JPH02262356A - Semiconductor device - Google Patents

Abstract

PURPOSE:To obtain a semiconductor device in which there is less concern about occurrence of crosstalk even though an interval between leads is reduced with the increase of signal pins by covering the periphery of a conductor for transmitting signals with an insulating film and further, providing a conductor for shielding at the outside of the above signal transmission conductor. CONSTITUTION:A semiconductor device is equipped with an active function: a semiconductor chip 1; a bump electrode 2 outputting the active function as an electric signal; a lead 3 consisting of the bump electrode 2 getting electric power to drive the above semiconductor chip 1 as well as the conductor which connects electrically, mechanically the above bump electrode 2 to terminals of mountings that are provided for the semiconductor chip such as a printed board and the like. In the above-mentioned semiconductor device, the lead 3 is made up by the conductor 6 for transmitting signals, an insulator 4 at the periphery of the above conductor, and a conductor 5 for shielding at the outside of the above insulator. The conductor for shielding which is provided on the lead prevents occurrence of crosstalk even though an interval between leads is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and particularly to a semiconductor device in which the shape of a lead used for mounting a semiconductor chip has a characteristic feature.

(Conventional technology) Using one protruding pole (hereinafter referred to as bump) and a lead, T:
An example of conventional mounting of a semiconductor chip will be explained using the drawings.

FIG. 6 is a perspective view of a semiconductor chip mounted by the TAB method. In the figure, reference numeral 1 denotes a semiconductor chip having an active function, and bumps 2 are provided on the semiconductor chip l.

Bump 2 connects semiconductor chip l and lead 3 to I! It is for electrical and mechanical connection. This mounting method using bumps 2 and leads 3 is called T A B (Tape
It is called mutomated bonding.

By bonding the bumps 2 and the leads 3, it becomes possible to take out the active function of the semiconductor chip 1 in a portion 3. Therefore, by connecting the leads 3, for example, by soldering, on an insulating substrate having pads that are electrically wired to external terminals, the mounted semiconductor chip can be made into a semiconductor chip. It becomes possible to treat the device as a semiconductor device whose active function can be taken out by an external terminal.

In optimal semiconductor chips, the number of signal bins such as logic LSIs such as gate arrays tends to increase. Therefore, in order to increase the number of bumps corresponding to signal pins, these semiconductor chips take measures such as reducing the bump pinch and bump dimensions as shown in Figure 7A. As shown in Figure 7A, the width and pitch of the leads corresponding to the bumps are reduced, and the bonding conditions change, as shown in Figure 8A, resulting in higher density semiconductor devices. Become.

(Problem to be Solved by the Invention) However, reducing the lead pitch also reduces the lead spacing, which is difficult when considering crosstalk 2. In other words, if the lead spacing is small, adjacent leads It has the disadvantage that it is easily influenced by the electric field generated by the flow of current, and is susceptible to noise. Figure 9 A shows this relationship, and in the mouth state, crosstalk occurs. Note that 7 indicates an electric field.

This invention was made to solve the above-mentioned problems.
The present invention aims to provide a semiconductor device free from crosstalk even when the Jj spacing is small.

[Means to solve the problem]

The shape of the lead of the semiconductor device according to the present invention is such that the periphery of the conductor for transmitting signals is covered with an insulating film, and the outside (!
! It is characterized in that a shielding conductor is provided at I.

[Effect]

In the semiconductor device according to the present invention, even if the lead spacing is reduced, there is no fear of crosstalk because of the shielding conductor provided on the leads.

〔Example〕

An embodiment of the present invention will be described below with reference to FIG. 1st
Figure A is a perspective view showing the external appearance of the lead, the opening is a front view, and Figure C is a cross-sectional side view. In the semiconductor device glue part 3 according to the present invention, an insulating film 4 is formed around a conductor 6 for transmitting signals. established,
Furthermore, a conductor 5 for shielding is provided around it.

FIG. 2 shows a conceptual cross-sectional view showing the electric field of adjacent tally leads used in the present invention. In this way, since the shield conductor 5 is around, the electric field 7 does not enter the signal transmission conductor.
Therefore, there is no need to worry about crosstalk. FIG. 8 shows a cross-sectional view of the bonding between the lead 3 and the sleeve 2 to which the present invention is applied. As shown,
By joining the signal transmission conductor 6 and the bump 2, the active function of the semiconductor chip 1 can be achieved. It becomes possible to take lead 3 and move downstream.

In the above embodiment, the outermost periphery of the shielding conductor 5 was the shielding conductor 5, but for convenience, an insulating film 4 may be provided on the outermost periphery of the shielding conductor 5, as shown in FIG. . Also, as shown in FIG. 8, the junction between bump 2 and lead 3 was not shielded, or as shown in FIG. You can stretch it out.

〔Effect of the invention〕

As described above, by using the present invention, it is possible to obtain a semiconductor device free from crosstalk even if the spacing between adjacent leads is narrow.

[Brief explanation of drawings]

Fig. 1 shows a lead which is a main part of an embodiment of this invention, A is a perspective view, the opening is a front view, C is a cross-sectional side view, and Fig. 2 is an explanation of the operation of an embodiment of this invention. Conceptual diagram for
The figure is a cross-sectional side view of a lead in one embodiment of this invention bonded to a bump, FIG. 4 is a perspective view showing a lead in another embodiment of this invention, and FIG. 5 is another embodiment of this invention. FIG. 6 is a perspective view showing a conventional semiconductor device, and FIG. 7 shows its operation. The second front sectional view for explanation, FIG. 8 is a perspective view for explaining the operation, and the ninth factor is a conceptual diagram for explaining the operation. In the figure, l is a semiconductor chip, 2 is a bump, 3 is a lead, and 4 is a semiconductor chip.
5 is an insulating film, 5 is a shield conductor, and 6 is a signal transmission conductor. Agent Masu Oiwa Okudo Figure 1 Figure 4 Figure 5, 3 Figure 2'\7 Door l, ゛ Suwa rice + Tsufu. Figure 6 Figure 7 (b) ÷ - Seventy one figure Figure 8 Figure 91

Claims (1)

[Claims] A semiconductor chip having an active function, a protruding electrode for outputting the active function as an electrical signal, and a protruding electrode for taking in electric power for driving the semiconductor chip;
In a semiconductor device having a lead made of a conductor that electrically and mechanically connects the protruding electrode and a terminal of a semiconductor chip mounted object such as a printed circuit board, the lead includes a signal transmission conductor and an insulator on its outer periphery. and an outer shielding conductor.