioned plate body and the second plate body are covered is located at the one of wafer
On active face.
In the embodiment of the application, the entire active face of the first above-mentioned plate body and the second plate body covering wafer.
In the embodiment of the application, the ratio of the area in above-mentioned capped region and the area of active face between
Between 0.75 to 1.
In the embodiment of the application, the first above-mentioned plate body and the second plate body substantially distinguish semicircular in shape.
The application more provides a kind of wafer jig, including one first clamping piece and one second clamping piece.First clamping piece packet
Include one first plate body.Second clamping piece is located at the side of the first clamping piece, and including one second plate body.First clamping piece and second
Clamping piece is suitable for relative movement, to clamp or discharge a wafer.When the first clamping piece and the second clamping piece are mutually drawn close, first
Clamping jaw and the second clamping jaw bear against the side of wafer jointly.The upright projection covering wafer of first plate body and the second plate body on wafer
A region, and the ratio of the area of an active face of the area and wafer in capped region is between 0.75 to 1.
In the embodiment of the application, the first above-mentioned plate body is located at having for wafer with the region that the second plate body is covered
On the face of source.
In the embodiment of the application, the first above-mentioned plate body and the second plate body difference semicircular in shape.
Based on above-mentioned, the wafer jig of the application employs the first plate body and the second plate body of large area so that wafer clamp
For tool when clamping wafer, the first plate body and the second plate body can cover the whole or most region of wafer.In this way, in addition to can
It avoids being suspended in except the ion in workspace adheres to wafer and pollute, can also reduce that be attached to wafer clamp marginate
Ion-transfer uses raising process yields to the probability of wafer.
For allow the application features described above and advantage can be clearer and more comprehensible, special embodiment below, and coordinate institute's accompanying drawings
It is described in detail below.
Description of the drawings
Figure 1A is that a kind of wafer jig of the embodiment according to the application is applied to the schematic diagram of an ion implantation apparatus.
Figure 1B is the close-up schematic view of the wafer jig and mobile arm in Figure 1A.
Fig. 2A is the schematic diagram of the wafer jig of Fig. 1.
Fig. 2 B are the schematic diagrames of the first clamping piece and the second clamping piece of drawing close Fig. 2A.
Fig. 3 is a kind of schematic diagram of wafer jig of another embodiment according to the application.
【Symbol description】
A：Active face
C：Region
Z1：Accreditation Waiting Area
Z2：Workspace
1：Ion implantation apparatus
2：Cavity
3：Valve
4：Mobile arm
5：Ion supply unit
6：Carrier
10：Wafer
100、200：Wafer jig
110、210：First clamping piece
112、212：First plate body
112a：First extended segment
112b：Notch
114、214：First clamping jaw
116：First drive rod
120、220：Second clamping piece
122、222：Second plate body
122a：Second extended segment
124、224：Second clamping jaw
126：Second drive rod
Specific embodiment
It is presented below and the wafer jig of the application is illustrated into relevant technical side applied to the embodiment of ion implantation apparatus
Case.Certainly, have usually intellectual in the art after refering to present context, will be understood that the wafer of the application
Fixture could be applicable to other process equipments with similar working environment and similar demand, for example, chemical vapor deposition
(chemical vapor deposition, CVD) equipment or a physical vapour deposition (PVD) (physical vapor
Deposition, PVD) equipment, to reduce the contaminated probability of wafer, use raising process yields.
Figure 1A is that a kind of wafer jig of the embodiment according to the application is applied to the schematic diagram of an ion implantation apparatus.Figure
1B is the close-up schematic view of the wafer jig and mobile arm of Figure 1A.Please referring initially to Figure 1A, ion implantation apparatus 1 includes a chamber
Body 2, a valve 3, one movement arm 4, a wafer jig 100, an ion supply unit 5 and a carrier 6.
Vacuum state is maintained essentially in cavity 2, valve 3 can opening and closing of fault cavity 2.Wafer 10 enters from valve 3
After cavity 2, first positioned at an Accreditation Waiting Area Z1.Mobile arm 4 in cavity 2 can be as shown in Figure 1A by 10 transverse shifting of wafer
To a workspace Z2.After wafer 10 is moved to workspace Z2 by mobile arm 4, please refer to Figure 1A and Figure 1B, wafer
Fixture 100 can be aligned with mobile arm 4 to accept wafer 10, and then, wafer 10 is positioned over workspace by wafer jig 100 forward
On the carrier 6 of Z2.
