CN114260907A - Ring taking device, wafer processing equipment and ring taking method - Google Patents
Ring taking device, wafer processing equipment and ring taking method Download PDFInfo
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- CN114260907A CN114260907A CN202210201105.8A CN202210201105A CN114260907A CN 114260907 A CN114260907 A CN 114260907A CN 202210201105 A CN202210201105 A CN 202210201105A CN 114260907 A CN114260907 A CN 114260907A
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Abstract
The invention relates to the technical field of semiconductor manufacturing, in particular to a ring removing device, wafer processing equipment and a ring removing method. The ring taking device comprises a rotating component, a jaw component, a driving component, a pressure detection component and a height adjusting component, wherein the driving component can drive the jaw component to move towards the direction close to or far away from the ring to be taken, so that the jaw assembly is inserted into the joint position between the UV film and the ring to be taken, the rotating assembly can drive the jaw assembly to rotate, so that the clamping jaw assembly separates the UV film from the ring to be taken, the pressure detection assembly is arranged on the clamping jaw assembly, is used for detecting the pressure value of the clamping jaw assembly abutting against the outer wall of the ring to be taken, when the pressure detection assembly detects the pressure value, the driving component drives the jaw components to move towards the direction far away from the ring to be taken, the height adjusting component is used for adjusting the height of the jaw components from the ring to be taken, so that the height of the clamping jaw assembly is in a preset value in the rotating process and the inserting process, the clamping jaw assembly is guaranteed to be accurately inserted into the attaching position, and the wafer is prevented from being damaged.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a ring removing device, wafer processing equipment and a ring removing method.
Background
In semiconductor manufacturing, wafers are often thinned to improve device performance, and the support rings at the edges of the wafers are cut to remove the thinned wafers. The wafer thinning process comprises a Taiko (Taiko) thinning process, the Taiko thinning process is to thin the middle area of the wafer, the edge area of the wafer is not thinned and is used as a support ring, after the middle area of the wafer is thinned, the support ring needs to be cut off from the wafer, as the UV film is attached to the back surface of the wafer, after the support ring is cut off from the wafer, the support ring still adheres to the UV film, and the support ring and the UV film need to be separated by using a ring taking device on wafer processing equipment.
In the prior art, in the process of separating the support ring from the UV film, the ring taking device firstly needs to insert the claw assembly in the ring taking device into the joint position between the UV film and the support ring, and then the claw assembly drives the support ring to rotate or ascend so that the claw assembly separates the UV film from the support ring. However, due to factors such as machine assembly errors, abrasion errors after long-term operation, or positioning deviations after wafer transportation, the chuck assemblies may press and damage the support rings and the wafers during the insertion between the UV films and the support rings, or the chuck assemblies cannot be accurately inserted between the UV films and the support rings, thereby reducing the accuracy and reliability of the separation operation of the ring taking device.
Therefore, it is desirable to provide a ring removing device, a wafer processing apparatus and a ring removing method to solve the above problems.
Disclosure of Invention
The invention aims to provide a ring taking device, wafer processing equipment and a ring taking method, so that a clamping jaw assembly is accurately inserted between a UV film and a ring to be taken, the accuracy and the reliability of separation work are ensured, and the protection of a wafer is improved.
In order to achieve the purpose, the invention adopts the following technical scheme:
the ring taking device comprises a rotating assembly, a jaw assembly and a driving assembly, wherein the driving assembly can drive the jaw assembly to move towards a direction close to or far away from a ring to be taken so as to enable the jaw assembly to be inserted into a joint position between a UV film and the ring to be taken, and the rotating assembly can drive the jaw assembly to rotate so as to enable the jaw assembly to separate the UV film from the ring to be taken;
the ring removing device further comprises:
the pressure detection assembly is arranged on the jaw assembly and is configured to detect a pressure value of the jaw assembly abutting against the outer wall of the ring to be taken, and when the pressure detection assembly detects the pressure value, the driving assembly drives the jaw assembly to move towards a direction away from the ring to be taken; and
the height adjusting assembly is configured to adjust the distance between the jaw assembly and the height of the ring to be taken, so that the heights of the jaw assemblies are in preset values in the rotating process and the inserting process.
