JPH0225748B2 - - Google Patents

Info

Publication number
JPH0225748B2
JPH0225748B2 JP59209291A JP20929184A JPH0225748B2 JP H0225748 B2 JPH0225748 B2 JP H0225748B2 JP 59209291 A JP59209291 A JP 59209291A JP 20929184 A JP20929184 A JP 20929184A JP H0225748 B2 JPH0225748 B2 JP H0225748B2
Authority
JP
Japan
Prior art keywords
surface plate
wafer
polishing
carrier
surface plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59209291A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6190867A (ja
Inventor
Koji Yamaga
Toshio Myashita
Yukio Ogiwara
Tomoyuki Takeuchi
Takeshi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Naoetsu Electronics Co Ltd
Shin Etsu Engineering Co Ltd
Original Assignee
Naoetsu Electronics Co Ltd
Shin Etsu Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Naoetsu Electronics Co Ltd, Shin Etsu Engineering Co Ltd filed Critical Naoetsu Electronics Co Ltd
Priority to JP59209291A priority Critical patent/JPS6190867A/ja
Publication of JPS6190867A publication Critical patent/JPS6190867A/ja
Publication of JPH0225748B2 publication Critical patent/JPH0225748B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP59209291A 1984-10-05 1984-10-05 ウェーハの研磨方法 Granted JPS6190867A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59209291A JPS6190867A (ja) 1984-10-05 1984-10-05 ウェーハの研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59209291A JPS6190867A (ja) 1984-10-05 1984-10-05 ウェーハの研磨方法

Publications (2)

Publication Number Publication Date
JPS6190867A JPS6190867A (ja) 1986-05-09
JPH0225748B2 true JPH0225748B2 (enrdf_load_stackoverflow) 1990-06-05

Family

ID=16570509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59209291A Granted JPS6190867A (ja) 1984-10-05 1984-10-05 ウェーハの研磨方法

Country Status (1)

Country Link
JP (1) JPS6190867A (enrdf_load_stackoverflow)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4894289U (enrdf_load_stackoverflow) * 1972-02-12 1973-11-10
JPS5743738A (en) * 1980-08-26 1982-03-11 Koga Tadashi Non-deashing microscopic wafer polishing machine of hard tissue
JPS5766860A (en) * 1980-10-14 1982-04-23 Supiide Fuamu Kk Abrasive liquid selector device

Also Published As

Publication number Publication date
JPS6190867A (ja) 1986-05-09

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