Ion supply unit 5 can generate various ions, and operation principle is that target material is dissociated, and is formed it into positively charged
Or the ion of negative electricity.Thereafter ion accelerates and is sent to the workspace Z2 of vacuum in transmission voltage, is held with injecting ions into be located at
Wafer 10 on load plate 6.
After completing ion implanting program, wafer jig 100 presss from both sides wafer 10 from carrier 6, mobile arm 4 can once again with
Wafer jig 100 aligns, and wafer 10 is transferred to mobile arm 4 from wafer jig 100.Then, arm 4 is moved by wafer 10
From workspace, Z2 takes back Accreditation Waiting Area Z1.Finally, wafer 10 leaves cavity 2 from valve 3 again.
Due to many ions not injected that may suspend in the Z2 of workspace, when 100 clamping wafer 10 of fixture, it is attached to
Ion in fixture 100, which may splash, is attached to wafer 10.In addition, the ion that is not injected of part may also can be in wafer jig
100 are attached to the edge of wafer jig 100, particularly wafer jig 100 during start.Has this, the present embodiment
It proposes wafer jig 100, to be effectively reduced wafer jig 100 in grasping silicon wafer 10, is attached to wafer jig frontside edge
Ion-transfer to wafer 10 probability.Hereafter further wafer jig 100 is introduced.
Fig. 2A is the schematic diagram of the wafer jig 100 of Fig. 1.Fig. 2A is please referred to, wafer jig 100 includes one first clamping piece
110 and one second clamping piece 120.First clamping piece 110 includes one first plate body 112, is connected at least the one of the first plate body 112
First clamping jaw 114 and one first drive rod 116.Second clamping piece 120 is located at the side of the first clamping piece 110, and including one
Two plate bodys 122, at least one second clamping jaw 124 and one second drive rod 126 for being connected to the second plate body 122.
In the present embodiment, the first plate body 112 and the second plate body 122 substantially semicircular in shape, and the first plate body 112 respectively
Two the first extended segment 112a extended outward from semicircular position and two second extensions are respectively provided with the second plate body 122
Section 122a.First clamping piece 110 and the second clamping piece 120 are respectively provided with two the first clamping jaws 114 and two the second clamping jaws 124,
First clamping jaw 114 and the second clamping jaw 124 are fixed on the first extended segment 112a and the second extended segment 122a in a manner of locking respectively.
Certainly, it is aforementioned in a manner of locking come to fix the first clamping jaw 114 and the second clamping jaw 124 be only many design sides of the application
One kind of case.Such as (or edge) it can form or provide the first clamping jaw on the first clamping piece 110 and the second clamping piece 120
114 and second clamping jaw 124 method, may be applicable to this.For example, in other embodiments, the first clamping jaw 114 and the second clamping jaw
124 modes that welding may be used be fixed on the first extended segment 112a and the second extended segment 122a or, the first clamping jaw 114 with
Second clamping jaw 124 also can be manufactured directly in a manner of integrally formed with the first plate body 112 and the second plate body 122 (such as forging, casting
Deng).
In addition, the first drive rod 116 and the second drive rod 126 connect respectively the first plate body 112 and the second plate body 122 it
Between, it is relatively drawn close with the second clamping piece 120 with the first clamping piece 110 of drive or separate, and clamp jointly or discharge wafer 10.
Fig. 2 B are the schematic diagrames of the first clamping piece and the second clamping piece of drawing close Fig. 2A.Fig. 2 B are please referred to, when the first clamping
When 110 and second clamping piece 120 of part is mutually drawn close, the 124 common side for bearing against wafer 10 of the first clamping jaw 114 and the second clamping jaw,
To clamp wafer 10.At this point, the active face A of 122 oriented wafer 10 of the first plate body 112 and the second plate body.