Preferably, the height adjustment assembly includes:
the height detection piece is configured to detect the height value of the claw assembly from the ring to be taken; and
the first driving piece can drive the jaw assembly to move up and down relative to the ring to be taken according to the height value detected by the height detecting piece.
Preferably, the jaw assembly includes:
a jaw member that can be inserted into the attaching position, and on which the pressure detection assembly is provided; and
the connecting plate is connected with the clamping claw piece, the height detection piece is arranged on the connecting plate and is configured to detect the height value of the connecting plate from the ring to be taken, and the output end of the first driving piece is connected with the connecting plate.
Preferably, the jaw member includes:
the connecting center pillar is connected with the connecting plate, and the pressure detection assembly is arranged on the connecting center pillar;
the upper limiting plate and the lower limiting plate are sleeved on the connecting middle column at intervals in the vertical direction, and the pressure detection assembly is positioned between the upper limiting plate and the lower limiting plate;
when the pressure detection assembly detects the pressure value, the driving assembly drives the clamping jaw piece to move towards the direction away from the ring to be taken, so that when the clamping jaw piece is inserted into the attaching position, the outer wall of the ring to be taken is away from the connecting middle column, and the ring to be taken is located between the upper limiting plate and the lower limiting plate.
Preferably, the pressure detecting assembly includes:
a piezoelectric sensor disposed on the connecting center pillar and between the upper and lower stopper plates, the piezoelectric sensor being configured to detect a pressure value of the connecting center pillar and the to-be-annulled outer wall; and
the conductive sliding ring is arranged on the connecting middle column and is electrically connected with the piezoelectric sensor, and the driving assembly can drive the jaw assembly to move towards the direction far away from the ring to be taken after receiving the pressure value transmitted by the conductive sliding ring.
Preferably, the height adjustment assembly further comprises:
a guide configured to guide the jaw assembly up and down relative to the ring to be extracted.
Preferably, the driving assembly includes:
the first driving piece is arranged on the fixing plate; and
the second driving piece is arranged on the rotating assembly, the output end of the second driving piece is connected with the fixing plate, and the second driving piece is configured to drive the fixing plate to move towards the direction close to or away from the ring to be taken.
Preferably, the jaw assemblies are at least provided with three groups, the jaw assemblies are arranged at intervals along the circumferential direction of the rotating assembly, and each group of the jaw assemblies is provided with the pressure detection assembly.
A wafer processing device comprises the ring removing device.
A method of removing a torus, comprising the steps of:
the first driving piece drives the jaw assembly to move up and down relative to the ring to be taken;
when the height detection piece detects that the height of the claw assembly from the ring to be taken reaches a preset value, the driving assembly drives the claw assembly to move towards the direction close to the ring to be taken;
when the pressure detection assembly detects that pressure values exist between the jaw assembly and the outer wall of the ring to be taken, the driving assembly drives the jaw assembly to move towards the direction far away from the ring to be taken;
when the pressure detection assembly does not detect the pressure value and the jaw assembly is inserted between the UV film and the ring to be taken, the rotating assembly drives the jaw assembly to rotate.
Preferably, when the rotating assembly drives the jaw assembly to rotate, the height detection piece detects the height value of the jaw assembly from the ring to be taken in real time, so that the jaw assembly is always in the preset value.
Preferably, when the rotating assembly drives the jaw assembly to rotate, if the pressure detecting assembly detects the pressure value, the driving assembly drives the jaw assembly to move in a direction away from the ring to be taken.
The invention has the beneficial effects that:
the invention provides a ring taking device which comprises a rotating assembly, a jaw assembly and a driving assembly, wherein the driving assembly can drive the jaw assembly to move towards a direction close to or far away from a ring to be taken so as to enable the jaw assembly to be inserted into a joint position between a UV film and the ring to be taken, and the rotating assembly can drive the jaw assembly to rotate so as to enable the jaw assembly to separate the UV film from the ring to be taken. In addition, this ring taking device still includes pressure measurement subassembly and altitude mixture control subassembly, pressure measurement subassembly sets up on the jack catch subassembly, pressure measurement subassembly is used for detecting the jack catch subassembly butt and treats the pressure value of taking the ring outer wall, when pressure measurement subassembly detected the pressure value, drive assembly drive jack catch subassembly moves towards the direction of keeping away from waiting to take the ring, avoid jack catch subassembly extrusion damage to treat the outer wall of taking the ring, improve the protection of treating and taking ring and wafer, altitude mixture control subassembly can adjust the jack catch subassembly apart from the height of waiting to take the ring, so that the high value of jack catch subassembly is in the default all the time in grafting process and rotation process, guarantee that the jack catch subassembly inserts accurately between UV membrane and the ring of waiting to take, also avoid the jack catch subassembly to appear the skew in rotatory, improve the accuracy and the reliability of separation work.
