JPH02250347A - Inspection of semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To prevent a protective film from being damaged and a wiring part from being cut and to eliminate a need for skill and much time by a method wherein a photosensitive substance is denatured by a radiant ray of light on the basis of an inspection result of a semiconductor integrated circuit in order to distinguish and indicate good products or bad products. CONSTITUTION:The surface of a semiconductor integrated circuit chip 11 of a semiconductor integrated circuit wafer is coated in advance with a photosensitive substance 13. The semiconductor integrated circuit chip 11 is inspected while probes 12 used to inspect electrical functions are brought into contact with it. When it is judged to be a bad chip in an inspection process, a light radiator 14 which has been arranged and installed above a mounting part of the semiconductor integrated circuit chip 11 is heated; the photo-sensitive substance 13 is irradiated with a ray of light; a discolored part 15 is formed in an exposed part of the photo-sensitive substance 13. Thereby, the chip can be distinguished and indicated; it is possible to prevent a protective film of the semiconductor integrated chip from being damaged and a wiring part from being cut; an inconvenience that skill and time are required to set an ink bottle can be solved.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an inspection method in the manufacturing process of semiconductor integrated circuits.

2. Description of the Related Art Conventionally, this type of testing method has been used to perform 8-function testing of electrical characteristics at the 1-bar stage in the manufacturing process of semiconductor integrated circuits.
The tests were conducted using a C tester, and semiconductor integrated circuit chips that did not meet predetermined characteristics were judged to be defective. In order to recognize this, ink was applied using an inker as shown in Figure 2. In FIG. 2, when the probe 2 is set up on the semiconductor integrated circuit chip 1 and the IC tester and the semiconductor integrated circuit chip 1 are electrically connected to each other, and it is recognized as defective as a result of various functional tests, the ink fountain 8 is the needle 9 in the electromagnetic coil 6
1 in FIG.
It was to be attached as shown by 0.

Problem to be Solved by the Invention However, in such a conventional configuration, when applying the adhering ink 10 to the semiconductor integrated circuit chip 1, the inker needle 9 strongly contacts the semiconductor integrated circuit chip 1.
There have been problems in that the protective film on the surface of the semiconductor integrated circuit chip 1 is scratched, and sometimes the wiring of the semiconductor integrated circuit chip 1 is cut. Further, the position of the ink fountain 8 must be set so that the ink 10 adheres evenly onto the semiconductor integrated circuit chip 1, and setting the position of the ink fountain 8 requires skill and time. There was a problem.

The present invention solves the above problems, and provides a method for testing semiconductor integrated circuits that does not damage the protective film of the semiconductor integrated circuit chip or cut the wiring, and does not require skill or much time. The purpose is to

Means for Solving the Problems In order to solve the above problems, the present invention installs a light emitter instead of an inker in the vicinity of a semiconductor integrated circuit wafer coated with a photosensitive material, and performs inspection of semiconductor integrated circuits. Based on the results, the photosensitive material is changed in quality by radiation, and a display is made to identify whether the product is good or defective.

Effect With the above configuration, for example, if the semiconductor integrated circuit is a defective product, the light rays emitted from the light radiator can partially change the quality of the photosensitive material without contacting the semiconductor integrated circuit or the I-bar. Identification is possible, and semiconductors*
Damage to the protective film of the i-circuit chip and disconnection of wiring are eliminated.

Example Hereinafter, one embodiment of the present invention will be described based on the drawings.

FIG. 1 is a sectional side view of a main part showing a method for testing a semiconductor integrated circuit according to an embodiment of the present invention. In FIG. 1, a photosensitive material 13 is coated in advance on the surface of a semiconductor integrated circuit chip 11 of a semiconductor integrated circuit wafer. As the photosensitive material 13, for example, a spiropyran-based material (a material that causes photochromism) that develops or changes color when exposed to light is used. Semiconductor integrated circuit chip 1
1 is inspected by being brought into contact with a probe 12 for electrical function inspection. If the chip is determined to be defective in the inspection process, the light radiator 14 disposed above the soft spot of the semiconductor integrated circuit chip 11 is heated and emits light to the photosensitive material 13, making it photosensitive. A discolored portion 15 is formed in the exposed portion of the sexual substance 13. Thereby, good and defective semiconductor integrated circuits can be easily identified visually.

Effects of the Invention As described above, according to the present invention, since a non-contact method is used in which light is emitted to semiconductor integrated circuit chips on a semiconductor integrated circuit wafer during the inspection process, it is possible to detect good chips or defective chips as in the conventional method. This solves the problem of damaging the I-bar of the semiconductor integrated circuit when applying ink to the ink bottle, and of requiring skill and time to set the ink bottle.

[Brief explanation of drawings]

FIG. 1 is a sectional side view of a main part showing a method for testing a semiconductor integrated circuit according to an embodiment of the present invention, and FIG. 2 is a sectional side view of a main part showing a conventional method for testing a semiconductor integrated circuit. DESCRIPTION OF SYMBOLS 11... Semiconductor integrated circuit chip, 12... Probe, 13... Photosensitive material, 14... Light emitter, 15...
...Discolored area (colored area). Agent Yoshihiro Morimoto Figure 1! ! 1. -Half-printing-Book collection A12...70-B73--X first purchase! 4°-” Likelihood radiation field I5...Discoloration part

Claims (1)

[Claims] 1. Coat a photosensitive substance on the surface of a semiconductor integrated circuit wafer, install a light emitter near the semiconductor integrated circuit wafer, and, based on the inspection results of the integrated circuits on the semiconductor integrated circuit wafer, A semiconductor integrated circuit inspection method for identifying whether the semiconductor integrated circuit is a good product or a defective product by changing the quality of the photosensitive material with a light beam emitted from the semiconductor integrated circuit.