In order to reduce wafer 10 during being captured by wafer jig 100, be attached on wafer jig frontside edge from
Son pollution and the ion that is suspended in the Z2 of workspace are attached to the probability of wafer 10, first clamping piece 110 of the present embodiment and
Second clamping piece 120 especially uses the first plate body 112 and the second plate body 122 of large area, makes the first plate body 112 and the second plate body
122 mutually draw close after the gross area can be close to the area of the active face of wafer 10.Also that is, when the first clamping piece 110
And second clamping piece 120 when drawing close, the first plate body 112 and the second plate body 122 can cover the active face A of wafer 10 as best one can,
The area of wafer jig 100 is exposed to the active face A for reducing wafer 10, reduces by 10 contaminated probability or contaminated of wafer
Area uses raising process yields.
Certainly, design of the wafer jig 100 in practical application is limited to, the first plate body 112 and the second plate body 122 have can
It can be difficult to fully cover the entire active face A of wafer 10.As shown in Figure 2 B, in order to formed to lock the first clamping jaw 114 with
The the first extended segment 112a and the second extended segment 122a of second clamping jaw 124, the edge meeting of the first plate body 112 and the second plate body 122
Edge compared to wafer 10 inside contracts, and exposes the peripheral region of wafer 10.In other words, in the present embodiment, the first plate body 112
Region C centrally located in the active face A of wafer 10 is about covered with upright projection of second plate body 122 on wafer 10, and
Expose other regions in active face A.In addition, the first plate body 112 may also need to form a notch 112b, for detector
(not being painted) judges whether wafer 10 is located on wafer jig 100 through notch 112b.
Although however, in a state that the first plate body 112 and the second plate body 122 are mutually drawn close, the wafer shown in this example
The wafer 10 that fixture 100 exposes part with being difficult to avoid that (is, for example, position, notch 112b or the first plate other than the C of region
Gap between 112 and second plate body 122 of body etc.), still, since the first plate body 112 and the second plate body 122 have been enough to cover crystalline substance
The active face A of the overwhelming majority of circle 10, therefore still contribute to reduce by 10 contaminated probability of wafer or contaminated area, by
To improve process yields.In other words, the region covered on the active face A of wafer 10 by the first plate body 112 and the second plate body 122
The ratio of the area of the area of C and entire active face A can be between 0.75 to 1.Certainly, the first plate body 112 and the second plate body
The area in 122 regions covered is closer to the area of entire active face A, 10 contaminated probability of wafer or contaminated area
It is smaller.
It is noted that although in the present embodiment, the shape of the first plate body 112 and the second plate body 122 is with semicircle
For, the shape of the first plate body 112 and the second plate body 122 is not limited thereto system, and the first plate body 112 and the second plate body 122 exist
The shape that upright projection on wafer 10 is covered also is not limited with circle.As long as it is leaned in the first plate body 112 and the second plate body 122
The entire active face A of wafer 10 or most region can be covered when holding together as best one can.In other embodiments, first
112 and second plate body 122 of plate body can also be two variform sectors that angle adds up to 360.Alternatively, the first plate body
112 and second plate body 122 also can be other possible shapes.
Fig. 3 is a kind of schematic diagram of wafer jig of another embodiment according to the application.In the present embodiment, by changing
Become and use greater area of first plate body, 212 and second plate body 222, the first clamping jaw 214 and the second clamping jaw 224 are directly locked in half
Circular first plate body, 212 and second plate body 222, that is, it is locked in the edge part of the first plate body 212 and the second plate body 222
Position, and the design of extended segment is omitted.In this way, the side of wafer 10 is born against jointly in the first clamping jaw 214 and the second clamping jaw 224
When, the region that the first plate body 212 and the second plate body 222 are covered can more preferably reduce wafer more close to whole wafer 10
Fixture 200 is in clamping process to the ionic soil caused by wafer 10.
In conclusion the wafer jig of the application employs the first plate body and the second plate body of large area so that wafer clamp
For tool when clamping wafer, the first plate body and the second plate body can cover the whole or most region of wafer.In this way, in addition to can
It avoids being suspended in except the ion in workspace adheres to wafer and pollute, can also reduce that be attached to wafer clamp marginate
Ion-transfer uses raising process yields to the probability of wafer.