The invention also provides a wafer processing device, by applying the ring taking device, the clamping jaw assembly can be prevented from extruding and damaging the ring to be taken, the protection of the ring to be taken and the wafer is improved, the clamping jaw assembly can be ensured to be accurately inserted between the UV film and the ring to be taken, the clamping jaw assembly is prevented from deflecting in rotation, and the accuracy and the reliability of separation work are improved.
The invention also provides a ring removing method, which can improve the protection of the ring to be removed and the wafer in the ring removing process, ensure that the clamping jaw assembly is accurately inserted between the UV film and the ring to be removed, and improve the accuracy and reliability of the separation work.
Drawings
FIG. 1 is a schematic structural diagram of a partial contraceptive ring removing device provided by an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a device for removing a rotating assembly according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a jaw assembly and a pressure sensing assembly provided by an embodiment of the present invention;
fig. 4 is a flowchart of a method for removing a loop according to an embodiment of the present invention.
In the figure:
100. a ring taking device; 200. waiting for ring removal;
1. a rotating assembly;
2. a jaw assembly; 21. a jaw member; 211. connecting the middle columns; 212. an upper limiting plate; 213. a lower limiting plate; 22. a connecting plate;
3. a drive assembly; 31. a fixing plate; 32. a second driving member;
4. a pressure detection assembly; 41. a piezoelectric sensor; 42. a conductive slip ring;
5. a height adjustment assembly; 51. a height detection member; 52. a first driving member; 53. a guide member; 531. a guide rail; 532. a slide block.
Detailed Description
In order to make the technical problems solved, the technical solutions adopted and the technical effects achieved by the present invention clearer, the technical solutions of the present invention are further described below by way of specific embodiments with reference to the accompanying drawings.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used based on the orientations and positional relationships shown in the drawings only for convenience of description and simplification of operation, and do not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
As shown in fig. 1 and fig. 2, the present embodiment provides a ring removing apparatus 100, which is mainly used to separate the support ring on the outer periphery of the thinned wafer from the UV film, so as to remove the support ring from the outer periphery of the wafer. But not limited thereto, the ring removing device 100 can also be used for realizing the separation work of other devices. Specifically, this device 100 of fetching rings includes rotating assembly 1, jaw assembly 2 and drive assembly 3, wherein, drive assembly 3 can drive jaw assembly 2 and move towards the direction that is close to or keeps away from waiting to get ring 200 to make jaw assembly 2 insert the laminating position between UV membrane and waiting to get ring 200, and rotating assembly 1 can drive jaw assembly 2 and drive assembly 3 rotatory, so that jaw assembly 2 separates UV membrane and waiting to get ring 200.
Preferably, as shown in fig. 1, the jaw assemblies 2 are provided with a plurality of groups, a plurality of groups of jaw assemblies 2 are arranged at intervals along the circumferential direction of the rotating assembly 1, each group of jaw assemblies 2 is correspondingly provided with a group of driving assemblies 3, when the ring 200 to be taken needs to be separated on the UV film, each group of driving assemblies 3 can synchronously drive each corresponding jaw assembly 2 to move towards the direction close to or away from the ring 200 to be taken, so that the plurality of jaw assemblies 2 are inserted between the UV film and the ring 200 to be taken at intervals, and then the rotating assembly 1 synchronously drives the plurality of groups of jaw assemblies 2 to rotate, thereby realizing the separation of the ring 200 to be taken from the UV film. The plurality of groups of jaw assemblies 2 are arranged to perform separation work, so that the work is more reliable and stable. In this embodiment, jaw assembly 2 is provided with three groups, and three groups of jaw assembly 2 are evenly arranged at intervals on the periphery of rotating assembly 1.
In this embodiment, rotating assembly 1 includes rotating electrical machines and link, and wherein, rotating electrical machines's output shaft is connected with the link, and drive assembly 3 sets up on the link, and rotating electrical machines passes through output shaft drive link and rotates, and then drives each group's jack catch subassembly 2 and drive assembly 3 synchronous revolution. It should be noted that each group of the jaw assemblies 2 is circumferentially arranged at intervals around the center of the rotating motor output shaft.
Referring to fig. 2, a specific structure of the driving assembly 3 is described, as shown in fig. 2, the driving assembly 3 includes a fixing plate 31 and a second driving member 32, wherein the second driving member 32 is disposed on the connecting frame of the rotating assembly 1, an output end of the second driving member 32 is connected to the fixing plate 31, and when the second driving member 32 drives the fixing plate 31 to move toward or away from the ring to be removed 200, the fixing plate 31 can drive the jaw assembly 2 to move toward or away from the ring to be removed 200. Specifically, the second driving member 32 may be a servo motor, which is easy to control and reliable in operation.
However, due to factors such as machine assembly error, abrasion error after long-term operation, or positioning deviation after wafer transportation, the groups of chuck assemblies 2 are not located on the same horizontal plane, and in the process of inserting each group of chuck assemblies 2 between the UV film and the ring to be extracted 200, the chuck assemblies 2 close to the ring to be extracted 200 (i.e., the chuck assemblies 2 lower than the other chuck assemblies 2) may press and damage the ring to be extracted 200 and the wafer; or in the rotation process of each group of the jaw assemblies 2, the height value of each group of the jaw assemblies 2 from the ring to be taken 200 is changed, so that the wafer is damaged; or the center of the output shaft of the rotating motor deviates the circle center of the ring to be taken 200, when each group of the jaw assemblies 2 moves towards the radial direction of the ring to be taken 200, the jaw assemblies 2 excessively extrude the ring to be taken 200, so that the ring to be taken 200 and the wafer are easily damaged, the jaw assemblies 2 cannot be accurately inserted between the UV film and the ring to be taken 200, and the accuracy and the reliability of the separation work of the ring taking device 100 are reduced.
In order to solve the above problem, as shown in fig. 2 and fig. 3, the ring removing device 100 provided in this embodiment further includes a pressure detecting component 4 and a height adjusting component 5, wherein the pressure detecting component 4 is disposed on the jaw component 2, the pressure detecting component 4 can detect a pressure value of the jaw component 2 abutting against the outer wall of the ring to be removed 200, when the pressure detecting component 4 detects the pressure value, the second driving component 32 drives the fixing plate 31 to drive the jaw component 2 to move towards a direction away from the ring to be removed 200, so as to prevent each group of jaw components 2 from attaching and pressing the ring to be removed 200 in the insertion attaching position and the rotation process, and improve the protection of the ring to be removed 200 and the wafer. In addition, height adjusting assembly 5 can adjust jack catch subassembly 2 distance and treat the height of getting ring 200, so that each group of jack catch subassembly 2 highly all is in the default at rotatory in-process and grafting in-process, guarantee that each group of jack catch subassembly 2 all can accurately insert between UV membrane and the ring 200 of waiting to get, avoid pressing the damage and treat ring 200 and wafer, also can guarantee that each group of jack catch subassembly 2 is in rotatory in-process, be in predetermined altitude value all the time, avoid taking place the skew to damage the wafer in rotatory, the accuracy and the reliability of getting ring device 100 separation work have been improved.