Although the application is disclosed above with embodiment, so it is not limited to the application, any technical field
Middle tool usually intellectual, is not departing from spirit and scope, when can make some changes and embellishment, therefore the application
Protection domain subject to be defined depending on appended claims range.
Claims (4)
1. a kind of wafer jig, including：
One first clamping piece including one first plate body and is connected at least one first clamping jaw of the first plate body；And
One second clamping piece positioned at the side of first clamping piece, and including one second plate body and is connected to the second plate body extremely
Few one second clamping jaw, which is suitable for relative movement with second clamping piece, to clamp or discharge a wafer, wherein when
When first clamping piece is mutually drawn close with second clamping piece, which bears against the side of the wafer with second clamping jaw jointly
Side, and first plate body at least covers the circle positioned at the wafer center with the upright projection of the second plate body on the wafer
Region；
Wherein, first clamping piece and second clamping piece using large area first plate body and second plate body, make this
The gross area after one plate body is mutually drawn close with second plate body can be close to the area of the active face of wafer；First plate
Body distinguishes semicircular in shape with second plate body, and first plate body is located at the wafer with the region that second plate body is covered
On one active face.
2. wafer jig according to claim 1, wherein first plate body cover the entire of the wafer with second plate body
Active face.
3. wafer jig according to claim 1, wherein the area in the capped region and the area of the active face
Ratio is between 0.75 to 1.
4. a kind of wafer jig, including：
One first clamping piece including one first plate body and is connected at least one first clamping jaw of the first plate body；
One second clamping piece positioned at the side of first clamping piece, and including one second plate body and is connected to the second plate body extremely
Few one second clamping jaw, which is suitable for relative movement with second clamping piece, to clamp or discharge a wafer, wherein when
When first clamping piece is mutually drawn close with second clamping piece, which bears against the side of the wafer with second clamping jaw jointly
Side, first plate body cover a region of the wafer with the upright projection of the second plate body on the wafer, and what is be capped is somebody's turn to do
The ratio of the area of one active face of the area in region and the wafer is between 0.75 to 1；
Wherein, first clamping piece and second clamping piece using large area first plate body and second plate body, make this
The gross area after one plate body is mutually drawn close with second plate body can be close to the area of the active face of wafer；First plate
Body distinguishes semicircular in shape with second plate body, and first plate body is located at the wafer with the region that second plate body is covered
On one active face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310661956.1A CN104701231B (en) | 2013-12-09 | 2013-12-09 | Wafer jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310661956.1A CN104701231B (en) | 2013-12-09 | 2013-12-09 | Wafer jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104701231A CN104701231A (en) | 2015-06-10 |
| CN104701231B true CN104701231B (en) | 2018-06-22 |
Family
ID=53348208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310661956.1A Active CN104701231B (en) | 2013-12-09 | 2013-12-09 | Wafer jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104701231B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128823B (en) * | 2019-12-24 | 2022-09-20 | 江苏晋誉达半导体股份有限公司 | Transfer method of semiconductor wafer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1971869A (en) * | 2005-11-21 | 2007-05-30 | 恩益禧电子股份有限公司 | Teaching apparatus and teaching method |
| CN103236414A (en) * | 2013-05-17 | 2013-08-07 | 嘉兴景焱智能装备技术有限公司 | Wafer fixing device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0555342A (en) * | 1991-08-26 | 1993-03-05 | Hitachi Ltd | Wafer chuck and wafer transfer device |
| KR100568456B1 (en) * | 2003-12-15 | 2006-04-07 | 주식회사 테라세미콘 | Semiconductor manufacturing System and Wafer-Film manufacturing Method |
-
2013
- 2013-12-09 CN CN201310661956.1A patent/CN104701231B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1971869A (en) * | 2005-11-21 | 2007-05-30 | 恩益禧电子股份有限公司 | Teaching apparatus and teaching method |
| CN103236414A (en) * | 2013-05-17 | 2013-08-07 | 嘉兴景焱智能装备技术有限公司 | Wafer fixing device |
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| Publication number | Publication date |
|---|---|
| CN104701231A (en) | 2015-06-10 |
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