Referring to fig. 2, a specific structure of the height adjusting assembly 5 is described, as shown in fig. 2, the height adjusting assembly 5 includes a height detecting member 51 and a first driving member 52, wherein the height detecting member 51 is disposed on the jaw assembly 2, the first driving member 52 is disposed on the fixing plate 31, the height detecting member 51 is used for detecting a height value of the jaw assembly 2 from the ring to be removed 200, and the first driving member 52 can drive the jaw assembly 2 to move up and down relative to the ring to be removed 200 according to the height value detected by the height detecting member 51. It should be noted that each group of jaw assemblies 2 is correspondingly provided with a height adjusting assembly 5, so that each group of jaw assemblies 2 is guaranteed to be at a preset height, and the height of each group of jaw assemblies 2 is flush with the height of the fitting position. When the height of the jaw assembly 2 from the ring to be taken 200, detected by the height detecting piece 51, is higher than a preset value, the first driving piece 52 can drive the jaw assembly 2 to move downwards according to the height value detected by the height detecting piece 51; when the height of the jaw assembly 2 from the ring to be taken 200 detected by the height detecting piece 51 is lower than a preset value, the first driving piece 52 can drive the jaw assembly 2 to move upwards according to the height value detected by the height detecting piece 51.
Specifically speaking, height detection spare 51 can be optical fiber sensor, and optical fiber sensor sets up on jaw assembly 2, and optical fiber sensor can detect jaw assembly 2 distance and wait to get the height value of ring 200 to optical fiber sensor has the installation of being convenient for, detects sensitive advantage. In other embodiments, the height detecting member 51 may also be a distance measuring sensor such as an ultrasonic sensor. The first driving member 52 may be a screw motor, an output end of the screw motor is connected to the jaw assembly 2, and the screw motor has the advantages of stable driving and reliable operation.
In addition, as shown in fig. 2, the height adjusting assembly 5 further includes a guiding member 53, and the guiding member 53 is used for guiding the jaw assembly 2 to move up and down relative to the ring to be taken 200, so as to prevent the first driving member 52 from shifting during the process of driving the jaw assembly 2 to move, and ensure that the jaw assembly 2 is more stable and reliable in movement adjustment. Specifically, the guide 53 includes a guide rail 531 and a slider 532 that are slidably coupled, wherein the guide rail 531 is provided on the fixed plate 31, the guide rail 531 extends in the up-down direction, and the slider 532 is provided on the jaw assembly 2.
Referring to fig. 2, a specific structure of the jaw assembly 2 is described, as shown in fig. 2, the jaw assembly 2 includes a jaw member 21 and a connecting plate 22, wherein the jaw member 21 can be inserted into the fitting position, the pressure detecting assembly 4 is disposed on the jaw member 21, the connecting plate 22 is connected to the jaw member 21, a height detecting member 51 is disposed on the connecting plate 22, the height detecting member 51 is configured to detect a height of the connecting plate 22 from the ring to be taken 200, an output end of the first driving member 52 is connected to the connecting plate 22, and the first driving member 52 can drive the jaw member 21 to move up and down relative to the ring to be taken 200 according to the height of the connecting plate 22 from the ring to be taken 200 detected by the height detecting member 51. Note that, in the present embodiment, the slider 532 is provided on the connection plate 22.
In the present embodiment, as shown in fig. 2, the jaw member 21 includes a connecting central pillar 211, an upper limiting plate 212 and a lower limiting plate 213, wherein the connecting central pillar 211 is connected to the connecting plate 22, the pressure detecting assembly 4 is disposed on the connecting central pillar 211, the upper limiting plate 212 and the lower limiting plate 213 are disposed on the connecting central pillar 211 at intervals along the up-down direction, the pressure detecting assembly 4 is disposed between the upper limiting plate 212 and the lower limiting plate 213, when the pressure detecting assembly 4 detects a pressure value, the driving assembly 3 drives the jaw member 21 to move in a direction away from the ring to be taken 200, so that when the jaw member 21 is inserted into the fitting position, the outer wall of the ring to be taken 200 is away from the connecting central pillar 211, and the ring to be taken 200 is disposed between the upper limiting plate 212 and the lower limiting plate 213. This mode of setting up not only can guarantee down limiting plate 213 insert the laminating position in, realize waiting to get the separation of ring 200 and UV membrane, can also avoid connecting center pillar 211 and waiting to get the outer wall of ring 200 and contact, improve the protection of waiting to get ring 200 and wafer. In addition, the upper limiting plate 212 and the lower limiting plate 213 are arranged, so that the bearing stability of the ring to be taken 200 is improved, and the ring to be taken 200 and the UV film can be conveniently separated. When the claw members 21 are inserted into the fitting positions, the lower end surface of the to-be-removed ring 200 is fitted to the upper end surface of the lower retainer plate 213.
Preferably, the lower limiting plate 213 is provided with an inclined slope, and the inclined slope is arranged to incline upwards towards the direction away from the center of the circle of the ring to be taken 200, which not only facilitates the insertion of the lower limiting plate 213 into the fitting position, but also enables the inclined slope to push the ring to be taken 200 upwards when the driving assembly 3 drives the lower limiting plate 213 to move towards the center of the circle of the ring to be taken 200, thereby facilitating the separation of the ring to be taken 200 from the UV film.
It should be noted that, in the present embodiment, as shown in fig. 3, the pressure detecting assembly 4 includes a piezoelectric sensor 41 and a conductive slip ring 42, wherein the piezoelectric sensor 41 is disposed on the connecting center pillar 211, and the piezoelectric sensor 41 is located between the upper limiting plate 212 and the lower limiting plate 213, the piezoelectric sensor 41 is used for detecting a pressure value of the connecting center pillar 211 and the outer wall of the ring to be taken 200, the conductive slip ring 42 is disposed on the connecting center pillar 211, and the conductive slip ring 42 is electrically connected to the piezoelectric sensor 41, and the driving assembly 3 can drive the jaw assembly 2 to move in a direction away from the ring to be taken 200 after receiving the pressure value transmitted by the conductive slip ring 42. Through setting up piezoelectric sensor 41 and detecting the pressure value of connecting center pillar 211 and waiting to get ring 200 outer wall, it is more sensitive accurate to detect. The piezoelectric sensor 41 is electrically connected with an external device through the conductive sliding ring 42, so that the wiring harness can be prevented from being wound, and the rotating component 1 is ensured to drive the jaw component 2 to rotate relative to the ring to be taken 200. It should be noted that the specific structure and operation principle of the conductive slip ring 42 belong to the prior art, and are not described herein again.
This embodiment still provides a wafer processing equipment, through using above-mentioned ring device 100 of getting, can avoid jaw assembly 2 excessively to extrude the damage and wait to get ring 200 and wafer, improves the protection of waiting to get ring 200 and wafer, can also guarantee that jaw assembly 2 is accurate to insert the UV membrane and wait to get between the ring 200, avoids jaw assembly 2 to appear the skew in the rotation, improves the accuracy and the reliability of separation work.
As shown in fig. 4, this embodiment further provides a method for removing intrauterine device, which includes the following steps:
the first driving piece 52 drives the jaw assembly 2 to move up and down relative to the ring to be taken 200;
when the height detection piece 51 detects that the height of the jaw assembly 2 from the to-be-extracted ring 200 reaches a preset value, the driving assembly 3 drives the jaw assembly 2 to move towards the direction close to the to-be-extracted ring 200;
when the pressure detection component 4 detects that pressure values exist on the outer walls of the jaw component 2 and the ring to be taken 200, the driving component 3 drives the jaw component 2 to move towards the direction far away from the ring to be taken 200;
when the pressure detecting assembly 4 does not detect the pressure value and the jaw assembly 2 is inserted between the UV film and the ring to be taken 200, the rotating assembly 1 drives the jaw assembly 2 to rotate.
The ring removing method can ensure that the height of the jaw assembly 2 is in a preset value, ensure that the jaw assembly 2 is accurately inserted between the UV film and the ring to be removed 200, and improve the accuracy and reliability of the separation work. In addition, the claw assembly 2 can be prevented from being attached and extruded to the outer wall of the to-be-extracted ring 200, and the protection of the to-be-extracted ring 200 and the wafer in the separation process is improved.
In addition, when the rotating assembly 1 drives the jaw assembly 2 to rotate, the height detecting piece 51 detects the height value of the jaw assembly 2 from the to-be-taken ring 200 in real time, so that the jaw assembly 2 is always at a preset value. Therefore, the rotating assembly 1 can drive the jaw assembly 2 to rotate, the height of the jaw assembly 2 changes, and the stability of the jaw assembly 2 is guaranteed.
Further, when the rotating assembly 1 drives the jaw assembly 2 to rotate, if the pressure detecting assembly 4 detects a pressure value, the driving assembly 3 drives the jaw assembly 2 to move away from the to-be-removed ring 200. This mode of setting up guarantees that rotating assembly 1 can avoid jaw assembly 2 laminating extrusion to wait to get the outer wall of ring 200 all the time at the rotatory in-process of jaw assembly 2 of driving, improves the protection of waiting to get ring 200 and wafer.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (12)
1. The ring taking device is characterized by comprising a rotating assembly (1), a jaw assembly (2) and a driving assembly (3), wherein the driving assembly (3) can drive the jaw assembly (2) to move towards a direction close to or away from a ring to be taken (200) so that the jaw assembly (2) is inserted into a joint position between a UV film and the ring to be taken (200), and the rotating assembly (1) can drive the jaw assembly (2) to rotate so that the jaw assembly (2) separates the UV film from the ring to be taken (200);
the ring removing device further comprises:
the pressure detection assembly (4) is arranged on the jaw assembly (2) and is configured to detect a pressure value of the jaw assembly (2) abutting against the outer wall of the ring to be extracted (200), and when the pressure detection assembly (4) detects the pressure value, the driving assembly (3) drives the jaw assembly (2) to move in a direction away from the ring to be extracted (200); and
the height adjusting assembly (5) is configured to adjust the height of the jaw assembly (2) from the ring to be taken (200) so that the height of the jaw assembly (2) is in a preset value in the rotating process and the inserting process.
2. The device according to claim 1, characterized in that said height adjustment assembly (5) comprises:
a height detection member (51) configured to detect a height value of the jaw assembly (2) from the ring to be extracted (200); and
the first driving piece (52), the first driving piece (52) can drive the jaw assembly (2) to move up and down relative to the ring to be taken (200) according to the height value detected by the height detecting piece (51).
3. The extractor device according to claim 2, characterized in that said jaw assembly (2) comprises:
a jaw member (21), the jaw member (21) being insertable into the fitting position, and the pressure detection assembly (4) being provided on the jaw member (21); and
the connecting plate (22) is connected with the clamping jaw piece (21), the height detecting piece (51) is arranged on the connecting plate (22), the height detecting piece (51) is configured to detect the height value of the connecting plate (22) from the ring to be taken (200), and the output end of the first driving piece (52) is connected with the connecting plate (22).
4. The extractor device according to claim 3, characterized in that said jaw (21) comprises:
the connecting center pillar (211) is connected with the connecting plate (22), and the pressure detection assembly (4) is arranged on the connecting center pillar (211);
the upper limiting plate (212) and the lower limiting plate (213) are sleeved on the connecting middle column (211) at intervals along the vertical direction, and the pressure detection assembly (4) is located between the upper limiting plate (212) and the lower limiting plate (213);
when the pressure detection assembly (4) detects the pressure value, the driving assembly (3) drives the jaw piece (21) to move towards the direction away from the ring to be taken (200), so that when the jaw piece (21) is inserted into the attaching position, the outer wall of the ring to be taken (200) is away from the connecting central column (211), and the ring to be taken (200) is located between the upper limiting plate (212) and the lower limiting plate (213).
5. The device according to claim 4, characterized in that said pressure detection assembly (4) comprises:
a piezoelectric sensor (41) provided on the connecting center pillar (211) and located between the upper stopper plate (212) and the lower stopper plate (213), the piezoelectric sensor (41) being configured to detect a pressure value of the connecting center pillar (211) and an outer wall of the ring to be extracted (200); and
the conductive sliding ring (42) is arranged on the connecting middle post (211) and is electrically connected with the piezoelectric sensor (41), and the driving assembly (3) can drive the jaw assembly (2) to move in the direction away from the ring to be taken (200) after receiving the pressure value transmitted by the conductive sliding ring (42).
6. The device according to any of claims 2 to 5, characterized in that the height adjustment assembly (5) further comprises:
a guide (53) configured to guide the jaw assembly (2) up and down relative to the ring to be extracted (200).
7. The extractor device according to any of the claims from 2 to 5, characterized in that said driving assembly (3) comprises:
a fixed plate (31), the first driving member (52) being disposed on the fixed plate (31); and
the second driving piece (32) is arranged on the rotating assembly (1), the output end of the second driving piece (32) is connected with the fixing plate (31), and the second driving piece (32) is configured to drive the fixing plate (31) to move towards the direction close to or away from the ring to be taken (200).
8. The device for removing the intrauterine device according to any one of claims 1 to 5, wherein at least three groups of jaw assemblies (2) are provided, the jaw assemblies (2) are arranged at intervals along the circumferential direction of the rotating assembly (1), and the pressure detection assembly (4) is provided on each group of jaw assemblies (2).
9. Wafer processing equipment, characterized in that ring removal is performed by using the ring removal device according to any one of claims 1 to 8 and inserting the joint position between the UV film and the ring to be removed (200).
10. A method for removing a ring is characterized by comprising the following steps:
the first driving piece (52) drives the jaw assembly (2) to move up and down relative to the ring to be taken (200);
when the height detection piece (51) detects that the height of the jaw assembly (2) from the ring to be extracted (200) reaches a preset value, the driving assembly (3) drives the jaw assembly (2) to move towards the direction close to the ring to be extracted (200);
when the pressure detection component (4) detects that pressure values exist on the jaw assembly (2) and the outer wall of the ring to be extracted (200), the driving component (3) drives the jaw assembly (2) to move towards the direction away from the ring to be extracted (200);
when the pressure value is not detected by the pressure detection component (4) and the jaw assembly (2) is inserted between a UV film and the ring to be taken (200), the rotating component (1) drives the jaw assembly (2) to rotate.
11. The method for extracting the rings as claimed in claim 10, characterized in that, when the rotating assembly (1) drives the jaw assembly (2) to rotate, the height detecting member (51) detects the height value of the jaw assembly (2) from the ring (200) to be extracted in real time, so that the jaw assembly (2) is always at the preset value.
12. The method for extracting rings according to claim 10 or 11, characterized in that when the rotating assembly (1) drives the jaw assembly (2) to rotate, if the pressure detecting assembly (4) detects the pressure value, the driving assembly (3) drives the jaw assembly (2) to move away from the ring to be extracted (200).
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| CN202210201105.8A CN114260907B (en) | 2022-03-03 | 2022-03-03 | Ring taking device, wafer processing equipment and ring taking method |
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| CN114260907B CN114260907B (en) | 2022-06-17 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114536215A (en) * | 2022-04-27 | 2022-05-27 | 绍兴中芯集成电路制造股份有限公司 | Ring taking device and method |
| CN115503001A (en) * | 2022-11-23 | 2022-12-23 | 江苏京创先进电子科技有限公司 | Wafer ring taking method and wafer ring taking device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204450566U (en) * | 2014-12-18 | 2015-07-08 | 创新服务股份有限公司 | Force sensing paw |
| JP2018082086A (en) * | 2016-11-17 | 2018-05-24 | ヒューグル開発株式会社 | Wafer extention device |
| CN113211664A (en) * | 2021-04-28 | 2021-08-06 | 华虹半导体(无锡)有限公司 | TAIKO ring taking device and method |
| CN114121770A (en) * | 2021-11-15 | 2022-03-01 | 华虹半导体(无锡)有限公司 | TAIKO ring taking fixing device and fixing method |
-
2022
- 2022-03-03 CN CN202210201105.8A patent/CN114260907B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204450566U (en) * | 2014-12-18 | 2015-07-08 | 创新服务股份有限公司 | Force sensing paw |
| JP2018082086A (en) * | 2016-11-17 | 2018-05-24 | ヒューグル開発株式会社 | Wafer extention device |
| CN113211664A (en) * | 2021-04-28 | 2021-08-06 | 华虹半导体(无锡)有限公司 | TAIKO ring taking device and method |
| CN114121770A (en) * | 2021-11-15 | 2022-03-01 | 华虹半导体(无锡)有限公司 | TAIKO ring taking fixing device and fixing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114536215A (en) * | 2022-04-27 | 2022-05-27 | 绍兴中芯集成电路制造股份有限公司 | Ring taking device and method |
| CN115503001A (en) * | 2022-11-23 | 2022-12-23 | 江苏京创先进电子科技有限公司 | Wafer ring taking method and wafer ring taking device |
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| Publication number | Publication date |
|---|---|
| CN114260907B (en) | 2022-06-17 |
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